JPS63149590U - - Google Patents

Info

Publication number
JPS63149590U
JPS63149590U JP4291387U JP4291387U JPS63149590U JP S63149590 U JPS63149590 U JP S63149590U JP 4291387 U JP4291387 U JP 4291387U JP 4291387 U JP4291387 U JP 4291387U JP S63149590 U JPS63149590 U JP S63149590U
Authority
JP
Japan
Prior art keywords
holes
mounting structure
integrated circuit
hybrid integrated
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4291387U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4291387U priority Critical patent/JPS63149590U/ja
Publication of JPS63149590U publication Critical patent/JPS63149590U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Components In General For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例の混成集積回路実装
構造を示す斜視図、第2図は第1図の混成集積回
路実装構造の一部を示す断面図、第3図は第1図
の混成集積回路の厚膜印刷基板を示す平面図、第
4図は第1図の混成集積回路実装構造の金属プレ
ートを示す平面図、第5図〜第7図は従来の混成
集積回路実装構造を示す平面図、第8図は第7図
の混成集積回路実装構造の一部を示す断面図であ
る。 1,20〜22……厚膜印刷基板、2,23〜
25……金属プレート、3……線材、4……貫通
穴、5……ICやトランジスタ等の部品、6……
コーテイング、7……穴、8,29……半田、9
……パターン、26〜28……突起。
FIG. 1 is a perspective view showing a hybrid integrated circuit mounting structure according to an embodiment of the present invention, FIG. 2 is a sectional view showing a part of the hybrid integrated circuit mounting structure of FIG. 1, and FIG. 4 is a plan view showing the metal plate of the hybrid integrated circuit mounting structure of FIG. 1, and FIGS. 5 to 7 are plan views showing the conventional hybrid integrated circuit mounting structure. The plan view shown in FIG. 8 is a sectional view showing a part of the hybrid integrated circuit mounting structure of FIG. 7. 1,20~22...Thick film printed board, 2,23~
25... Metal plate, 3... Wire, 4... Through hole, 5... Parts such as IC and transistor, 6...
Coating, 7... Hole, 8, 29... Solder, 9
...Pattern, 26-28...Protrusion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属プレート上に厚膜印刷基板を半田溶着して
なる混成集積回路実装構造において、前記金属プ
レートに複数の穴が設けてあり、前記穴のそれぞ
れに対向する貫通穴が前記厚膜印刷基板に設けて
あり、互いに対向する前記穴及び貫通穴に線材が
挿着してあることを特徴とする混成集積回路実装
構造。
In a hybrid integrated circuit mounting structure in which a thick film printed circuit board is solder welded onto a metal plate, a plurality of holes are provided in the metal plate, and through holes opposite to each of the holes are provided in the thick film printed circuit board. 1. A hybrid integrated circuit mounting structure characterized in that a wire rod is inserted into the hole and the through hole which are opposed to each other.
JP4291387U 1987-03-24 1987-03-24 Pending JPS63149590U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4291387U JPS63149590U (en) 1987-03-24 1987-03-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4291387U JPS63149590U (en) 1987-03-24 1987-03-24

Publications (1)

Publication Number Publication Date
JPS63149590U true JPS63149590U (en) 1988-10-03

Family

ID=30859279

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4291387U Pending JPS63149590U (en) 1987-03-24 1987-03-24

Country Status (1)

Country Link
JP (1) JPS63149590U (en)

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