JPS63149590U - - Google Patents
Info
- Publication number
- JPS63149590U JPS63149590U JP4291387U JP4291387U JPS63149590U JP S63149590 U JPS63149590 U JP S63149590U JP 4291387 U JP4291387 U JP 4291387U JP 4291387 U JP4291387 U JP 4291387U JP S63149590 U JPS63149590 U JP S63149590U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- mounting structure
- integrated circuit
- hybrid integrated
- metal plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
Landscapes
- Mounting Components In General For Electric Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図は本考案の一実施例の混成集積回路実装
構造を示す斜視図、第２図は第１図の混成集積回
路実装構造の一部を示す断面図、第３図は第１図
の混成集積回路の厚膜印刷基板を示す平面図、第
４図は第１図の混成集積回路実装構造の金属プレ
ートを示す平面図、第５図〜第７図は従来の混成
集積回路実装構造を示す平面図、第８図は第７図
の混成集積回路実装構造の一部を示す断面図であ
る。
１，２０〜２２……厚膜印刷基板、２，２３〜
２５……金属プレート、３……線材、４……貫通
穴、５……ＩＣやトランジスタ等の部品、６……
コーテイング、７……穴、８，２９……半田、９
……パターン、２６〜２８……突起。
FIG. 1 is a perspective view showing a hybrid integrated circuit mounting structure according to an embodiment of the present invention, FIG. 2 is a sectional view showing a part of the hybrid integrated circuit mounting structure of FIG. 1, and FIG. 4 is a plan view showing the metal plate of the hybrid integrated circuit mounting structure of FIG. 1, and FIGS. 5 to 7 are plan views showing the conventional hybrid integrated circuit mounting structure. The plan view shown in FIG. 8 is a sectional view showing a part of the hybrid integrated circuit mounting structure of FIG. 7. 1,20~22...Thick film printed board, 2,23~
25... Metal plate, 3... Wire, 4... Through hole, 5... Parts such as IC and transistor, 6...
Coating, 7... Hole, 8, 29... Solder, 9
...Pattern, 26-28...Protrusion.
Claims (1)
なる混成集積回路実装構造において、前記金属プ
レートに複数の穴が設けてあり、前記穴のそれぞ
れに対向する貫通穴が前記厚膜印刷基板に設けて
あり、互いに対向する前記穴及び貫通穴に線材が
挿着してあることを特徴とする混成集積回路実装
構造。 In a hybrid integrated circuit mounting structure in which a thick film printed circuit board is solder welded onto a metal plate, a plurality of holes are provided in the metal plate, and through holes opposite to each of the holes are provided in the thick film printed circuit board. 1. A hybrid integrated circuit mounting structure characterized in that a wire rod is inserted into the hole and the through hole which are opposed to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4291387U JPS63149590U (en) | 1987-03-24 | 1987-03-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4291387U JPS63149590U (en) | 1987-03-24 | 1987-03-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63149590U true JPS63149590U (en) | 1988-10-03 |
Family
ID=30859279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4291387U Pending JPS63149590U (en) | 1987-03-24 | 1987-03-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63149590U (en) |
-
1987
- 1987-03-24 JP JP4291387U patent/JPS63149590U/ja active Pending