JPS6150390U - - Google Patents
Info
- Publication number
- JPS6150390U JPS6150390U JP1984135474U JP13547484U JPS6150390U JP S6150390 U JPS6150390 U JP S6150390U JP 1984135474 U JP1984135474 U JP 1984135474U JP 13547484 U JP13547484 U JP 13547484U JP S6150390 U JPS6150390 U JP S6150390U
- Authority
- JP
- Japan
- Prior art keywords
- electrodes
- condenser microphone
- microphone
- soldering
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
Description
第１図は本考案による実装の断面図であり、第
２図はプリント基板の平面図、第３図は本考案に
よる実装の側断面図である。
１…コンデンサマイクロホン、２…プリント基
板、３…プリントパターン、４…スルーホール、
５…半田。
FIG. 1 is a sectional view of a mounting according to the present invention, FIG. 2 is a plan view of a printed circuit board, and FIG. 3 is a side sectional view of a mounting according to the present invention. 1...Condenser microphone, 2...Printed circuit board, 3...Printed pattern, 4...Through hole,
5...Solder.
Claims (1)
クロホンと、このマイクロホンの前記ハンダ付エ
リアの電極数及び電極ピツチに相当するスルーホ
ールを複数個有するプリント基板と、前記コンデ
ンサマイクロホンの電極とスルーホールとを接合
する半田とからなるコンデンサマイクロホンの取
付装置。 A condenser microphone having soldering electrodes on the bottom surface, a printed circuit board having a plurality of through holes corresponding to the number of electrodes and electrode pitch of the soldering area of this microphone, and the electrodes and through holes of the condenser microphone are joined. A condenser microphone mounting device consisting of solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984135474U JPS6150390U (en) | 1984-09-06 | 1984-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984135474U JPS6150390U (en) | 1984-09-06 | 1984-09-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6150390U true JPS6150390U (en) | 1986-04-04 |
Family
ID=30693958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984135474U Pending JPS6150390U (en) | 1984-09-06 | 1984-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6150390U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201471U (en) * | 1986-06-13 | 1987-12-22 |
-
1984
- 1984-09-06 JP JP1984135474U patent/JPS6150390U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62201471U (en) * | 1986-06-13 | 1987-12-22 |