JPH0375569U - - Google Patents
Info
- Publication number
- JPH0375569U JPH0375569U JP13596589U JP13596589U JPH0375569U JP H0375569 U JPH0375569 U JP H0375569U JP 13596589 U JP13596589 U JP 13596589U JP 13596589 U JP13596589 U JP 13596589U JP H0375569 U JPH0375569 U JP H0375569U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- insertion hole
- land
- wire insertion
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims 4
- 238000003780 insertion Methods 0.000 claims 4
- 238000010586 diagram Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案になる片面プリント配線板のハ
ンダ付け用ランド部の平面図、第２図ａは第１図
の一部概略断面図であり、同図ｂは同図ａの平面
図、第３図は面積比αとランドの損傷率との関係
を示したグラフ、第４図は従来の片面プリント配
線板の一部概略断面図であり、第５図は第４図の
ランドの平面図である。
３０……片面プリント配線板、３１……基板、
３２ａ……ランド、３２ｂ……補強ランド、Ａ，
Ｂ，Ｃ、３３……ハンダ付けランド、３４……ハ
ンダ、１２……孔、１５……リード線、Ｄ……外
心。
1 is a plan view of a soldering land portion of a single-sided printed wiring board according to the present invention, FIG. 2a is a partially schematic sectional view of FIG. 1, and FIG. 2b is a plan view of FIG. Fig. 3 is a graph showing the relationship between the area ratio α and the land damage rate, Fig. 4 is a partial schematic cross-sectional view of a conventional single-sided printed wiring board, and Fig. 5 is a plane view of the land in Fig. 4. It is a diagram. 30... Single-sided printed wiring board, 31... Board,
32a...Land, 32b...Reinforcement land, A,
B, C, 33...Soldering land, 34...Solder, 12...Hole, 15...Lead wire, D...Circumcenter.
Claims (1)
する片面プリント配線板であつて、 ３つのリード線を有する電子部品のリード線挿
入孔の周囲に形成された前記ハンダ付けランドと
して、３つの各々の挿入孔の中心と、この中心を
結んでできる三角形の外心とを結ぶ３本の直線に
対して直交し、リード線挿入孔の中心を通る３本
の直線により分割される各ハンダ付けランドの前
記三角形の外側の面積が内側の面積よりも大きい
ことを特徴とする片面プリント配線板。[Claims for Utility Model Registration] A single-sided printed wiring board having a soldering land around a lead wire insertion hole, the soldering land formed around the lead wire insertion hole of an electronic component having three lead wires. The land is divided by three straight lines that are perpendicular to the three straight lines connecting the center of each of the three insertion holes and the circumference of the triangle formed by connecting these centers, and that pass through the center of the lead wire insertion hole. A single-sided printed wiring board characterized in that the outside area of the triangle of each soldering land is larger than the inside area.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13596589U JPH0375569U (en) | 1989-11-22 | 1989-11-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13596589U JPH0375569U (en) | 1989-11-22 | 1989-11-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0375569U true JPH0375569U (en) | 1991-07-29 |
Family
ID=31683196
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13596589U Pending JPH0375569U (en) | 1989-11-22 | 1989-11-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0375569U (en) |
-
1989
- 1989-11-22 JP JP13596589U patent/JPH0375569U/ja active Pending