JPH02129758U - - Google Patents

Info

Publication number
JPH02129758U
JPH02129758U JP3858389U JP3858389U JPH02129758U JP H02129758 U JPH02129758 U JP H02129758U JP 3858389 U JP3858389 U JP 3858389U JP 3858389 U JP3858389 U JP 3858389U JP H02129758 U JPH02129758 U JP H02129758U
Authority
JP
Japan
Prior art keywords
parts
wiring board
distance
terminal parts
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3858389U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3858389U priority Critical patent/JPH02129758U/ja
Publication of JPH02129758U publication Critical patent/JPH02129758U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structure Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例の平面図、第2図は
本考案の一実施例の半田メツキ量の特性図、第3
図は従来の一例の平面図、第4図は従来の一例の
半田メツキ量の特性図、第5図はフラツトパツケ
ージICの平面及び正面図である。 2a〜2d……ステパターン、3……ターミナ
ル部。
Fig. 1 is a plan view of an embodiment of the present invention, Fig. 2 is a characteristic diagram of solder plating amount of an embodiment of the present invention, and Fig. 3
This figure is a plan view of a conventional example, FIG. 4 is a characteristic diagram of solder plating amount of a conventional example, and FIG. 5 is a plane and front view of a flat package IC. 2a to 2d...Ste pattern, 3...Terminal section.

Claims (1)

【実用新案登録請求の範囲】 電子部品より延出した複数のリード線と接続す
る複数のターミナル部の外側に導体部が設けられ
たプリント配線基板のパターン構造において、 前記導体部と前記複数のターミナル部のうち前
記導体部に隣り合うターミナル部との距離を複数
のターミナル部の相隣るターミナル部間の距離よ
り大に設定してなるプリント配線基板のパターン
構造。
[Claim for Utility Model Registration] In a pattern structure of a printed wiring board in which a conductor portion is provided on the outside of a plurality of terminal portions connected to a plurality of lead wires extending from an electronic component, the conductor portion and the plurality of terminals A pattern structure of a printed wiring board, wherein the distance between terminal parts adjacent to the conductor part among the parts is set larger than the distance between adjacent terminal parts of the plurality of terminal parts.
JP3858389U 1989-03-31 1989-03-31 Pending JPH02129758U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3858389U JPH02129758U (en) 1989-03-31 1989-03-31

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3858389U JPH02129758U (en) 1989-03-31 1989-03-31

Publications (1)

Publication Number Publication Date
JPH02129758U true JPH02129758U (en) 1990-10-25

Family

ID=31546717

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3858389U Pending JPH02129758U (en) 1989-03-31 1989-03-31

Country Status (1)

Country Link
JP (1) JPH02129758U (en)

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