JPS6150389U - - Google Patents
Info
- Publication number
- JPS6150389U JPS6150389U JP13424584U JP13424584U JPS6150389U JP S6150389 U JPS6150389 U JP S6150389U JP 13424584 U JP13424584 U JP 13424584U JP 13424584 U JP13424584 U JP 13424584U JP S6150389 U JPS6150389 U JP S6150389U
- Authority
- JP
- Japan
- Prior art keywords
- microphone
- hole
- notch
- electrode
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Details Of Audible-Bandwidth Transducers (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Transmitters (AREA)
Description
第１図は本考案による実装の断面図であり、第
２図、第３図、第４図は各種実施例におけるプリ
ント基板の平面図であり、第５図は本考案による
実装の１例を示す側断面図である。
１…コンデンサーマイクロホン、２…プリント
基板、３…プリントパターン、４…スルーホール
のメツキ面、５…半田、１０…切り欠き。
FIG. 1 is a cross-sectional view of the mounting according to the present invention, FIGS. 2, 3, and 4 are plan views of printed circuit boards in various embodiments, and FIG. 5 is an example of the mounting according to the present invention. FIG. 1... Condenser microphone, 2... Printed circuit board, 3... Printed pattern, 4... Plated surface of through hole, 5... Solder, 10... Notch.
Claims (1)
クロホンと、このマイクロホンの電極に対応する
位置に１つ又は複数のスルーホールを有するプリ
ント基板と、前記スルーホールに設けられた切り
欠きと、前記スルーホール内のメツキ面とコンデ
ンサマイクロホンの電極面とを直接接合する半田
とからなるコンデンサマイクロホンの取付装置。 A condenser microphone having a soldering electrode on the bottom surface, a printed circuit board having one or more through holes at positions corresponding to the electrodes of the microphone, a notch provided in the through hole, and a notch in the through hole. A mounting device for a capacitor microphone consisting of solder that directly connects the plating surface and the electrode surface of the capacitor microphone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13424584U JPS6150389U (en) | 1984-09-04 | 1984-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13424584U JPS6150389U (en) | 1984-09-04 | 1984-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6150389U true JPS6150389U (en) | 1986-04-04 |
Family
ID=30692762
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13424584U Pending JPS6150389U (en) | 1984-09-04 | 1984-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6150389U (en) |
-
1984
- 1984-09-04 JP JP13424584U patent/JPS6150389U/ja active Pending
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