JPH021563U - - Google Patents
Info
- Publication number
- JPH021563U JPH021563U JP7648988U JP7648988U JPH021563U JP H021563 U JPH021563 U JP H021563U JP 7648988 U JP7648988 U JP 7648988U JP 7648988 U JP7648988 U JP 7648988U JP H021563 U JPH021563 U JP H021563U
- Authority
- JP
- Japan
- Prior art keywords
- solder
- jet
- tank
- movable plate
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 23
- 230000000630 rising effect Effects 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims description 2
- 230000004907 flux Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案に係るはんだ噴流装置の要部断
面図、第２図及び第３図は従来におけるはんだ噴
流装置の要部断面図及び全体図、第４図は噴流筒
部分の分解斜視図である。
１……噴流装置、２ａ，２ｂ……はんだ流、４
……電子部品、７……噴流筒、９……噴流口、１
０……フラツクス、１５……可動板、１６……支
軸、２２……補助可動板、２５……制御筒、２８
……支軸、３１……後方の調整板。
Fig. 1 is a sectional view of the main parts of the solder jet device according to the present invention, Figs. 2 and 3 are sectional views of the main parts and overall view of the conventional solder jet device, and Fig. 4 is an exploded perspective view of the jet cylinder part. It is. 1... Jet device, 2a, 2b... Solder flow, 4
...Electronic component, 7... Jet tube, 9... Jet port, 1
0... Flux, 15... Movable plate, 16... Support shaft, 22... Auxiliary movable plate, 25... Control tube, 28
...Spindle, 31... Rear adjustment plate.
補正 昭６３．７．１４
実用新案登録請求の範囲を次のように補正する
。Amendment July 14, 1983 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
はんだを加熱しながら溶融状態で収容するはん
だ槽と、下方がはんだ槽内に設置され上方にはん
だの噴流口が形成された噴流筒と、はんだ槽に受
容されているはんだを噴流口まで押し上げるポン
プとを有するはんだ噴流装置において、
前記噴流筒の内部に、上昇するはんだを二分す
ると共に各はんだ流量の比率調整を行なう可動板
を取付け、
前記噴流口付近に、二分された一方のはんだ流
をはんだ付け位置の下面に導く制御筒を角度調整
可能に設けたこと、 を特徴とする
はんだ噴流装置。[Scope of Claim for Utility Model Registration] A solder tank that stores solder in a molten state while heating it, a jet tube whose lower part is installed in the solder tank and whose upper part is formed with a jet nozzle for solder, and which is received in the solder tank. In the solder jet apparatus, a movable plate is installed inside the jet cylinder to divide the rising solder into two parts and to adjust the ratio of each solder flow rate , 1. A solder jet device characterized by having a control tube whose angle can be adjusted to guide one of the solder flows to the lower surface of a soldering position .
Claims (1)
だ槽と、下方がはんだ槽内に設置され上方にはん
だの噴流口が形成された噴流筒と、はんだ槽に受
容されているはんだを噴流口まで押し上げるポン
プと、噴流筒の内部に取付けられ上昇するはんだ
を二分すると共に各はんだ流量の比率調整を行な
う可動板と、噴流口付近に角度調整可能に設けら
れ二分された一方のはんだ流をはんだ付け位置の
下面に導く制御筒と、から成るはんだ噴流装置。 A solder tank that heats the solder and stores it in a molten state, a jet tube whose lower part is installed in the solder tank and has a solder jet port formed above, and a pump that pushes the solder received in the solder tank up to the jet port. A movable plate is installed inside the jet tube to divide the rising solder into two and adjust the ratio of each solder flow rate, and a movable plate is installed near the jet port so that the angle can be adjusted to direct one of the divided solder flows to the soldering position. A solder jet device consisting of a control tube that leads to the bottom surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7648988U JPH021563U (en) | 1988-06-09 | 1988-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7648988U JPH021563U (en) | 1988-06-09 | 1988-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH021563U true JPH021563U (en) | 1990-01-08 |
Family
ID=31301514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7648988U Pending JPH021563U (en) | 1988-06-09 | 1988-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021563U (en) |
-
1988
- 1988-06-09 JP JP7648988U patent/JPH021563U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH021563U (en) | ||
| JPH0253873U (en) | ||
| JPH03106264U (en) | ||
| JPH0276663U (en) | ||
| JPS6113156Y2 (en) | ||
| JPH021564U (en) | ||
| JPS62113623U (en) | ||
| JPS61185561U (en) | ||
| JPS6163359U (en) | ||
| JPS61132324U (en) | ||
| JPS60179230U (en) | Coffee extractor concentration adjustment device | |
| JPS63189471U (en) | ||
| JPS5877700U (en) | steam iron | |
| JPH0362663U (en) | ||
| JPH0454559U (en) | ||
| JPH02114189U (en) | ||
| JPS6153235U (en) | ||
| JPH0311445U (en) | ||
| JPS5877697U (en) | steam iron | |
| JPH0160765U (en) | ||
| JPS6046960U (en) | Gas cutting machine with adjustable crater angle | |
| JPH01140007U (en) | ||
| JPS58137540U (en) | Core disintegration and elution device | |
| JPS62179148U (en) | ||
| JPS61111662U (en) |