JPS6390880U - - Google Patents
Info
- Publication number
- JPS6390880U JPS6390880U JP18665986U JP18665986U JPS6390880U JP S6390880 U JPS6390880 U JP S6390880U JP 18665986 U JP18665986 U JP 18665986U JP 18665986 U JP18665986 U JP 18665986U JP S6390880 U JPS6390880 U JP S6390880U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- insertion hole
- circuit board
- component insertion
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000037431 insertion Effects 0.000 claims description 5
- 238000003780 insertion Methods 0.000 claims description 5
- 238000005476 soldering Methods 0.000 claims description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は、本考案のプリント基板のリードレス
部品取付構造の一実施例の平面図であり、第２図
は、第１図のＡ―Ａ矢視断面図であり、第３図は
、従来のプリント基板のリードレス部品取付構造
の断面図である。
１：プリント基板、２：部品挿入穴、３：上面
電極、４：下面電極、５：リードレス部品、６：
電極、７：半田付け、１０：スリツト。
FIG. 1 is a plan view of an embodiment of the leadless component mounting structure for a printed circuit board of the present invention, FIG. 2 is a sectional view taken along the line A--A in FIG. 1, and FIG. FIG. 2 is a cross-sectional view of a conventional leadless component mounting structure for a printed circuit board. 1: Printed circuit board, 2: Component insertion hole, 3: Top electrode, 4: Bottom electrode, 5: Leadless component, 6:
Electrode, 7: Soldering, 10: Slit.
Claims (1)
挿入穴から略放射状に複数のスリツトを切り込み
、前記プリント基板の上面で前記スリツトにより
区分された前記部品挿入穴の周囲の１つの区画に
上面電極を形成し、前記プリント基板の下面で前
記区画と異なる他の区画に下面電極を形成し、前
記部品挿入穴に挿入されたリードレス部品の両端
部に形成された電極を前記上面電極および下面電
極にそれぞれ半田付け接続することを特徴とした
プリント基板のリードレス部品取付構造。 A component insertion hole is formed in the printed circuit board, a plurality of slits are cut approximately radially from the component insertion hole, and an upper surface electrode is formed in one section around the component insertion hole divided by the slits on the upper surface of the printed circuit board. forming a lower electrode on the lower surface of the printed circuit board in another section different from the section, and connecting electrodes formed at both ends of the leadless component inserted into the component insertion hole to the upper electrode and the lower electrode. A leadless component mounting structure for printed circuit boards that features soldering connections to each.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18665986U JPS6390880U (en) | 1986-12-02 | 1986-12-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18665986U JPS6390880U (en) | 1986-12-02 | 1986-12-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6390880U true JPS6390880U (en) | 1988-06-13 |
Family
ID=31136420
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18665986U Pending JPS6390880U (en) | 1986-12-02 | 1986-12-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6390880U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100739151B1 (en) | 2006-01-24 | 2007-07-13 | 엘지전자 주식회사 | A mounting method for surface mount devices |
-
1986
- 1986-12-02 JP JP18665986U patent/JPS6390880U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100739151B1 (en) | 2006-01-24 | 2007-07-13 | 엘지전자 주식회사 | A mounting method for surface mount devices |