JPH02124667U - - Google Patents
Info
- Publication number
- JPH02124667U JPH02124667U JP1989034071U JP3407189U JPH02124667U JP H02124667 U JPH02124667 U JP H02124667U JP 1989034071 U JP1989034071 U JP 1989034071U JP 3407189 U JP3407189 U JP 3407189U JP H02124667 U JPH02124667 U JP H02124667U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- board
- view
- clip
- lands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図ａ及びｂは本考案の実施例である多重基
板回路モジユールの側面図及びその一部拡大断面
図であり、第２図ａ乃至ｅは、上記多重基板回路
モジユールの製造過程を説明するための斜視図、
平面図、一部拡大図、一部拡大断面図であり、第
３図ａ及びｂは、本考案の他の実施例の側面図及
びその一部拡大断面図であり、第４図ａ乃至ｄは
上記他の実施例の製造過程を説明するための斜視
図、平面図、一部拡大断面図であり、第５図ａ，
ｂ，ｃは従来技術を示すための平面図、側面図、
一部拡大図、そして、第６図は、さらに他の従来
技術を示すための断面図である。
１０，１１……配線基板、１２……接着剤、１
３，１４……リードランド、１５……スルーホー
ル、１６，１６′……クリツプリード、１７……
半田層。
1A and 1B are a side view and a partially enlarged cross-sectional view of a multi-substrate circuit module according to an embodiment of the present invention, and FIGS. 2 A to 2 e illustrate the manufacturing process of the multi-substrate circuit module. Perspective view for,
3A and 3B are a side view and a partially enlarged sectional view of another embodiment of the present invention, and FIGS. 4A to 4D are a plan view, a partially enlarged view, and a partially enlarged sectional view; 5A and 5B are a perspective view, a plan view, and a partially enlarged cross-sectional view for explaining the manufacturing process of the other embodiment, and FIGS.
b and c are a plan view and a side view to show the prior art;
A partially enlarged view and FIG. 6 are cross-sectional views showing still another conventional technique. 10, 11...Wiring board, 12...Adhesive, 1
3, 14... Lead land, 15... Through hole, 16, 16'... Clip lead, 17...
solder layer.
Claims (1)
基板回路モジユールにおいて、一つの配線基板の
縁部にリードランドが形成され、上記リードラン
ドを含む配線基板の縁部をクリツプリードのクリ
ツプ部が挾持し、さらに、その他の配線基板の端
面に上記リードランドと同じ間隔で半田付用の電
極が形成され、上記クリツプリードが上記リード
ランドに半田付けされると共に、同リードランド
が他方の回路基板の端面の半田付用の電極に半田
付けされたことを特徴とする多重基板回路モジユ
ール。 In a multi-board circuit module in which at least two wiring boards are stacked, a lead land is formed at the edge of one wiring board, and a clip part of the clip lead holds the edge of the wiring board including the lead land, Furthermore, soldering electrodes are formed on the end surface of the other circuit board at the same intervals as the lead lands, and the clip leads are soldered to the lead lands, and the lead lands are connected to the end surface of the other circuit board. A multi-board circuit module characterized by being soldered to soldering electrodes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989034071U JPH062222Y2 (en) | 1989-03-24 | 1989-03-24 | Multiple board circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989034071U JPH062222Y2 (en) | 1989-03-24 | 1989-03-24 | Multiple board circuit module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02124667U true JPH02124667U (en) | 1990-10-15 |
| JPH062222Y2 JPH062222Y2 (en) | 1994-01-19 |
Family
ID=31538226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989034071U Expired - Lifetime JPH062222Y2 (en) | 1989-03-24 | 1989-03-24 | Multiple board circuit module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062222Y2 (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01127176U (en) * | 1988-02-24 | 1989-08-30 |
-
1989
- 1989-03-24 JP JP1989034071U patent/JPH062222Y2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01127176U (en) * | 1988-02-24 | 1989-08-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH062222Y2 (en) | 1994-01-19 |
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