JPS63188977U - - Google Patents
Info
- Publication number
- JPS63188977U JPS63188977U JP8141387U JP8141387U JPS63188977U JP S63188977 U JPS63188977 U JP S63188977U JP 8141387 U JP8141387 U JP 8141387U JP 8141387 U JP8141387 U JP 8141387U JP S63188977 U JPS63188977 U JP S63188977U
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- lead wires
- mounting lead
- lead wire
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案による実装基板の一実施例を示
した断面図、第２図は上記実施例の変形例を示し
た断面図である。
１，７……電子部品、２，３，８……取付リー
ド線、４……電子回路（プリント）基板、５，６
，９……取付け穴。
FIG. 1 is a sectional view showing an embodiment of a mounting board according to the present invention, and FIG. 2 is a sectional view showing a modification of the above embodiment. 1, 7... Electronic component, 2, 3, 8... Mounting lead wire, 4... Electronic circuit (printed) board, 5, 6
, 9...Mounting hole.
Claims (1)
電子部品を搭載し上記取付リード線挿入用の複数
の取付け穴が穿孔された電子回路基板とを具備す
る実装基板において、上記複数の取付リード線の
うちの少なくとも一本の取付リード線は、寸法及
び形状の少なくとも一方が残りの取付リード線と
異なり、上記一本の取付リード線に対応する取付
け穴と上記残りの取付リード線に対応する取付け
穴との一方は、他方の取付け穴に対応する取付リ
ード線が挿入可能となるように、寸法又は形状が
定められていることを特徴とする実装基板。 In a mounting board comprising an electronic component having a plurality of mounting lead wires, and an electronic circuit board on which the electronic component is mounted and having a plurality of mounting holes for inserting the plurality of mounting lead wires, At least one of the mounting lead wires is different from the remaining mounting lead wires in at least one of dimensions and shape, and has a mounting hole corresponding to the one mounting lead wire and a mounting hole corresponding to the remaining mounting lead wire. A mounting board characterized in that one of the mounting boards has a size or shape determined such that a corresponding mounting lead wire can be inserted into the mounting hole of the other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8141387U JPS63188977U (en) | 1987-05-28 | 1987-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8141387U JPS63188977U (en) | 1987-05-28 | 1987-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63188977U true JPS63188977U (en) | 1988-12-05 |
Family
ID=30933128
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8141387U Pending JPS63188977U (en) | 1987-05-28 | 1987-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63188977U (en) |
-
1987
- 1987-05-28 JP JP8141387U patent/JPS63188977U/ja active Pending
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