JPH01161365U - - Google Patents
Info
- Publication number
- JPH01161365U JPH01161365U JP5725988U JP5725988U JPH01161365U JP H01161365 U JPH01161365 U JP H01161365U JP 5725988 U JP5725988 U JP 5725988U JP 5725988 U JP5725988 U JP 5725988U JP H01161365 U JPH01161365 U JP H01161365U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- attachment part
- solder attachment
- adjacent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 230000037431 insertion Effects 0.000 claims description 3
- 238000003780 insertion Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は本考案に関するプリント基板の一実施例
を示し、第１図は裏面から見た部分平面図、第２
図はランドの平面図、第３図はランドの側面図、
第４図は部品を配置した状態の平面図、第５図乃
至第８図はそれぞれ他の実施例のランドの平面図
、第９図及び第１０図は従来例を示し、第９図は
部分平面図、第１０図は部品を配置した状態の平
面図である。
（主要部分を示す図面の符号の説明）、１……
プリント基板、２……部品、３……リード線、４
……挿入孔、５……ランド（半田取付部）、６…
…突出部、Ｈ……半田。
The drawings show an embodiment of the printed circuit board related to the present invention, and FIG. 1 is a partial plan view seen from the back side, and FIG.
The figure is a plan view of the land, Figure 3 is a side view of the land,
FIG. 4 is a plan view of the parts arranged, FIGS. 5 to 8 are plan views of lands of other embodiments, FIGS. 9 and 10 are conventional examples, and FIG. 9 is a partial view of the land. A plan view, FIG. 10 is a plan view of the state in which parts are arranged. (Explanation of symbols in drawings indicating main parts), 1...
Printed circuit board, 2... Parts, 3... Lead wire, 4
...Insertion hole, 5...Land (solder attachment part), 6...
...Protrusion, H...solder.
Claims (1)
数個形成され、該挿入孔の周囲に半田取付部が形
成されたプリント基板において、上記半田取付部
は隣接方向に位置して突出部が形成されたことを
特徴とするプリント基板。 In a printed circuit board in which a plurality of insertion holes for inserting component lead wires are formed adjacent to each other and a solder attachment part is formed around the insertion hole, the solder attachment part is located in an adjacent direction and a protruding part is formed. A printed circuit board characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5725988U JPH01161365U (en) | 1988-04-26 | 1988-04-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5725988U JPH01161365U (en) | 1988-04-26 | 1988-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01161365U true JPH01161365U (en) | 1989-11-09 |
Family
ID=31283114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5725988U Pending JPH01161365U (en) | 1988-04-26 | 1988-04-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01161365U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209731A (en) * | 1989-02-09 | 1990-08-21 | Seiko Epson Corp | Spinner |
| JPH04225256A (en) * | 1990-12-26 | 1992-08-14 | Toshiba Corp | Holding device for wafer |
-
1988
- 1988-04-26 JP JP5725988U patent/JPH01161365U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02209731A (en) * | 1989-02-09 | 1990-08-21 | Seiko Epson Corp | Spinner |
| JPH04225256A (en) * | 1990-12-26 | 1992-08-14 | Toshiba Corp | Holding device for wafer |
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