JPH0459188U - - Google Patents
Info
- Publication number
- JPH0459188U JPH0459188U JP10099590U JP10099590U JPH0459188U JP H0459188 U JPH0459188 U JP H0459188U JP 10099590 U JP10099590 U JP 10099590U JP 10099590 U JP10099590 U JP 10099590U JP H0459188 U JPH0459188 U JP H0459188U
- Authority
- JP
- Japan
- Prior art keywords
- wire
- pad
- wire guide
- substrate
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
Description
第１図は本考案の実施例を示す図であり、同図
ａはその上面図であり、同図ｂはその側面図であ
り、第２図は本考案の他の実施例を示す図であり
、同図ａはその上面図であり、同図ｂはその側面
図であり、第３図は従来例を示す図であり、同図
ａはその上面図であり、同図ｂはその側面図であ
る。
図において、１……基板、２……ワイヤ、３…
…電子部品、４……ワイヤガイド、５……台座、
６……パツド、７……導電パターン、をそれぞれ
示す。
Fig. 1 is a diagram showing an embodiment of the present invention, Fig. 1a is a top view thereof, Fig. 2b is a side view thereof, and Fig. 2 is a diagram showing another embodiment of the invention. Figure a is a top view thereof, Figure b is a side view thereof, and Figure 3 is a diagram showing a conventional example, Figure a is a top view thereof, and Figure b is a side view thereof. It is a diagram. In the figure, 1... board, 2... wire, 3...
...Electronic component, 4... Wire guide, 5... Pedestal,
6... Pad, 7... Conductive pattern, respectively.
Claims (1)
収納するワイヤガイド４を有するワイヤ配線構造
において、 前記ワイヤガイド４より露出する部分にワイヤ
２が接続されるパツド６を有すると共に、該パツ
ト６と接続する導電パターン７をその内部に有す
る台座５を該ワイヤガイドと前記基板間に設けた
ことを特徴とするワイヤ配線構造。[Claims for Utility Model Registration] In a wire wiring structure having a wire guide 4 mounted on a substrate 1 and housing a wire 2 for design change, a pad to which the wire 2 is connected to a portion exposed from the wire guide 4. 6, and a pedestal 5 having a conductive pattern 7 therein connected to the pad 6 is provided between the wire guide and the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10099590U JPH0459188U (en) | 1990-09-28 | 1990-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10099590U JPH0459188U (en) | 1990-09-28 | 1990-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0459188U true JPH0459188U (en) | 1992-05-21 |
Family
ID=31844078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10099590U Pending JPH0459188U (en) | 1990-09-28 | 1990-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0459188U (en) |
-
1990
- 1990-09-28 JP JP10099590U patent/JPH0459188U/ja active Pending