JPH0359667U - - Google Patents
Info
- Publication number
- JPH0359667U JPH0359667U JP12143689U JP12143689U JPH0359667U JP H0359667 U JPH0359667 U JP H0359667U JP 12143689 U JP12143689 U JP 12143689U JP 12143689 U JP12143689 U JP 12143689U JP H0359667 U JPH0359667 U JP H0359667U
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- jumper wire
- notch
- jumper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Combinations Of Printed Boards (AREA)
Description
図は本考案の一実施例を示す展開斜視図である
。
主な図番の説明、１……メインプリント基板、
２……孔、３ａ，３ｂ，３ｃ，３ｄ，３ｅ……第
１のジヤンパー線、４……サブプリント基板、５
ａ，５ｂ，５ｃ，５ｄ，５ｅ……切欠、６ａ，６
ｂ，６ｃ，６ｄ，６ｅ……第２のジヤンパー線。
The figure is a developed perspective view showing an embodiment of the present invention. Explanation of main drawing numbers, 1... Main printed circuit board,
2... Hole, 3a, 3b, 3c, 3d, 3e... First jumper wire, 4... Sub printed board, 5
a, 5b, 5c, 5d, 5e...notch, 6a, 6
b, 6c, 6d, 6e... second jumper wires.
Claims (1)
設してプリント基板同志の接合を行うプリント基
板接合装置において、前記第１のプリント基板に
形成され、前記第２のプリント基板の端部が挿入
される孔と、該孔をまたいで前記第１のプリント
基板に架設される第１のジヤンパー線と、前記第
２のプリント基板の端部の前記第１のジヤンパー
線に対向する部分に形成される切欠と、該切欠を
またいで前記第２のプリント基板に架設される第
２のジヤンパー線とを備え、前記孔に前記第２の
プリント基板の端部を挿入する際に、前記第１の
ジヤンパー線が前記切欠に挿入される様にし、前
記第１及び第２のジヤンパー線間で半田付けを行
う様にしたことを特徴とするプリント基板接合装
置。 In a printed circuit board bonding apparatus that connects printed circuit boards by standing a second printed circuit board on a first printed circuit board, an end portion of the second printed circuit board formed on the first printed circuit board is inserted. a first jumper wire installed on the first printed circuit board across the hole; and a first jumper wire formed on an end of the second printed circuit board opposite to the first jumper wire. a notch, and a second jumper wire installed on the second printed circuit board across the notch, and when inserting the end of the second printed circuit board into the hole, A printed circuit board bonding apparatus characterized in that a jumper wire is inserted into the notch, and soldering is performed between the first and second jumper wires.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12143689U JPH0359667U (en) | 1989-10-17 | 1989-10-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12143689U JPH0359667U (en) | 1989-10-17 | 1989-10-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0359667U true JPH0359667U (en) | 1991-06-12 |
Family
ID=31669469
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12143689U Pending JPH0359667U (en) | 1989-10-17 | 1989-10-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0359667U (en) |
-
1989
- 1989-10-17 JP JP12143689U patent/JPH0359667U/ja active Pending
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