JPS63112369U - - Google Patents
Info
- Publication number
- JPS63112369U JPS63112369U JP243787U JP243787U JPS63112369U JP S63112369 U JPS63112369 U JP S63112369U JP 243787 U JP243787 U JP 243787U JP 243787 U JP243787 U JP 243787U JP S63112369 U JPS63112369 U JP S63112369U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- soldering land
- land
- board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 16
- 229910000679 solder Inorganic materials 0.000 claims description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 230000002950 deficient Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係る印刷配線板の
半田付けランドを説明する斜視図、第２図は第１
図の半田付けランドのパターン形状を示す斜視図
、第３図は第１図の半田付け前の状態を説明する
斜視図、第４図は半田付けランドの他のパターン
形状を示す斜視図、第５図は本考案の他の実施例
に係る半田付けランドを説明する斜視図、第６図
は第５図の半田付け前の状態を説明する斜視図、
第７図は全スルーホール部分の断面図、第８図は
半スルーホール部分の断面図、第９図は従来の半
田付けランドのパターン形状を示す斜視図、第１
０図は半田付け前の状態を示す斜視図、第１１図
は半田付け不良状態の斜視図、第１２図は第１０
図の断面図、第１３図は第１１図の断面図、第１
４図は半田ペーストの他の塗布状態を示す斜視図
である。
１１…基板、１２…回路パターン、１３…半田
付けランド、１３ａ…半田溜り部、１４…レジス
ト、１５…半田、１６…フラツトパツケージＩＣ
、１７…リード線、１８…全スルーホールランド
、１９…半スルーホールランド。
FIG. 1 is a perspective view illustrating a soldering land of a printed wiring board according to an embodiment of the present invention, and FIG.
3 is a perspective view illustrating the state before soldering shown in FIG. 1; FIG. 4 is a perspective view showing another pattern shape of the soldering land; FIG. 5 is a perspective view illustrating a soldering land according to another embodiment of the present invention, FIG. 6 is a perspective view illustrating the state before soldering of FIG. 5,
FIG. 7 is a sectional view of the entire through-hole portion, FIG. 8 is a sectional view of the half-through-hole portion, FIG. 9 is a perspective view showing the pattern shape of a conventional soldering land, and FIG.
Figure 0 is a perspective view showing the state before soldering, Figure 11 is a perspective view of a defective soldering state, and Figure 12 is a perspective view of the state before soldering.
Figure 13 is a cross-sectional view of Figure 11,
FIG. 4 is a perspective view showing another application state of solder paste. DESCRIPTION OF SYMBOLS 11... Board, 12... Circuit pattern, 13... Soldering land, 13a... Solder pool part, 14... Resist, 15... Solder, 16... Flat package IC
, 17... Lead wire, 18... Full through hole land, 19... Half through hole land.
Claims (1)
線が導出された電子部品と、 前記電子部品のリード線配置に対応して前記回
路パターン上に形成された半田付けランドと、 前記半田付けランドのリード線の配設位置より
外側にあり、且つ半田レジストにて被覆されてい
ない部位に形成され、半田付け時、余分な半田を
流入させる半田溜り部とを具備したことを特徴と
する印刷配線板の半田付けランド。[Claims for Utility Model Registration] A board on which a circuit pattern is formed, an electronic component mounted on the board and having a plurality of lead wires led out from the component body, and a circuit corresponding to the lead wire arrangement of the electronic component. It is formed on the soldering land formed on the pattern and on the part that is outside the lead wire placement position of the soldering land and is not covered with solder resist, and prevents excess solder from flowing in during soldering. 1. A soldering land for a printed wiring board, characterized in that the soldering land is provided with a solder pool portion for causing soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP243787U JPS63112369U (en) | 1987-01-13 | 1987-01-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP243787U JPS63112369U (en) | 1987-01-13 | 1987-01-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63112369U true JPS63112369U (en) | 1988-07-19 |
Family
ID=30781278
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP243787U Pending JPS63112369U (en) | 1987-01-13 | 1987-01-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63112369U (en) |
-
1987
- 1987-01-13 JP JP243787U patent/JPS63112369U/ja active Pending