JPH0375570U - - Google Patents
Info
- Publication number
- JPH0375570U JPH0375570U JP13625689U JP13625689U JPH0375570U JP H0375570 U JPH0375570 U JP H0375570U JP 13625689 U JP13625689 U JP 13625689U JP 13625689 U JP13625689 U JP 13625689U JP H0375570 U JPH0375570 U JP H0375570U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- sided printed
- soldering land
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 240000006829 Ficus sundaica Species 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案になる片面プリント配線板のハ
ンダ付け用ランド部の平面図、第２図は第１図の
片面プリント配線板にリード線をハンダ付けした
概略断面図、第３図は面積比αとランドの損傷率
との関係を示したグラフ、第４図は従来の片面プ
リント配線板の一部概略断面図であり、第５図は
第４図のランドの平面図、第６図ａ，ｂは二等辺
三角形Ｓを形成する様に配置された挿入孔におい
て、三角形の底辺に対して垂直な方向から応力を
加えた場合の片面プリント配線板の一部側面図及
びランド面から見た平面図、第７図ａ，ｂは二等
辺三角形Ｓを形成する様に配置された挿入孔にお
いて三角形の底辺に対して平行な方向から応力を
加えた場合の片面プリント配線板の一部側面図及
びランド面から見た平面図である。
３０……片面プリント配線板、３１……基板、
３２ａ……ランド、３２ｂ……補強ランド、Ａ，
Ｂ，Ｃ、３３，３３′……ハンダ付けランド、３
４……ハンダ、１２……孔、１５……リード線、
ｌ，ｌ′……平行線。
Figure 1 is a plan view of the soldering land portion of the single-sided printed wiring board of the present invention, Figure 2 is a schematic cross-sectional view of the single-sided printed wiring board of Figure 1 with lead wires soldered, and Figure 3 is the area. A graph showing the relationship between the ratio α and the land damage rate, FIG. 4 is a partial schematic sectional view of a conventional single-sided printed wiring board, FIG. 5 is a plan view of the land in FIG. 4, and FIG. a and b are a partial side view and a view from the land surface of a single-sided printed wiring board when stress is applied from a direction perpendicular to the base of the triangle in the insertion hole arranged to form an isosceles triangle S. Figures 7a and 7b show a partial side surface of a single-sided printed wiring board when stress is applied from a direction parallel to the base of the triangle in an insertion hole arranged to form an isosceles triangle S. FIG. 30... Single-sided printed wiring board, 31... Board,
32a...land, 32b...reinforcement land, A,
B, C, 33, 33'... Soldering land, 3
4... Solder, 12... Hole, 15... Lead wire,
l, l'...Parallel lines.
Claims (1)
する片面プリント配線板であつて、 ３つのリード線を有する電子部品のリード線挿
入孔の周囲に形成された前記ハンダ付けランドと
して、二等辺三角形を形成する様に配置された３
つの挿入孔の内、前記二等辺三角形の底辺に垂直
であり、この底辺の端部を通る一対の平行線によ
り分割される各ハンダ付けランドの前記平行線の
外側の面積が内側の面積よりも大きいことを特徴
とする片面プリント配線板。[Claims for Utility Model Registration] A single-sided printed wiring board having a soldering land around a lead wire insertion hole, the soldering land formed around the lead wire insertion hole of an electronic component having three lead wires. As lands, 3 are arranged to form an isosceles triangle.
Among the two insertion holes, each soldering land is divided by a pair of parallel lines that are perpendicular to the base of the isosceles triangle and passes through the ends of the base, and the area outside the parallel lines is larger than the area inside. A single-sided printed wiring board characterized by its large size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13625689U JPH0375570U (en) | 1989-11-25 | 1989-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13625689U JPH0375570U (en) | 1989-11-25 | 1989-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375570U true JPH0375570U (en) | 1991-07-29 |
Family
ID=31683473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13625689U Pending JPH0375570U (en) | 1989-11-25 | 1989-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375570U (en) |
-
1989
- 1989-11-25 JP JP13625689U patent/JPH0375570U/ja active Pending