JPH02104672U - - Google Patents
Info
- Publication number
- JPH02104672U JPH02104672U JP1284089U JP1284089U JPH02104672U JP H02104672 U JPH02104672 U JP H02104672U JP 1284089 U JP1284089 U JP 1284089U JP 1284089 U JP1284089 U JP 1284089U JP H02104672 U JPH02104672 U JP H02104672U
- Authority
- JP
- Japan
- Prior art keywords
- outer shell
- electronic component
- wiring board
- terminals
- component device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims description 2
- 230000037431 insertion Effects 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第３図は本考案の一実施例を示した
もので、第１図ａ乃至ｃは半田付けの工程を説明
する工程図、第２図はサブミニチユアリレーの下
面図、第３図は要部の拡大正面図である。そして
、第４図及び第５図は従来例を示したもので、第
４図は第１図ｃ相当図、第５図は第２図相当図で
ある。
図面中、１１はリレー本体（電子部品本体）、
１２は端子、１３は突起部、１５は配線基板、１
６は挿通孔、１８は半田部である。
Figures 1 to 3 show an embodiment of the present invention; Figures 1a to c are process diagrams explaining the soldering process; Figure 2 is a bottom view of the sub-miniature relay; Figure 3 is an enlarged front view of the main parts. 4 and 5 show conventional examples, with FIG. 4 being a diagram corresponding to FIG. 1c, and FIG. 5 being a diagram corresponding to FIG. 2. In the drawing, 11 is the relay body (electronic component body),
12 is a terminal, 13 is a protrusion, 15 is a wiring board, 1
6 is an insertion hole, and 18 is a solder portion.
Claims (1)
各端子を、配線基板に設けた挿通孔に一方側から
挿通した状態で他方側から半田付けして成る電子
部品装置において、電子部品本体の外殻の複数箇
所に、該外殻と前記配線基板との間に隙間を確保
するための突起部を形成し、且つ前記各端子を、
前記外殻から突出する部分が該外殻の内側に存す
る基端部分よりも細くなるように形成したことを
特徴とする電子部品装置。 In an electronic component device in which a plurality of terminals are provided protruding from an electronic component body, each terminal is inserted into an insertion hole provided in a wiring board from one side and soldered from the other side. Protrusions are formed at a plurality of locations on the outer shell to ensure gaps between the outer shell and the wiring board, and each of the terminals is
An electronic component device characterized in that a portion protruding from the outer shell is formed to be thinner than a base end portion existing inside the outer shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1284089U JPH02104672U (en) | 1989-02-06 | 1989-02-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1284089U JPH02104672U (en) | 1989-02-06 | 1989-02-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02104672U true JPH02104672U (en) | 1990-08-20 |
Family
ID=31222643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1284089U Pending JPH02104672U (en) | 1989-02-06 | 1989-02-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02104672U (en) |
-
1989
- 1989-02-06 JP JP1284089U patent/JPH02104672U/ja active Pending
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