JPS63199065A - Jet solder tank - Google Patents
Jet solder tankInfo
- Publication number
- JPS63199065A JPS63199065A JP2808487A JP2808487A JPS63199065A JP S63199065 A JPS63199065 A JP S63199065A JP 2808487 A JP2808487 A JP 2808487A JP 2808487 A JP2808487 A JP 2808487A JP S63199065 A JPS63199065 A JP S63199065A
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- port
- tank
- jet port
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 70
- 238000005476 soldering Methods 0.000 claims description 9
- 239000012530 fluid Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 abstract 5
- 238000007664 blowing Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 210000000078 claw Anatomy 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、はんだ槽内に設けた１槽の噴流槽に２個所
の噴流口を形成し、これらの噴流口から噴流するはんだ
融液の噴流量や噴流角度をそれぞれ別個に調整できるよ
うにした噴流式はんだ槽に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention forms two jet ports in one jet tank provided in a solder tank, and the solder melt that is jetted from these jet ports. This invention relates to a jet solder bath in which the jet flow amount and jet angle can be adjusted separately.
従来、チップ部品を接着剤等で仮装着したプリント基板
にはんだ付けする場合、はんだ槽本体を仕切壁で仕切っ
て、プリント基板の走行方向に対して順次１次槽と２次
槽の２槽に配列した２槽式の噴流式はんだ槽を使用して
いた。そして上記噴流式はんだ槽は、各槽毎にはんだ融
液を加圧して噴流口から噴流する加圧装置をそれぞれ設
けていた。Conventionally, when soldering chip parts to a printed circuit board that has been temporarily attached with adhesive, etc., the solder tank itself is divided by a partition wall, and the soldering tank is divided into two tanks, a primary tank and a secondary tank, sequentially in the running direction of the printed circuit board. An array of two jet-flow solder baths was used. Each of the jet-type solder tanks was provided with a pressurizing device for pressurizing the solder melt and jetting it from the jet port.
上記のような従来の噴流式はんだ槽では、噴流槽を２糟
設け、各噴流槽毎にはんだ融液を噴流する噴流槽とはん
だ融液を加圧する加圧装置を必要とするため、はんだ槽
本体が大きくなって設置するための広い場所を必要とし
、また、プリント基板の種類が多い場合にフローディッ
プ式のはんだ槽と噴流式のはんだ槽の２槽のはんだ槽を
設置する必要があり、したがって、設備のための経費と
はんだ付けに要する費用がかかるという問題点があった
。In the conventional jet type soldering bath as described above, two jet tanks are provided, and each jet tank requires a jet tank to jet the solder melt and a pressurizing device to pressurize the solder melt. The main unit is large and requires a large space for installation, and if there are many types of printed circuit boards, it is necessary to install two soldering baths: a flow dip type soldering bath and a jet type soldering bath. Therefore, there is a problem in that the cost for equipment and the cost required for soldering are high.
この発明は上記の問題点を解決するためになされたもの
で、１＠の噴流槽に２個所の噴流口を形成することによ
り１台の加圧装置で各噴流口からのはんだ融液の噴流量
と形状とを任意に変えることができる噴流式はんだ槽を
得ることを目的とする。This invention was made to solve the above problems, and by forming two jet ports in one jet tank, melted solder can be jetted from each jet port using one pressurizing device. The object of the present invention is to obtain a jet-flow solder bath whose flow rate and shape can be arbitrarily changed.
（問題点を解決するための手段）
この発明にかかる噴流式はんだ槽は、噴流槽の上部にそ
の長手方向がプリント基板の走行方向と直角方向となる
ように形成した第１の噴流口と第２の噴流口とをプリン
ト基板の走行方向に対して順次配列し、かつ第１の噴流
口と第２の噴流口から噴出するはんだ融液の量をそれぞ
れ調整する各流量調整器を設け、さらに第１の噴流口ま
たは第２の噴流口からはんだ融液を噴出し凹凸波を形成
する透孔を形成した噴流体またははんだ融液を噴出して
噴流波を形成する噴流板を第１の噴流口または第２の噴
流口のいずれかに設けたものである。(Means for Solving the Problems) The jet type solder bath according to the present invention includes a first jet port formed at the upper part of the jet tank so that its longitudinal direction is perpendicular to the running direction of the printed circuit board. 2 jet ports are arranged sequentially in the running direction of the printed circuit board, and each flow rate regulator is provided to respectively adjust the amount of the solder melt spouted from the first jet port and the second jet port, and A first jet is used to connect a jet having a through hole formed in which the solder melt is jetted from the first jet port or the second jet port to form uneven waves, or a jet plate which jets the solder melt to form jet waves. It is provided either at the mouth or at the second jet opening.
（作用〕
この発明においては、各流量調整器を回動して流入口と
流出口の位置を変えることにより、噴流口から噴出する
はんだ融液の量と形状とをそれぞれ変えることができる
とともに、各噴流口上の噴流波を形成する部材を変える
ことにより１槽の噴流槽で種々の噴流波を形成すること
ができる。(Function) In the present invention, by rotating each flow rate regulator to change the positions of the inlet and outlet, the amount and shape of the solder melt spouted from the jet ports can be changed. By changing the members that form the jet waves on each jet port, various jet waves can be formed in one jet tank.
（実施例〕
第１図はこの発明の一実施例を示す側断面図、第２図は
第１図の要部を拡大して示す側断面図、第３図は第２図
のＩ−Ｉ線による断面図である。(Example) Fig. 1 is a side sectional view showing an embodiment of the present invention, Fig. 2 is a side sectional view showing an enlarged main part of Fig. 1, and Fig. 3 is an I-I of Fig. 2. FIG.
これらの図において、１はプリント基板で、図示しない
搬送チェーンの保持爪に係合されて矢印Ａ方向に走行す
る。２は前記プリント基板１に接着剤等で仮装着された
チップ部品、３は噴流式はんだ槽の全体を示す。４はは
んだ槽本体、５ははんだ融液、５ａｔは凹凸波、５ａ２
はフローディップ式の平面状の噴流波、６は前記はんだ
融液５を加圧して強制的に環流させる羽根車、７は前記
羽根車６を回転させるモータで、羽根車６．モータ７に
よりはんだ融液５の加圧手段が構成される。In these figures, reference numeral 1 denotes a printed circuit board, which is engaged with a holding claw of a conveyor chain (not shown) and travels in the direction of arrow A. Reference numeral 2 indicates a chip component temporarily attached to the printed circuit board 1 with adhesive or the like, and reference numeral 3 indicates the entire jet-flow solder tank. 4 is the solder tank body, 5 is the solder melt, 5at is the uneven wave, 5a2
6 is a flow dip type planar jet wave; 6 is an impeller that pressurizes the solder melt 5 and forcibly circulates it; 7 is a motor that rotates the impeller 6; The motor 7 constitutes means for pressurizing the solder melt 5.
８は流動管、９は前記はんだ融液５が還流する還流口、
１ｏは前記流動管８の上部に設けた噴流槽、１１．１２
は前記噴流槽１０の上部に形成された第１の噴流口と第
２の噴流口で、プリント基板１の走査方向（矢印Ａ方向
）に対して順次配列されている。１３．１４は前記噴流
口１１．１２内に設けられ、噴流口１１．１２から噴出
するはんだ融液５の噴出量を調整するためにプリント基
板１の走行方向（矢印入方向）と直角方向に設けられた
円筒状の流量調整器で第４図の斜視図で示す。１５．１
６は前記流動管８からのはんだ融液５を流量調整器１３
．１４内に流入する流入口、１７．１８は前記流入口１
５．１６から流入した流量調整器１３．１４内のはんだ
融液５を流出する流出口で、流入口１５と流出口１７お
よび流入口１６と流出口１８とはいずれも流量調整器１
３．１４の軸心に対して対向位置（角度１８ｏ。8 is a flow tube; 9 is a reflux port through which the solder melt 5 flows back;
1o is a jet tank provided at the upper part of the flow pipe 8; 11.12
are a first jet port and a second jet port formed in the upper part of the jet tank 10, which are sequentially arranged in the scanning direction of the printed circuit board 1 (direction of arrow A). 13.14 is provided in the jet port 11.12, and is perpendicular to the running direction of the printed circuit board 1 (the direction of the arrow) in order to adjust the amount of the solder melt 5 jetted out from the jet port 11.12. A cylindrical flow regulator is provided, shown in perspective view in FIG. 15.1
6 is a flow rate regulator 13 for controlling the solder melt 5 from the flow tube 8.
．． 14, an inlet 17.18 is the inlet 1
5.16 is an outlet through which the solder melt 5 in the flow rate regulator 13.14 flows out, and both the inlet 15 and the outlet 17 and the inlet 16 and the outlet 18 are
3. Position opposite to the axis of 14 (angle 18o).
離れた位置）で、かつ流量調整器１３．１４の長手方向
に多数形成されている。１９．２０は前記流量調整器１
３．１４と一体に固着された釉で第１、第２の噴流口１
１．１２に回動可能に取り付けられている。２１．２２
は前記軸１９．２０に取り付けられ、流量調整器１３．
１４を回動してはんだ融液５の流量を調整せしめるため
のレバー、２３．２４は前記流量調整器１３．１４を所
定位置に固定せしめるための固定ねじ、２５゜２６は前
記流出口１７．１８から流出するはんだ融液５の一部ま
たは全部を遮へいして噴流口１１．１２から噴出する量
を調整せしめるため、噴流口１１．１２に固定した遮へ
い板、２７．２８は前記流出口１７．１８から流出した
はんだ融液５の流れを整流する整流板で、いずれも多数
の透孔２９．３０が形成されている。３１は前記凹凸波
５ａｌを形成する部材として第１の噴流口１１の上部に
設けた噴流体、３２は前記噴流体３１に形成された透孔
、３３．３４は前記噴流波５ａ２を形成する部材として
第２の噴流口１２の上部に設けた噴流板、３５は前記噴
流板３３の端部に設けた堰板である。A large number of flow rate regulators 13, 14 are formed at separate locations) in the longitudinal direction of the flow rate regulators 13, 14. 19.20 is the flow rate regulator 1
3. The first and second jet ports 1 are made of glaze that is integrally fixed with 14.
1.12 is rotatably attached. 21.22
is attached to said shaft 19.20 and includes a flow regulator 13.
14 is a lever for rotating to adjust the flow rate of the solder melt 5; 23.24 is a fixing screw for fixing the flow rate regulator 13.14 in a predetermined position; 25.26 is a lever for adjusting the flow rate of the solder melt 5; A shielding plate 27.28 is fixed to the jet port 11.12 in order to block part or all of the solder melt 5 flowing out from the jet port 11.12 and adjust the amount spouted from the jet port 11.12. .18, each of which has a large number of through holes 29 and 30 formed therein. 31 is a jet provided above the first jet port 11 as a member for forming the uneven waves 5al, 32 is a through hole formed in the jet 31, and 33.34 is a member for forming the jet waves 5a2. The jet plate 35 is a weir plate provided at the end of the jet plate 33.
上記のように構成された噴流式はんだ槽３においては、
はんだ融液５がモータ７、羽根車６からなる１台の加圧
手段で加圧され、流動管８を通って噴流槽１０内に入る
。次いで、はんだ融液５が流量調整器１３．１４の流入
口１５．１６から内部に流入し、流出口１７．１８から
流出する。そして流入口１５．１６と流出口１７．１８
が第２図に示す位置にあるときは、流出口１７．１８か
ら流出したはんだ融液５の全部が整流板２７゜２８の透
孔２９．３０を通って噴出する。ここで、第１の噴流口
１１から噴出したはんだ融液５は噴流体３１の透孔３２
から上部へ噴出して凹凸波５ａ＋を形成する。また、第
２の噴流口１２から噴出したはんだ融液５は噴流板３３
．３４と噴流板３４に堰板３５をによりフローディップ
式の平面状の噴流波５ａ２が形成される。In the jet solder bath 3 configured as described above,
Solder melt 5 is pressurized by one pressurizing means consisting of a motor 7 and an impeller 6, and enters a jet tank 10 through a flow pipe 8. The solder melt 5 then flows into the flow regulator 13.14 through the inlet 15.16 and out through the outlet 17.18. and inlet 15.16 and outlet 17.18
When is in the position shown in FIG. 2, all of the solder melt 5 flowing out from the outlet 17.18 is ejected through the through hole 29.30 of the current plate 27.28. Here, the solder melt 5 spouted from the first jet port 11 is transferred to the through hole 32 of the jet fluid 31.
The water is ejected upwards to form uneven waves 5a+. Further, the solder melt 5 spouted from the second jet port 12 is transferred to the jet plate 33.
．． 34 and the weir plate 35 on the jet plate 34, a flow dip type planar jet wave 5a2 is formed.
第５図（ａ）、（ｂ）、（Ｃ）は流量調整器１３により
はんだ融液５の噴流量を調整する動作を示す説明図であ
る。FIGS. 5A, 5B, and 5C are explanatory diagrams showing the operation of adjusting the jet flow rate of the solder melt 5 by the flow rate regulator 13.
第５図（ａ）においては、レバー２１を矢印Ｂ側へ倒す
と、流出口１７は遮へい板２５で遮へいされることがな
いので、はんだ融液５の全量が流通する。In FIG. 5(a), when the lever 21 is tilted toward the arrow B side, the outlet 17 is not blocked by the shielding plate 25, so that the entire amount of the solder melt 5 flows.
第５図（ｂ）においては、レバー２１を中央に立てるこ
とにより、流出口１７の一部が遮へい板２５に遮へいさ
れるので、はんだ融液５の一部が流通し噴流口１１から
の噴流量が減少する。In FIG. 5(b), by placing the lever 21 in the center, a part of the outflow port 17 is shielded by the shielding plate 25, so that a part of the solder melt 5 flows and the jet from the jet port 11 is blocked. Flow rate decreases.
第５図（Ｃ）は、レバー２１を矢印Ｃ側へ倒すと流出口
１７は遮へい板２５で遮へいされるので、はんだ融液５
が上方へ流れなくなり、噴流口１１からの噴出を停止さ
せることができる。FIG. 5(C) shows that when the lever 21 is tilted toward the arrow C side, the outflow port 17 is shielded by the shielding plate 25, so that the solder melt 5
will no longer flow upward, and the jet from the jet port 11 can be stopped.
また、流量調整器１３の流入口１５．流出口１７を第６
図（ａ）に示す位置からレバー２１を矢印Ｃ方向に回動
して、第６図（ｂ）に示す位置にしてもはんだ融液５の
噴出量を停止させることができる。In addition, the inlet 15 of the flow rate regulator 13. Outlet 17 is the sixth
The spouting amount of the solder melt 5 can also be stopped by rotating the lever 21 in the direction of arrow C from the position shown in FIG. 6(a) to the position shown in FIG. 6(b).
さらに、上記実施例においては、第１の噴流口１１、第
２の噴流口１２内のはんだ融液５の流量を調整するのに
円筒状の流量調整器１３．１４を使用したが、円筒状の
流量調整器１３．１４に代えて第７図に示すように弁の
作用をする板体状の流量調整器３６を軸１９に取り付け
てもはんだ融液５の流量を調整することができる。Furthermore, in the above embodiment, the cylindrical flow rate regulators 13 and 14 were used to adjust the flow rate of the solder melt 5 in the first jet port 11 and the second jet port 12. The flow rate of the solder melt 5 can also be adjusted by attaching a plate-shaped flow rate regulator 36 acting as a valve to the shaft 19, as shown in FIG. 7, in place of the flow rate regulators 13 and 14.
このように板体状の流量調整器３６が上下方向に位置し
ているときは、はんだ融液５の全量が流れ、レバー２１
を矢印Ｃ方向に回動させれば板体状の流量調整器３６は
二点鎖線に示す位置になってはんだ融液５の流出が停止
する。なお、第５図〜第７図においては第１の噴流口１
１について説明したが、第２の噴流口についても同様で
ある。When the plate-like flow rate regulator 36 is positioned in the vertical direction in this way, the entire amount of the solder melt 5 flows and the lever 21
When rotated in the direction of arrow C, the plate-like flow rate regulator 36 is at the position shown by the two-dot chain line, and the outflow of the solder melt 5 is stopped. In addition, in FIGS. 5 to 7, the first jet port 1
1 has been described, but the same applies to the second jet port.
このように、この発明の噴流式はんだ槽３においては、
モータ７、羽根車６からなる１台の加圧手段ではんだ融
液５を加圧して、かつ各流量調整器１３．１４を操作し
、かつ第１．第２の噴流口に種々の噴流体３１や噴流板
３３．３４を設けることによりそれぞれ異なった凹凸波
５ａ＋や、噴流波５ａ２を形成させることができる。さ
らに加圧手段が動作中であっても、いずれか一方のはん
だ融液５の噴出を停止させて凹凸波５ａ＋または噴流波
５ａｚのみを噴出させることができる。In this way, in the jet solder bath 3 of the present invention,
The solder melt 5 is pressurized by one pressurizing means consisting of a motor 7 and an impeller 6, and each flow rate regulator 13, 14 is operated, and the first. By providing various jet fluids 31 and jet plates 33, 34 at the second jet port, different uneven waves 5a+ and jet waves 5a2 can be formed. Furthermore, even if the pressurizing means is in operation, it is possible to stop ejecting either one of the solder melts 5 and eject only the uneven wave 5a+ or the jet wave 5az.
以上説明したようにこの発明は、噴流槽の上部にその長
手方向がプリント基板の走行方向と直角方向となるよう
に形成した第１の噴流口と第２の噴流口とをプリント基
板の走行方向に対して順次配列し、かつ第１の噴流口と
第２の噴流口から噴出するはんだ融液の量をそれぞれ調
整する各流量調整器を設け、さらに第１の噴流口または
第２の噴流口からはんだ融液を噴出し凹凸波を形成する
透孔を形成した噴流体またははんだ融液を噴出して噴流
波を形成する噴流板を第１の噴流口または第２の噴流口
のいずれかに設けたので、１槽のはんだ槽で２種類の噴
流波を形成させることができるため種々のプリント基板
のはんだ付けに利用することができ、各噴流口から噴流
するはんだ融液の量の調整と、いずれか一方の噴流口か
らのはんだ融液の噴出を停止させることが簡単な操作で
行うことができるとともに、はんだ槽の設備に要する経
費を節減できる利点を有する。As explained above, the present invention has a first jet port and a second jet port formed in the upper part of the jet tank so that the longitudinal direction thereof is perpendicular to the running direction of the printed circuit board. Flow rate regulators are arranged sequentially for adjusting the amount of solder melt spouted from the first jet port and the second jet port, respectively, and the flow rate regulators are arranged sequentially for each of the first jet port and the second jet port, respectively. A jet having through-holes formed therein for spouting solder melt to form uneven waves or a jet plate for spouting solder melt to form jet waves is placed in either the first jet port or the second jet port. Since two types of jet waves can be formed in one solder tank, it can be used for soldering various printed circuit boards, and the amount of solder melt jetted from each jet port can be adjusted. This has the advantage that the spouting of the solder melt from either one of the jet ports can be stopped with a simple operation, and the cost required for the equipment of the solder bath can be reduced.
第１図はこの発明の一実施例を示す側断面図、第２図は
第１図の要部を拡大して示す側断面図、第３図は第２図
のＩ−１線による断面図、第４図は第２図の流量調整器
を示す斜視図、第５図、第６図は流量調整器の動作を示
す説明図、第７図は流量調整器の他の例を示す説明図で
ある。
図中、１はプリント基板、２はチップ部品、３は噴流式
はんだ槽、４ははんだ槽本体、５ははんだ融液、５ａ＋
は凹凸波、５ａ２は噴流波、６は羽根車、７はモータ、
８は流動管、１０は噴流槽、１１は第１の噴流口、１２
は第２の噴流口、１３．１４は流量調整器、１５．１６
は流入口、１７．１８は流出口、１９．２０は軸、２１
．２２はレバー、２３．２４は固定ねじ、２５．２６は
遮へい板、３１は噴流体、３２は透孔、３３゜３４は噴
流体、３５は堰板である。
第１図Fig. 1 is a side sectional view showing an embodiment of the present invention, Fig. 2 is a side sectional view showing an enlarged main part of Fig. 1, and Fig. 3 is a sectional view taken along line I-1 in Fig. 2. , FIG. 4 is a perspective view showing the flow regulator of FIG. 2, FIGS. 5 and 6 are explanatory diagrams showing the operation of the flow regulator, and FIG. 7 is an explanatory diagram showing another example of the flow regulator. It is. In the figure, 1 is a printed circuit board, 2 is a chip component, 3 is a jet solder bath, 4 is a solder bath body, 5 is a solder melt, 5a+
is an uneven wave, 5a2 is a jet wave, 6 is an impeller, 7 is a motor,
8 is a flow pipe, 10 is a jet tank, 11 is a first jet port, 12
is the second jet port, 13.14 is the flow rate regulator, 15.16
is the inlet, 17.18 is the outlet, 19.20 is the shaft, 21
．． 22 is a lever, 23 and 24 are fixing screws, 25 and 26 are shielding plates, 31 is a jet fluid, 32 is a through hole, 33 degrees and 34 are jet fluids, and 35 is a weir plate. Figure 1
Claims (1)
行う噴流槽をはんだ槽本体内に備えた噴流式はんだ槽に
おいて、前記噴流槽の上部にその長手方向が前記プリン
ト基板の走行方向と直角方向となるように形成した第１
の噴流口と第２の噴流口とを前記プリント基板の走行方
向に対して順次配列し、かつ前記第１の噴流口と前記第
２の噴流口から噴出する前記はんだ融液の量をそれぞれ
調整する各流量調整器を設け、さらに前記第１の噴流口
または第２の噴流口から前記はんだ融液を噴出し凹凸波
を形成する透孔を形成した噴流体または前記はんだ融液
を噴出して噴流波を形成する噴流板を前記第１の噴流口
または第２の噴流口のいずれかに設けたことを特徴とす
る噴流式はんだ槽。In a jet type soldering tank having a jet tank in a solder tank body for spouting solder melt to solder a printed circuit board, there is provided an upper part of the jet tank with its longitudinal direction perpendicular to the running direction of the printed circuit board. The first one formed so that
The jet ports and the second jet ports are arranged in sequence with respect to the running direction of the printed circuit board, and the amounts of the solder melt spouted from the first jet ports and the second jet port are adjusted respectively. further comprising a flow rate regulator for spouting the solder melt from the first jet port or the second jet port, and spouting the jet fluid or the solder melt having through-holes forming uneven waves. 1. A jet-flow solder bath, characterized in that a jet plate for forming jet waves is provided at either the first jet port or the second jet port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2808487A JPS63199065A (en) | 1987-02-12 | 1987-02-12 | Jet solder tank |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2808487A JPS63199065A (en) | 1987-02-12 | 1987-02-12 | Jet solder tank |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63199065A true JPS63199065A (en) | 1988-08-17 |
Family
ID=12238915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2808487A Pending JPS63199065A (en) | 1987-02-12 | 1987-02-12 | Jet solder tank |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63199065A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453964U (en) * | 1987-09-30 | 1989-04-03 | ||
| JPH0267787A (en) * | 1988-09-02 | 1990-03-07 | Kenji Kondo | Soldering of printed-circuit board and its apparatus |
| US4981249A (en) * | 1988-08-31 | 1991-01-01 | Matsushita Electric Industrial Co., Ltd. | Automatic jet soldering apparatus |
| JPH0443459U (en) * | 1990-08-07 | 1992-04-13 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59110459A (en) * | 1982-12-17 | 1984-06-26 | Kenji Kondo | Jet type solder tank |
| JPS61137670A (en) * | 1984-12-11 | 1986-06-25 | Tamura Seisakusho Co Ltd | Jet type soldering device |
-
1987
- 1987-02-12 JP JP2808487A patent/JPS63199065A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59110459A (en) * | 1982-12-17 | 1984-06-26 | Kenji Kondo | Jet type solder tank |
| JPS61137670A (en) * | 1984-12-11 | 1986-06-25 | Tamura Seisakusho Co Ltd | Jet type soldering device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6453964U (en) * | 1987-09-30 | 1989-04-03 | ||
| US4981249A (en) * | 1988-08-31 | 1991-01-01 | Matsushita Electric Industrial Co., Ltd. | Automatic jet soldering apparatus |
| JPH0267787A (en) * | 1988-09-02 | 1990-03-07 | Kenji Kondo | Soldering of printed-circuit board and its apparatus |
| JPH0443459U (en) * | 1990-08-07 | 1992-04-13 |
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