JPS6099063U - Solder coating structure - Google Patents

Solder coating structure

Info

Publication number
JPS6099063U
JPS6099063U JP18885983U JP18885983U JPS6099063U JP S6099063 U JPS6099063 U JP S6099063U JP 18885983 U JP18885983 U JP 18885983U JP 18885983 U JP18885983 U JP 18885983U JP S6099063 U JPS6099063 U JP S6099063U
Authority
JP
Japan
Prior art keywords
coating structure
solder coating
solder application
solder
application surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18885983U
Other languages
Japanese (ja)
Inventor
岡本　昭三
Original Assignee
西日本商工株式会社
日本板硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 西日本商工株式会社, 日本板硝子株式会社 filed Critical 西日本商工株式会社
Priority to JP18885983U priority Critical patent/JPS6099063U/en
Publication of JPS6099063U publication Critical patent/JPS6099063U/en
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

−第１図は半田付によって取付けるターミナルの斜視図
、第２図は同上の取付状態を示す拡大縦断面図、第３図
は同じく取付状態の正面図である。 ４・・・・・・ターミナル、５・・・・・・取付基板、
６・・・・・・ソケット差込片、７・・・・・・非半田
塗布面、８・・・・・・半田塗布面、１０・・・・・・
凹溝、１１・・・・・・半田。- Fig. 1 is a perspective view of a terminal mounted by soldering, Fig. 2 is an enlarged vertical sectional view showing the same mounted state, and Fig. 3 is a front view of the same mounted state. 4...Terminal, 5...Mounting board,
6... Socket insertion piece, 7... Non-solder coated surface, 8... Solder coated surface, 10...
Concave groove, 11...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半田付によって取付ける部材の半田塗布面と非半田塗布
面との境界に凹溝を設けたことを特徴とする半田塗布構
造。A solder application structure characterized in that a concave groove is provided at the boundary between a solder application surface and a non-solder application surface of a component to be attached by soldering.
JP18885983U 1983-12-06 1983-12-06 Solder coating structure Pending JPS6099063U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18885983U JPS6099063U (en) 1983-12-06 1983-12-06 Solder coating structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18885983U JPS6099063U (en) 1983-12-06 1983-12-06 Solder coating structure

Publications (1)

Publication Number Publication Date
JPS6099063U true JPS6099063U (en) 1985-07-05

Family

ID=30407327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18885983U Pending JPS6099063U (en) 1983-12-06 1983-12-06 Solder coating structure

Country Status (1)

Country Link
JP (1) JPS6099063U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5252482U (en) * 1975-10-14 1977-04-14

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5252482U (en) * 1975-10-14 1977-04-14

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