JPS642468U - - Google Patents
Info
- Publication number
- JPS642468U JPS642468U JP9658887U JP9658887U JPS642468U JP S642468 U JPS642468 U JP S642468U JP 9658887 U JP9658887 U JP 9658887U JP 9658887 U JP9658887 U JP 9658887U JP S642468 U JPS642468 U JP S642468U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- circuit pattern
- mounting structure
- component mounting
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 2
- 238000009434 installation Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第1図は本考案に係る電子部品実装構造の一実
施例を示す側面図、第2図は第1図の平面図、第
3図及び第4図は本考案の他の実施例による電子
部品のそれぞれ装着前及び装着後を示す側面図、
第5図は従来の電子部品実装構造を示す縦断面図
、第6図は第5図の平面図である。
1……プリント配線板、2……回路パターン、
5……電子部品、6……リード線、6a……突起
部。
FIG. 1 is a side view showing one embodiment of an electronic component mounting structure according to the present invention, FIG. 2 is a plan view of FIG. 1, and FIGS. 3 and 4 are electronic components according to other embodiments of the present invention. side views showing before and after installation, respectively;
FIG. 5 is a longitudinal sectional view showing a conventional electronic component mounting structure, and FIG. 6 is a plan view of FIG. 5. 1...Printed wiring board, 2...Circuit pattern,
5...Electronic component, 6...Lead wire, 6a...Protrusion.
Claims (1)
ンに電子部品のリード線を接続して実装する電子
部品実装構造において、前記電子部品のリード線
の一部を前記回路パターンに圧入して接続したこ
とを特徴とする電子部品実装構造。 (2) 電子部品のリード線の回路パターンに対す
る圧入面には、少なくとも1個の突起部が形成さ
れたことを特徴とする実用新案登録請求の範囲第
(1)項記載の電子部品実装構造。[Claims for Utility Model Registration] (1) In an electronic component mounting structure in which lead wires of an electronic component are connected and mounted to a circuit pattern formed on a printed wiring board, a portion of the lead wires of the electronic component are connected to the circuit pattern formed on the printed wiring board. An electronic component mounting structure characterized by press-fitting and connecting to a circuit pattern. (2) Utility model registration claim 1, characterized in that at least one protrusion is formed on the press-fit surface of the lead wire of the electronic component into the circuit pattern.
Electronic component mounting structure described in (1).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9658887U JPS642468U (en) | 1987-06-25 | 1987-06-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9658887U JPS642468U (en) | 1987-06-25 | 1987-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS642468U true JPS642468U (en) | 1989-01-09 |
Family
ID=31321582
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9658887U Pending JPS642468U (en) | 1987-06-25 | 1987-06-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS642468U (en) |
-
1987
- 1987-06-25 JP JP9658887U patent/JPS642468U/ja active Pending
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