JPH01104074U - - Google Patents
Info
- Publication number
- JPH01104074U JPH01104074U JP19810287U JP19810287U JPH01104074U JP H01104074 U JPH01104074 U JP H01104074U JP 19810287 U JP19810287 U JP 19810287U JP 19810287 U JP19810287 U JP 19810287U JP H01104074 U JPH01104074 U JP H01104074U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- wire
- notch
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第３図は本考案の実施例を示し、第
１図は、取付状態の要部縦断側面図、第２図は、
プリント基板の要部平面図、第３図は、同上他の
実施例を示すプリント基板の要部平面図、第４図
及び第５図は、それぞれ従来例を示し、第４図は
、第１例を示す部分縦断面図、第５図は、同上他
の例を示す部分縦断面図である。
１……プリント基板、２，２１……通孔、３…
…切欠部、４……リード線又はリード端子、５…
…補強線材、６……半田金属。
1 to 3 show an embodiment of the present invention, FIG. 1 is a vertical sectional side view of the main part in the installed state, and FIG.
FIG. 3 is a plan view of the main part of the printed circuit board showing another embodiment of the same, FIGS. 4 and 5 respectively show the conventional example, and FIG. FIG. 5 is a partial vertical cross-sectional view showing another example of the same as the above. 1...Printed circuit board, 2,2 1 ...Through hole, 3...
...Notch, 4...Lead wire or lead terminal, 5...
...Reinforcement wire, 6...Solder metal.
Claims (1)
ーン配線とを貫通する回路素子取付孔の孔縁の一
部に切欠部を形成し、前記通孔に回路素子のリー
ド線（端子）を挿入すると共に該切欠部に半田付
補強線材を挿入して該リード線と、補強線材とを
半田金属によつてプリント基板の表裏に亘つて一
体に溶着せしめてなることを特徴とするプリント
基板上における半田付構造。 A notch is formed in a part of the hole edge of the circuit element mounting hole that passes through the printed circuit board and the pattern wiring formed on the printed circuit board, and the lead wire (terminal) of the circuit element is inserted into the through hole and the notch is inserted. A soldering structure on a printed circuit board, characterized in that a reinforcing soldering wire is inserted into the lead wire and the reinforcing wire are welded together over the front and back of the printed circuit board using solder metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19810287U JPH0528785Y2 (en) | 1987-12-25 | 1987-12-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19810287U JPH0528785Y2 (en) | 1987-12-25 | 1987-12-25 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01104074U true JPH01104074U (en) | 1989-07-13 |
| JPH0528785Y2 JPH0528785Y2 (en) | 1993-07-23 |
Family
ID=31488626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19810287U Expired - Lifetime JPH0528785Y2 (en) | 1987-12-25 | 1987-12-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0528785Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012530238A (en) * | 2009-11-20 | 2012-11-29 | シャンシー ジェイ アンド アール ファイア ファイティング カンパニー リミテッド | Two-way jet flame igniter for aerosol fire suppression |
-
1987
- 1987-12-25 JP JP19810287U patent/JPH0528785Y2/ja not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012530238A (en) * | 2009-11-20 | 2012-11-29 | シャンシー ジェイ アンド アール ファイア ファイティング カンパニー リミテッド | Two-way jet flame igniter for aerosol fire suppression |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0528785Y2 (en) | 1993-07-23 |