JPS59152772U - Component mounting structure of printed circuit board - Google Patents
Component mounting structure of printed circuit boardInfo
- Publication number
- JPS59152772U JPS59152772U JP4777383U JP4777383U JPS59152772U JP S59152772 U JPS59152772 U JP S59152772U JP 4777383 U JP4777383 U JP 4777383U JP 4777383 U JP4777383 U JP 4777383U JP S59152772 U JPS59152772 U JP S59152772U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- lead
- mounting structure
- component mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Connecting Device With Holders (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1区は従来のプリント基板にてチップ部品とディップ
部品とを混用実装した状態を示す正面図、第2図は従来
のプリント基板にてチップ部品とディップ部品とを多重
実装した状態を示す正面図、第3図は本考案によるプリ
ント基板の部品実装構造を示す正面図、第4図はリード
ソケットの拡大斜視図、第5図は第4図のA−A線断面
図である。
10・・・プリント基板、11・・・パターン、12a
。
12b、12C・・・チップ部品、13・・・ディップ
部品、14a、 14b−・・リード、15a、
15b−・・リードソケット、16a、16b・・・リ
ードソケットの端子、19・・・リードソケット内のバ
ネ片。Section 1 is a front view showing a state in which chip components and dip components are mounted together on a conventional printed circuit board, and Figure 2 is a front view showing a state in which chip components and dip components are mounted in multiple ways on a conventional printed circuit board. 3 is a front view showing a component mounting structure of a printed circuit board according to the present invention, FIG. 4 is an enlarged perspective view of a lead socket, and FIG. 5 is a sectional view taken along line A--A in FIG. 4. 10... Printed circuit board, 11... Pattern, 12a
. 12b, 12C...Chip part, 13...Dip part, 14a, 14b-...Lead, 15a,
15b...Lead socket, 16a, 16b...Terminal of lead socket, 19...Spring piece in lead socket.
Claims (1)
置して多重実装してなるプリント基板の部品実装構造に
おいて、上記ディップ部品のリード列毎に独立したリー
ドソケットを上記チップ部品を間に挾んでプリント基板
上のパターンに取り付け、このリードソケットにディッ
プ部品の各リードを挿脱可能に挿入実装するようにした
ことを特徴とするプリン1へ基板の部品実装構造。In a printed circuit board component mounting structure in which chip components and dip components are placed one above the other on a printed circuit board and mounted multiple times, an independent lead socket is printed for each lead row of the dip components with the chip components sandwiched between them. A structure for mounting components on a printed circuit board 1, characterized in that each lead of a dip component is attached to a pattern on a circuit board, and each lead of a dip component is removably inserted and mounted into this lead socket.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4777383U JPS59152772U (en) | 1983-03-31 | 1983-03-31 | Component mounting structure of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4777383U JPS59152772U (en) | 1983-03-31 | 1983-03-31 | Component mounting structure of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59152772U true JPS59152772U (en) | 1984-10-13 |
Family
ID=30178320
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4777383U Pending JPS59152772U (en) | 1983-03-31 | 1983-03-31 | Component mounting structure of printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59152772U (en) |
-
1983
- 1983-03-31 JP JP4777383U patent/JPS59152772U/en active Pending
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