JPS61136579U - - Google Patents
Info
- Publication number
- JPS61136579U JPS61136579U JP1828185U JP1828185U JPS61136579U JP S61136579 U JPS61136579 U JP S61136579U JP 1828185 U JP1828185 U JP 1828185U JP 1828185 U JP1828185 U JP 1828185U JP S61136579 U JPS61136579 U JP S61136579U
- Authority
- JP
- Japan
- Prior art keywords
- soldered
- land portions
- wiring board
- printed wiring
- lead wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005192 partition Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係る印刷配線基板の一実施例
を示す斜視図、第２図は第１図のランド部に対す
るリード線の接続状態を示す斜視図、第３図は本
考案に係る印刷配線基板の他の実施例を示す斜視
図、第４図は従来の印刷配線基板を示す斜視図で
ある。
４，５……リード線、６……主印刷配線基板、
７……導体パターン、８，８′，８−１〜８−４
，８′−１〜８′−２……ランド、１０……スリ
ツト。
FIG. 1 is a perspective view showing an embodiment of the printed wiring board according to the present invention, FIG. 2 is a perspective view showing the connection state of the lead wire to the land portion of FIG. 1, and FIG. 3 is the printed circuit board according to the present invention. A perspective view showing another embodiment of the wiring board. FIG. 4 is a perspective view showing a conventional printed wiring board. 4, 5... Lead wire, 6... Main printed wiring board,
7... Conductor pattern, 8, 8', 8-1 to 8-4
, 8' -1 to 8' -2 ...Land, 10...Slit.
Claims (1)
部に複数のリード線を隣接して半田付けするよう
にしてなる印刷配線基板において、前記ランド部
にこのランド部に半田付けされる複数のリード線
を互いに仕切るスリツトを形成したことを特徴と
する印刷配線基板。 In a printed wiring board in which a plurality of lead wires are soldered adjacent to land portions formed on a conductor pattern on an insulating substrate, a plurality of lead wires to be soldered to the land portions are soldered to the land portions. A printed wiring board characterized by forming slits that partition each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1828185U JPS61136579U (en) | 1985-02-14 | 1985-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1828185U JPS61136579U (en) | 1985-02-14 | 1985-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61136579U true JPS61136579U (en) | 1986-08-25 |
Family
ID=30506767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1828185U Pending JPS61136579U (en) | 1985-02-14 | 1985-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61136579U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01293557A (en) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | Semiconductor device |
-
1985
- 1985-02-14 JP JP1828185U patent/JPS61136579U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01293557A (en) * | 1988-05-20 | 1989-11-27 | Mitsubishi Electric Corp | Semiconductor device |
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