JPH0276663U - - Google Patents
Info
- Publication number
- JPH0276663U JPH0276663U JP15243088U JP15243088U JPH0276663U JP H0276663 U JPH0276663 U JP H0276663U JP 15243088 U JP15243088 U JP 15243088U JP 15243088 U JP15243088 U JP 15243088U JP H0276663 U JPH0276663 U JP H0276663U
- Authority
- JP
- Japan
- Prior art keywords
- solder reservoir
- flow rate
- liquid level
- drive device
- bath
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 2
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案の噴流はんだ槽の一部を断面に
した斜視図、第２図は本考案の噴流はんだ槽の正
面図、第３図は同側面断面図である。
１…噴流はんだ槽、２…ノズル板、３…側板、
２…ノズル、５…溜板、６…はんだ貯溜槽、７…
開口、８…流量調整装置（摺動板）、１２…駆動
装置。
FIG. 1 is a partially sectional perspective view of the jet solder bath of the present invention, FIG. 2 is a front view of the jet solder bath of the present invention, and FIG. 3 is a side sectional view of the same. 1... Jet solder bath, 2... Nozzle plate, 3... Side plate,
2... Nozzle, 5... Reservoir plate, 6... Solder reservoir, 7...
Opening, 8...flow adjustment device (sliding plate), 12... drive device.
Claims (1)
はんだにおいて、はんだ貯溜槽の下部開口には駆
動装置で流量調整を行うことのできる流量調整装
置が設置されており、しかも該駆動装置ははんだ
貯溜槽の液面を検知する液面センサーと電気的に
接続されていることを特徴とする噴流はんだ槽。 In jet soldering in which a solder reservoir is installed on the side of the nozzle, a flow rate adjustment device that can adjust the flow rate with a drive device is installed at the lower opening of the solder reservoir, and the drive device is connected to the solder reservoir. A jet soldering bath characterized by being electrically connected to a liquid level sensor that detects the liquid level in the bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15243088U JPH0276663U (en) | 1988-11-25 | 1988-11-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15243088U JPH0276663U (en) | 1988-11-25 | 1988-11-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0276663U true JPH0276663U (en) | 1990-06-12 |
Family
ID=31427349
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15243088U Pending JPH0276663U (en) | 1988-11-25 | 1988-11-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0276663U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0569121A (en) * | 1991-08-23 | 1993-03-23 | Matsushita Electric Ind Co Ltd | Method for controlling wave solder waveform surface, controlling jig and soldering device |
-
1988
- 1988-11-25 JP JP15243088U patent/JPH0276663U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0569121A (en) * | 1991-08-23 | 1993-03-23 | Matsushita Electric Ind Co Ltd | Method for controlling wave solder waveform surface, controlling jig and soldering device |
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