JPS6245847U - - Google Patents

Info

Publication number
JPS6245847U
JPS6245847U JP13783985U JP13783985U JPS6245847U JP S6245847 U JPS6245847 U JP S6245847U JP 13783985 U JP13783985 U JP 13783985U JP 13783985 U JP13783985 U JP 13783985U JP S6245847 U JPS6245847 U JP S6245847U
Authority
JP
Japan
Prior art keywords
lead pin
hybrid
circuit board
printed circuit
bent portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13783985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP13783985U priority Critical patent/JPS6245847U/ja
Publication of JPS6245847U publication Critical patent/JPS6245847U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本考案の一実施例の屈曲部を有する
リードピンを取付けたハイブリツドIC、第2図
は、プリント基板へのリードピン挿入状態の断面
図で、第2図イは第1図でA方向からみた断面図
、第2図ロは第1図でB方向からみた断面図であ
る。 1……ハイブリツドIC、2……リードピン、
3……屈曲部、4……プリント基板、5……リー
ドピン挿入穴、6……リードピン肩部、7……屈
曲部底部。
Fig. 1 shows a hybrid IC to which a lead pin having a bent portion according to an embodiment of the present invention is attached, Fig. 2 is a sectional view of the lead pin inserted into a printed circuit board, and Fig. 2 A is A in Fig. 1. FIG. 2B is a sectional view seen from direction B in FIG. 1. 1...Hybrid IC, 2...Lead pin,
3...Bent part, 4...Printed circuit board, 5...Lead pin insertion hole, 6...Lead pin shoulder part, 7...Bent part bottom.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ハイブリツドIC用リードピンにおいて、該ハ
イブリツドICをプリント基板に実装した状態で
該プリント基板厚さの中心附近で最大接触を得る
ように前記リードピンに屈曲部を設けたことを特
徴とするハイブリツドIC用リードピン構造。
A lead pin structure for a hybrid IC, characterized in that, in the lead pin for a hybrid IC, a bent portion is provided in the lead pin so as to obtain maximum contact near the center of the thickness of the printed circuit board when the hybrid IC is mounted on the printed circuit board. .
JP13783985U 1985-09-09 1985-09-09 Pending JPS6245847U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13783985U JPS6245847U (en) 1985-09-09 1985-09-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13783985U JPS6245847U (en) 1985-09-09 1985-09-09

Publications (1)

Publication Number Publication Date
JPS6245847U true JPS6245847U (en) 1987-03-19

Family

ID=31042265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13783985U Pending JPS6245847U (en) 1985-09-09 1985-09-09

Country Status (1)

Country Link
JP (1) JPS6245847U (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131868A (en) * 1978-04-04 1979-10-13 Nec Corp Electronic apparatus terminal for through-hole
JPS59218793A (en) * 1983-05-27 1984-12-10 富士通株式会社 Method of mounting dip type ic
JPS6013754B2 (en) * 1982-04-13 1985-04-09 ヴエストフアリア・ゼパラト−ル・アクチエンゲゼルシヤフト Equipment for evacuating airtight self-discharging centrifuge drums

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131868A (en) * 1978-04-04 1979-10-13 Nec Corp Electronic apparatus terminal for through-hole
JPS6013754B2 (en) * 1982-04-13 1985-04-09 ヴエストフアリア・ゼパラト−ル・アクチエンゲゼルシヤフト Equipment for evacuating airtight self-discharging centrifuge drums
JPS59218793A (en) * 1983-05-27 1984-12-10 富士通株式会社 Method of mounting dip type ic

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