JPS6245847U - - Google Patents
Info
- Publication number
- JPS6245847U JPS6245847U JP13783985U JP13783985U JPS6245847U JP S6245847 U JPS6245847 U JP S6245847U JP 13783985 U JP13783985 U JP 13783985U JP 13783985 U JP13783985 U JP 13783985U JP S6245847 U JPS6245847 U JP S6245847U
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- hybrid
- circuit board
- printed circuit
- bent portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第1図は、本考案の一実施例の屈曲部を有する
リードピンを取付けたハイブリツドIC、第2図
は、プリント基板へのリードピン挿入状態の断面
図で、第2図イは第1図でA方向からみた断面図
、第2図ロは第1図でB方向からみた断面図であ
る。
1……ハイブリツドIC、2……リードピン、
3……屈曲部、4……プリント基板、5……リー
ドピン挿入穴、6……リードピン肩部、7……屈
曲部底部。
Fig. 1 shows a hybrid IC to which a lead pin having a bent portion according to an embodiment of the present invention is attached, Fig. 2 is a sectional view of the lead pin inserted into a printed circuit board, and Fig. 2 A is A in Fig. 1. FIG. 2B is a sectional view seen from direction B in FIG. 1. 1...Hybrid IC, 2...Lead pin,
3...Bent part, 4...Printed circuit board, 5...Lead pin insertion hole, 6...Lead pin shoulder part, 7...Bent part bottom.
Claims (1)
イブリツドICをプリント基板に実装した状態で
該プリント基板厚さの中心附近で最大接触を得る
ように前記リードピンに屈曲部を設けたことを特
徴とするハイブリツドIC用リードピン構造。 A lead pin structure for a hybrid IC, characterized in that, in the lead pin for a hybrid IC, a bent portion is provided in the lead pin so as to obtain maximum contact near the center of the thickness of the printed circuit board when the hybrid IC is mounted on the printed circuit board. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13783985U JPS6245847U (en) | 1985-09-09 | 1985-09-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13783985U JPS6245847U (en) | 1985-09-09 | 1985-09-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6245847U true JPS6245847U (en) | 1987-03-19 |
Family
ID=31042265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13783985U Pending JPS6245847U (en) | 1985-09-09 | 1985-09-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6245847U (en) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54131868A (en) * | 1978-04-04 | 1979-10-13 | Nec Corp | Electronic apparatus terminal for through-hole |
JPS59218793A (en) * | 1983-05-27 | 1984-12-10 | 富士通株式会社 | Method of mounting dip type ic |
JPS6013754B2 (en) * | 1982-04-13 | 1985-04-09 | ヴエストフアリア・ゼパラト−ル・アクチエンゲゼルシヤフト | Equipment for evacuating airtight self-discharging centrifuge drums |
-
1985
- 1985-09-09 JP JP13783985U patent/JPS6245847U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54131868A (en) * | 1978-04-04 | 1979-10-13 | Nec Corp | Electronic apparatus terminal for through-hole |
JPS6013754B2 (en) * | 1982-04-13 | 1985-04-09 | ヴエストフアリア・ゼパラト−ル・アクチエンゲゼルシヤフト | Equipment for evacuating airtight self-discharging centrifuge drums |
JPS59218793A (en) * | 1983-05-27 | 1984-12-10 | 富士通株式会社 | Method of mounting dip type ic |
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