JPH03120969U - - Google Patents
Info
- Publication number
- JPH03120969U JPH03120969U JP3075490U JP3075490U JPH03120969U JP H03120969 U JPH03120969 U JP H03120969U JP 3075490 U JP3075490 U JP 3075490U JP 3075490 U JP3075490 U JP 3075490U JP H03120969 U JPH03120969 U JP H03120969U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- auxiliary
- port
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 238000005476 soldering Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第５図は本考案の一実施例を示すも
ので、第１図は噴流筒の斜視図、第２図は第１図
の−線断面図、第３図は第１図の−線断
面図、第４図は第３図の−線断面図、第５図
は第２図の−線断面図である。第６図乃至第
８図は一側寄りに多量の半田を必要とする印刷配
線板の半田付けを行なう場合の噴流動作を示すも
ので、第６図は印刷配線板の上面図、第７図は噴
流状態を示す側面図、第８図は噴流状態示す正面
図である。第９図乃至第１１図は両側に多量の半
田を必要とする印刷配線板の半田付けを行なう場
合の噴流動作を示すもので、第９図は印刷配線板
の上面図、第１０図は噴流状態を示す側面図、第
１１図は噴流状態を示す正面図である。第１２図
及び第１３図は従来例を示すもので、第１２図は
半田噴流装置の概略図、第１３図は第１２図の
−線拡大断面図である。
図中、１……噴流筒、２……主噴流筒、２ａ…
…主噴流口、３……第１補助噴流筒、３ａ……第
１補助噴流口、３ｂ……ガイドレール、３ｃ……
操作板、４……第２補助噴流筒、４ａ……第２補
助噴流口、４ｂ……ガイドレール、４ｃ……操作
板、ＹＨ……溶融半田。
1 to 5 show one embodiment of the present invention, in which FIG. 1 is a perspective view of a jet tube, FIG. 2 is a cross-sectional view taken along the line -- in FIG. FIG. 4 is a cross-sectional view taken along the line -- in FIG. 3, and FIG. 5 is a cross-sectional view taken along the line -- in FIG. 2. Figures 6 to 8 show the jet flow operation when soldering a printed wiring board that requires a large amount of solder on one side. Figure 6 is a top view of the printed wiring board, and Figure 7 is a top view of the printed wiring board. 8 is a side view showing a jet state, and FIG. 8 is a front view showing a jet state. Figures 9 to 11 show the jet flow operation when soldering a printed wiring board that requires a large amount of solder on both sides. Figure 9 is a top view of the printed wiring board, and Figure 10 is a jet flow. FIG. 11 is a side view showing the state, and FIG. 11 is a front view showing the jet state. 12 and 13 show a conventional example, in which FIG. 12 is a schematic diagram of a solder jet device, and FIG. 13 is an enlarged sectional view taken along the line -- in FIG. 12. In the figure, 1... jet tube, 2... main jet tube, 2a...
...Main jet port, 3...First auxiliary jet tube, 3a...First auxiliary jet port, 3b...Guide rail, 3c...
Operation plate, 4... Second auxiliary jet tube, 4a... Second auxiliary jet port, 4b... Guide rail, 4c... Operation plate, YH... Molten solder.
Claims (1)
槽内に配置され、且つ上端に噴流口を有する噴流
筒と、半田槽内の溶融半田を噴流筒を通じて噴流
口から上方に押し出すポンプとを具備した半田噴
流装置において、 噴流筒を、主噴流口を有する主噴流筒と、主噴
流口と離れた位置に補助噴流口を有する補助噴流
筒とから構成すると共に、 補助噴流口にその開口長さ及び位置を変更可能
な噴流調整機構を設けた ことを特徴とする半田噴流装置。 (2) 補助噴流筒を複数個並設すると共に、各補
助噴流筒の補助噴流口にその開口長さ及び位置を
変更可能な噴流調整機構を夫々設けた請求項(1)
記載の半田噴流装置。[Scope of Claim for Utility Model Registration] (1) A solder tank that stores solder in a molten state, a jet tube disposed within the solder tank and having a jet port at the upper end, and a jet tube that allows the molten solder in the solder tank to pass through the jet tube. In a solder jet device equipped with a pump that pushes upward from a jet port, the jet cylinder is composed of a main jet cylinder having a main jet port and an auxiliary jet cylinder having an auxiliary jet port at a position apart from the main jet port. Also, a solder jet device characterized in that the auxiliary jet port is provided with a jet flow adjustment mechanism that can change the opening length and position of the auxiliary jet port. (2) Claim (1) in which a plurality of auxiliary jet tubes are arranged in parallel, and the auxiliary jet port of each auxiliary jet tube is provided with a jet flow adjustment mechanism that can change the opening length and position.
The described solder jet device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3075490U JPH03120969U (en) | 1990-03-26 | 1990-03-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3075490U JPH03120969U (en) | 1990-03-26 | 1990-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03120969U true JPH03120969U (en) | 1991-12-11 |
Family
ID=31533461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3075490U Pending JPH03120969U (en) | 1990-03-26 | 1990-03-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03120969U (en) |
-
1990
- 1990-03-26 JP JP3075490U patent/JPH03120969U/ja active Pending
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