JPH01165653U - - Google Patents
Info
- Publication number
- JPH01165653U JPH01165653U JP6267188U JP6267188U JPH01165653U JP H01165653 U JPH01165653 U JP H01165653U JP 6267188 U JP6267188 U JP 6267188U JP 6267188 U JP6267188 U JP 6267188U JP H01165653 U JPH01165653 U JP H01165653U
- Authority
- JP
- Japan
- Prior art keywords
- back surface
- lead
- socket
- wire mesh
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Connecting Device With Holders (AREA)
Description
第１図および第２図、第３図は本考案の一実施
例を示すＩＣソケツトのドーター・ボード上への
実装斜視図およびそのＡ−Ａ′，Ｂ−Ｂ′断面図
、第４図はＩＣソケツトをドーター・ボード上へ
実装する状態を説明する斜視図、第５図は従来の
ＩＣソケツトに生じ易い半田の這い上り現象の状
態図である。
１……ドーター・ボード、２……ＩＣソケツト
、３……コンタクト、３′……（ＩＣソケツトの
）リード、４……ＤＩＰ型ＩＣ、５……（ＤＩＰ
型ＩＣの）リード、６……挿入窓口、７……スル
ー・ホール、８……半田、９……半田の這い上り
、１０……金網状のシート。
Figures 1, 2, and 3 are perspective views of an IC socket mounted on a daughter board and sectional views taken along lines A-A' and B-B', respectively, showing an embodiment of the present invention. FIG. 5 is a perspective view illustrating the state in which an IC socket is mounted on a daughter board, and is a state diagram of the solder creep-up phenomenon that tends to occur in conventional IC sockets. 1... Daughter board, 2... IC socket, 3... Contact, 3'... (IC socket) lead, 4... DIP type IC, 5... (DIP
type IC) lead, 6...insertion window, 7...through hole, 8...solder, 9...solder creep up, 10...wire mesh sheet.
Claims (1)
と、裏面に設けられる電子回路基板への半田固着
用のリードと、前記裏面に設けられる金網状シー
トとを備えることを特徴とするＩＣソケツト。 An IC socket characterized by comprising a contact for mounting an IC component provided on the top surface, a lead for soldering to an electronic circuit board provided on the back surface, and a wire mesh sheet provided on the back surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6267188U JPH01165653U (en) | 1988-05-11 | 1988-05-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6267188U JPH01165653U (en) | 1988-05-11 | 1988-05-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01165653U true JPH01165653U (en) | 1989-11-20 |
Family
ID=31288241
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6267188U Pending JPH01165653U (en) | 1988-05-11 | 1988-05-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01165653U (en) |
-
1988
- 1988-05-11 JP JP6267188U patent/JPH01165653U/ja active Pending
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