JPH01127176U - - Google Patents
Info
- Publication number
- JPH01127176U JPH01127176U JP1988023456U JP2345688U JPH01127176U JP H01127176 U JPH01127176 U JP H01127176U JP 1988023456 U JP1988023456 U JP 1988023456U JP 2345688 U JP2345688 U JP 2345688U JP H01127176 U JPH01127176 U JP H01127176U
- Authority
- JP
- Japan
- Prior art keywords
- lead portion
- circuit board
- recess
- lead
- base end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Description
第１図ａ〜ｄは、本考案の各実施例を示す回路
基板の要部を底面側から見た斜視図、第２図は、
前記実施例によるリードピンを用いて第一の回路
基板と第二の回路基板とを固着した状態の底面側
から見た斜視図、第３図は、従来例を示す回路基
板の要部を底面側から見た斜視図、第４図は、同
従来例によるリードピンを用いて第一の回路基板
と第二の回路基板とを固着した状態の底面側から
見た斜視図である。
１１，１２……回路基板、１４……リードピン
、１４ａ……リードピンの半田付面、１４ｂ……
リードピンの凹部、１４ｃ……リードピンのリー
ド部。
Figures 1a to d are perspective views of the main parts of the circuit board showing each embodiment of the present invention, viewed from the bottom side, and Figure 2 is a
FIG. 3 is a perspective view of the first circuit board and the second circuit board fixed to each other using the lead pins according to the embodiment, as seen from the bottom side, and FIG. FIG. 4 is a perspective view, seen from the bottom side, of a state in which the first circuit board and the second circuit board are fixed using lead pins according to the conventional example. 11, 12...Circuit board, 14...Lead pin, 14a...Soldering surface of lead pin, 14b...
Recessed portion of lead pin, 14c...Lead portion of lead pin.
Claims (1)
形成され、この基端部から長尺なリード部１４ｃ
が延出された混成集積回路装置用リードピンにお
いて、前記凹部１４ｂに対してリード部１４ｃが
導出されたのと反対側に、凹部１４ｂに挾み込ま
れる回路基板１１の板面とほぼ平行な半田付面１
４ａが形成されたことを特徴とする混成集積回路
装置。 A recess 14b into which the circuit board 11 is inserted is formed at the base end, and a long lead portion 14c is formed from the base end.
In the lead pin for a hybrid integrated circuit device from which the lead portion 14c is extended, on the side opposite to the lead portion 14c from which the lead portion 14c is led out with respect to the recess portion 14b, there is solder that is approximately parallel to the board surface of the circuit board 11 that is inserted into the recess portion 14b. Attached side 1
A hybrid integrated circuit device characterized in that 4a is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023456U JPH0439668Y2 (en) | 1988-02-24 | 1988-02-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023456U JPH0439668Y2 (en) | 1988-02-24 | 1988-02-24 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01127176U true JPH01127176U (en) | 1989-08-30 |
| JPH0439668Y2 JPH0439668Y2 (en) | 1992-09-17 |
Family
ID=31242462
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988023456U Expired JPH0439668Y2 (en) | 1988-02-24 | 1988-02-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0439668Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02124667U (en) * | 1989-03-24 | 1990-10-15 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52101948U (en) * | 1976-01-30 | 1977-08-02 | ||
| JPS5396684U (en) * | 1977-01-11 | 1978-08-05 | ||
| JPS6287453U (en) * | 1985-11-21 | 1987-06-04 |
-
1988
- 1988-02-24 JP JP1988023456U patent/JPH0439668Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52101948U (en) * | 1976-01-30 | 1977-08-02 | ||
| JPS5396684U (en) * | 1977-01-11 | 1978-08-05 | ||
| JPS6287453U (en) * | 1985-11-21 | 1987-06-04 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02124667U (en) * | 1989-03-24 | 1990-10-15 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0439668Y2 (en) | 1992-09-17 |