JPH0467376U - - Google Patents
Info
- Publication number
- JPH0467376U JPH0467376U JP11047390U JP11047390U JPH0467376U JP H0467376 U JPH0467376 U JP H0467376U JP 11047390 U JP11047390 U JP 11047390U JP 11047390 U JP11047390 U JP 11047390U JP H0467376 U JPH0467376 U JP H0467376U
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- circuit board
- printed circuit
- hole
- daruma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 230000037431 insertion Effects 0.000 claims 2
- 238000003780 insertion Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案のリード線の接合構造を示すも
ので、リード線のハンダ付け前工程を示す全体斜
視図、第２図は本考案によるリード線の接合構造
を示す断面図、第３図は従来のリード線の接合構
造を示す断面図である。
１０……プリント基板、１１……パターン、１
２……スルーホール、２０……リード線、２１…
…導体部、３０……ハンダ、４０……電子機器。
Fig. 1 shows the lead wire joining structure of the present invention, and is an overall perspective view showing the pre-soldering process of the lead wire, Fig. 2 is a sectional view showing the lead wire joining structure of the present invention, and Fig. 3 1 is a sectional view showing a conventional lead wire joining structure. 10...Printed circuit board, 11...Pattern, 1
2...Through hole, 20...Lead wire, 21...
...Conductor part, 30...Solder, 40...Electronic equipment.
Claims (1)
するとともに、該スルーホールに対して、リード
線の挿入端を傾斜状に挿入した後、このリード線
の挿入部分をハンダ付けしたことを特徴とするプ
リント基板におけるリード線の接合構造。 A printed circuit board characterized in that a Daruma-shaped through hole is formed in the printed circuit board, and the insertion end of a lead wire is inserted into the through hole in an inclined manner, and then the insertion portion of the lead wire is soldered. Junction structure of lead wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11047390U JPH0467376U (en) | 1990-10-24 | 1990-10-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11047390U JPH0467376U (en) | 1990-10-24 | 1990-10-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0467376U true JPH0467376U (en) | 1992-06-15 |
Family
ID=31857809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11047390U Pending JPH0467376U (en) | 1990-10-24 | 1990-10-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0467376U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159296A (en) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Ind Co Ltd | Substrate with connecting terminal and battery pack |
-
1990
- 1990-10-24 JP JP11047390U patent/JPH0467376U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008159296A (en) * | 2006-12-21 | 2008-07-10 | Matsushita Electric Ind Co Ltd | Substrate with connecting terminal and battery pack |
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