JPH0165170U - - Google Patents
Info
- Publication number
- JPH0165170U JPH0165170U JP1987161287U JP16128787U JPH0165170U JP H0165170 U JPH0165170 U JP H0165170U JP 1987161287 U JP1987161287 U JP 1987161287U JP 16128787 U JP16128787 U JP 16128787U JP H0165170 U JPH0165170 U JP H0165170U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- circuit board
- insulating layer
- board bonding
- circuit boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
第１図は、本考案の実施例の断面図、第２図は
、本考案の実施例の平面図、第３図は、第２の回
路基板の斜視図、第４図は、従来例の断面図であ
る。
１……第１の回路基板、２……第２の回路基板
、３……配線パターン、４……配線パターン、５
……絶縁層、６……接合端部、７……長穴、８…
…半田付け部分。
FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a plan view of an embodiment of the present invention, FIG. 3 is a perspective view of a second circuit board, and FIG. 4 is a diagram of a conventional example. FIG. 1... First circuit board, 2... Second circuit board, 3... Wiring pattern, 4... Wiring pattern, 5
...Insulating layer, 6...Joining end, 7...Elongated hole, 8...
...Soldering part.
Claims (1)
パターンが形成された面で接合される回路基板の
接合構造において、回路基板の重なつた部分内で
、配線パターンを残して絶縁層が一部除去されて
いることを特徴とする回路基板の接合構造。 (2) 前記絶縁層が除去された形状が、非直線的
な長円形状であることを特徴とする実用新案登録
請求の範囲第１項記載の回路基板の接合構造。[Claims for Utility Model Registration] (1) In a bonded structure of circuit boards each having a wiring pattern formed thereon and joined together on the surfaces on which the wiring pattern is formed, the wiring pattern may be formed within the overlapping portions of the circuit boards. A circuit board bonding structure characterized in that an insulating layer is partially removed while remaining. (2) The circuit board bonding structure according to claim 1, wherein the shape from which the insulating layer is removed is a non-linear oval shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161287U JPH0165170U (en) | 1987-10-21 | 1987-10-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987161287U JPH0165170U (en) | 1987-10-21 | 1987-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0165170U true JPH0165170U (en) | 1989-04-26 |
Family
ID=31444083
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987161287U Pending JPH0165170U (en) | 1987-10-21 | 1987-10-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0165170U (en) |
-
1987
- 1987-10-21 JP JP1987161287U patent/JPH0165170U/ja active Pending