JPH0513029B2 - - Google Patents
Info
- Publication number
- JPH0513029B2 JPH0513029B2 JP62081116A JP8111687A JPH0513029B2 JP H0513029 B2 JPH0513029 B2 JP H0513029B2 JP 62081116 A JP62081116 A JP 62081116A JP 8111687 A JP8111687 A JP 8111687A JP H0513029 B2 JPH0513029 B2 JP H0513029B2
- Authority
- JP
- Japan
- Prior art keywords
- jet
- tank
- printed circuit
- circuit board
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000679 solder Inorganic materials 0.000 claims description 65
- 239000012530 fluid Substances 0.000 claims description 33
- 238000005476 soldering Methods 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 8
- 230000000630 rising effect Effects 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000005192 partition Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、はんだ付けによつてプリント基板
に発生したはんだのブリツジ、つららまたははん
だかすにはんだ融液の噴流波を吹き付けて除去せ
しめるようにしたプリント基板のはんだ付け方法
およびその装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention is a method for removing solder bridges, icicles, or solder scum generated on a printed circuit board during soldering by spraying a jet wave of solder melt. The present invention relates to a printed circuit board soldering method and an apparatus therefor.
従来、電子部品を接着剤等で仮装着したプリン
ト基板にはんだ付けする場合、噴流槽から噴出す
るはんだ融液の噴流波の頂面にプリント基板の走
行方向に対し、交差する方向に凹凸波を形成し、
この凹凸波をプリント基板の走行方向に対して往
復移動せしめてプリント基板の電子部品間に発生
するフラツクスのガスや気泡を取り除いていた。
Conventionally, when electronic components are soldered to a printed circuit board that has been temporarily attached with adhesive, etc., uneven waves are formed on the top surface of the jet wave of the solder melt ejected from the jet tank in a direction that intersects with the running direction of the printed circuit board. form,
These uneven waves are moved back and forth in the running direction of the printed circuit board to remove flux gas and bubbles generated between the electronic components of the printed circuit board.
ところで、従来、上記のはんだ付け装置におい
ては、気泡を取り除くことができてもはんだ付け
によつてプリント基板に発生したはんだのブリツ
ジ、つらら、またははんだかすを十分に取り除く
ことができないという問題点があつた。
By the way, conventionally, the above-mentioned soldering equipment has a problem in that even if air bubbles can be removed, it is not possible to sufficiently remove solder bridges, icicles, or solder scum generated on printed circuit boards during soldering. It was hot.
この発明は、上記問題点を解決するためになさ
れたもので、はんだ付けによつて発生したプリン
ト基板のブリツジ、つららまたははんだかすを確
実に除去することができるプリント基板のはんだ
付け方法およびその装置を得ることを目的とす
る。 The present invention was made to solve the above-mentioned problems, and is a method and apparatus for soldering a printed circuit board that can reliably remove bridges, icicles, or solder scum generated on the printed circuit board during soldering. The purpose is to obtain.
この発明の第１の発明にかかるプリント基板の
はんだ付け方法は、電子部品を装着したプリント
基板の走行方向に対して順次配列した１次槽内と
２次槽内にそれぞれはんだ融液を収容したはんだ
槽を用い、１次槽において、プリント基板の走行
方向と交差する方向に対して往復移動する多数の
凹凸液が形成されたはんだ融液の噴流波によりプ
リント基板に１次のはんだ付けを行い、２次槽に
おいて、はんだ融液をプリント基板の走行方向と
反対方向に所定の上昇角度で、かつその長手方向
がプリント基板の走行方向と交差する方向に噴出
させて薄い板状の噴流波として２次のはんだ付け
を行うものである。
In the method for soldering a printed circuit board according to the first aspect of the present invention, a solder melt is stored in a primary tank and a secondary tank that are arranged sequentially in the running direction of a printed circuit board on which electronic components are mounted. Using a soldering bath, primary soldering is performed on a printed circuit board using a jet wave of solder melt in which a large number of concave and convex liquids are formed that move back and forth in a direction that intersects the running direction of the printed circuit board. In the secondary tank, the solder melt is jetted out at a predetermined rising angle in the opposite direction to the running direction of the printed circuit board, and in a direction whose longitudinal direction intersects with the running direction of the printed circuit board, so as to form a thin plate-shaped jet wave. This is for performing secondary soldering.
また、この発明の第２の発明にかかるプリント
基板のはんだ付け装置は、はんだ槽をプリント基
板の走行方向に対して順次配列した１次槽と２次
槽の２槽に形成し、１次槽内と２次槽内にそれぞ
れはんだ融液を収容し、これらのはんだ融液を羽
根車により加圧して強制的に還流させるため１次
槽に第１の噴流槽を、２次槽に第２の噴流槽を設
け、これらの噴流槽の上方にそれぞれ噴流口を設
け、かつ第１の噴流槽の噴流口からプリント基板
の走行方向と交差する方向に対し多数の凹凸波を
形成させる多数の透孔を形成した円柱状の噴流体
を噴流口に設け、また、噴流体をプリント基板の
走行方向と交差する方向に往復移動させる装置を
設け、さらに、回動の中心となる回動軸を有し、
この回動軸の長手方向がプリント基板の走行方向
と交差する方向で、その両端側が閉そくされた円
筒がその軸心方向に対して直角方向の断面が扇形
となるように形成されて２次槽内のはんだ融液を
噴出する噴流体を第２の噴流槽の噴流口に回動軸
を中心にして回動可能に設けたものである。 Further, in the printed circuit board soldering apparatus according to the second aspect of the present invention, the solder tank is formed into two tanks, a primary tank and a secondary tank, which are sequentially arranged in the running direction of the printed circuit board. Solder melt is stored in the inner and secondary tanks, and in order to pressurize the solder melt with an impeller and forcibly circulate it, a first jet tank is installed in the primary tank, and a second jet tank is installed in the secondary tank. A jet tank is provided, a jet port is provided above each of these jet tanks, and a large number of transparent waves are formed from the jet port of the first jet tank to form a large number of uneven waves in a direction intersecting the running direction of the printed circuit board. A cylindrical jet with a hole formed therein is provided at the jet opening, a device is provided for reciprocating the jet in a direction intersecting the running direction of the printed circuit board, and a rotating shaft is provided as the center of rotation. death,
The longitudinal direction of this rotating shaft is in the direction that intersects the running direction of the printed circuit board, and a cylinder whose both ends are closed is formed so that its cross section in the direction perpendicular to the axial direction is fan-shaped. A jet for spouting out the solder melt in the second jet tank is rotatably provided at the jet port of the second jet tank about a rotation axis.
また、この発明の第３の発明にかかるプリント
基板のはんだ付け装置は、２次槽内のはんだ融液
を噴出するスリツト状の透孔が、その長手方向に
形成された円筒形の噴流体を第２の噴流槽の噴流
口に回動可能に設けたものである。 Further, in the printed circuit board soldering apparatus according to the third aspect of the present invention, the slit-shaped through hole for spouting the solder melt in the secondary tank has a cylindrical jet formed in the longitudinal direction. It is rotatably provided at the jet port of the second jet tank.
この発明の第１の発明においては、はんだ付け
されたプリント基板に噴流波が吹き付けられるの
で、プリント基板に発生したブリツジ、つらら、
またははんだかすを融解して飛散させることによ
り取り除くことができる。
In the first aspect of the present invention, since jet waves are blown onto the soldered printed circuit board, bridges and icicles generated on the printed circuit board can be removed.
Alternatively, it can be removed by melting and scattering the solder residue.
また、この発明の第２の発明においては、噴流
波の厚みと噴流速度とをプリント基板に対応して
任意に変えることができる。 Further, in the second aspect of the present invention, the thickness of the jet wave and the speed of the jet wave can be arbitrarily changed depending on the printed circuit board.
また、この発明の第３の発明においては、噴流
波の角度をプリント基板に対応して任意に変える
ことができ、また、噴流波の厚みが薄く、噴流速
度の速い噴流波が得られる。 Further, in the third aspect of the present invention, the angle of the jet wave can be arbitrarily changed depending on the printed circuit board, and the jet wave has a thin thickness and a high jet velocity.
第１図ａ，ｂはこの発明の一実施例を示すもの
で、第１図ａは概略斜視図、第１図ｂは第１図ａ
の−線による拡大断面図、第２図ａ〜ｇは第
１図の要部を示したもので、第２図ａは第１図ａ
の第１の噴流槽の部分を示す拡大平面図、第２図
ｂ，ｃは第２図ａの−線、−線による断
面図、第２図ｄは第１図ａの第２の噴流槽の部分
を示す拡大平面図、第２図ｅは第２図ｄの回動軸
部分を拡大して示した断面図、第２図ｆは第２図
ｅの正面図、第２図ｇは第２図ｄ−による断
面図である。
1A and 1B show an embodiment of the present invention, FIG. 1A is a schematic perspective view, and FIG. 1B is a schematic perspective view of FIG. 1A.
Figures 2a to 2g show the main parts of Figure 1, and Figure 2a is an enlarged cross-sectional view taken along the - line.
FIG. 2b and c are cross-sectional views taken along lines - and - in FIG. 2a, and FIG. 2d is the second jet tank in FIG. 1a. 2e is an enlarged cross-sectional view of the rotating shaft portion of 2d, 2f is a front view of 2e, and 2g is an enlarged sectional view of the rotating shaft portion of 2d. FIG. 2 is a cross-sectional view according to FIG. 2 d-;
これらの図において、１はプリント基板で、図
示しないはんだ付け装置のキヤリアまたは搬送チ
エンの基板保持具に装着されている。２は前記プ
リント基板１に接着剤等で仮着された抵抗体また
はコンデンサ等の電子部品、３ははんだ槽で、２
槽式のものを示す。はんだ槽３は中央に設けた仕
切壁３ａにより２層に形成されている。４，５は
前記はんだ槽３の１次槽と２次槽で、プリント基
板１の走行方向（矢印Ａ方向）に対して順次配列
されている。６，７は前記１次槽４、２次槽５内
のはんだ融液で、２次槽５内のはんだ融液７の方
が１次槽４内のはんだ融液６よりも高温に保持さ
れている。８，９は前記１次槽４，２次槽５内に
設置された第１の噴流槽と第２の噴流槽で、モー
タ（図示せず）の駆動によりはんだ融液６，７を
加圧して強制的に噴流させせている。１０，１１
は前記各噴流槽８，９の噴流口である。１２は円
柱状の噴流体、１２ａは第２図ｂ，ｃに示すよう
に、前記噴流体１２の下部で長手方向に形成した
係合部で、噴流口１０の案内部１０ａに対して摺
動可能に係合されている。１３Ａ，１３Ｂはプリ
ント基板１の走行方向（矢印Ａ方向）と交差する
方向に配列され、所要の角度αで斜めに形成した
多数の透孔で、透孔１３Ａは一例として第２図ｂ
に示すように、上方に向つてプリント基板１の走
行方向（矢印Ａ方向）に対し前方に、これに対し
て透孔１３Ｂは第２図ｃに示すように後方に傾斜
し、かつ傾斜の方向を噴流体１２の長手方向に対
して交互にかつ等間隔で形成されている。１４は
前記噴流体１２をプリント基板１の走行方向（矢
印Ａ方向）と交差する方向（矢印Ｂ方向）に対し
て透孔１３Ａまたは１３Ｂの１ピツチｐの距離だ
け往復移動を繰り返す装置で、図示のものは一例
としてクランク装置を示してある。１５はロツド
で、一端が噴流体１２に連結されており、他端は
はずみ車１６に連結されている。１７は前記クラ
ンク装置１４における駆動用のモータである。な
お、クランク装置１４はプリント基板１の走行に
邪魔にならないように走行通路から外して設けら
れている。１８は前記噴流口１１に設けた噴流体
で、両端側が閉そくされた円筒をその軸心方向に
対して直角方向の断面が所要の大きさの扇形とな
るように形成したものである。１８Ａ，１８Ｂは
前記噴流体１８の第１噴流体と第２の噴流体とを
示す。１９，２０は前記各噴流体１８Ａ，１８Ｂ
の回動によつて種々の大きさに形成されるはんだ
融液７の流入口と流出口、２１は前記第１の噴流
体１８Ａの回動軸、２２は前記第２の噴流体１８
Ｂの回動軸で、各回動軸２１と２２とは共通の軸
心ｃを有し、この軸心ｃは噴流体１８Ａ，１８Ｂ
の回動の中心で、かつプリント基板１の走行方向
（矢印Ａ方向）と直角方向となるように設定され
ている。２３，２４は前記各回動軸２１と２２を
回動させるときに使用するスパナ等を係合させる
ための係合部、２５は前記はんだ融液７の溢流波
（後述）を形成させる場合の噴流板、２６は前記
はんだ融液７の溢流波を調整する堰板、２７は前
記堰板２６を固定するねじである。 In these figures, reference numeral 1 denotes a printed circuit board, which is mounted on a substrate holder of a carrier or conveyance chain of a soldering device (not shown). 2 is an electronic component such as a resistor or a capacitor temporarily attached to the printed circuit board 1 with adhesive or the like; 3 is a solder bath;
The tank type is shown. The solder bath 3 is formed into two layers with a partition wall 3a provided at the center. Reference numerals 4 and 5 denote a primary tank and a secondary tank of the solder tank 3, which are arranged in sequence in the running direction of the printed circuit board 1 (direction of arrow A). 6 and 7 are solder melts in the primary tank 4 and secondary tank 5, and the solder melt 7 in the secondary tank 5 is kept at a higher temperature than the solder melt 6 in the primary tank 4. ing. Reference numerals 8 and 9 denote a first jet tank and a second jet tank installed in the primary tank 4 and the secondary tank 5, in which the solder melts 6 and 7 are pressurized by driving a motor (not shown). The jet is forced to flow. 10,11
are jet ports of each of the jet tanks 8 and 9. Reference numeral 12 denotes a cylindrical jet; 12a, as shown in FIG. Possibly engaged. 13A and 13B are a large number of through holes arranged in a direction intersecting the running direction (direction of arrow A) of the printed circuit board 1 and formed obliquely at a required angle α, and the through hole 13A is shown in FIG.
As shown in FIG. 2c, the through hole 13B is inclined upward and forward with respect to the running direction (direction of arrow A) of the printed circuit board 1, whereas the through hole 13B is inclined backward as shown in FIG. are formed alternately and at equal intervals in the longitudinal direction of the jet fluid 12. Reference numeral 14 denotes a device that repeatedly moves the jet fluid 12 back and forth by a distance of one pitch p of the through hole 13A or 13B in a direction (arrow B direction) that intersects the traveling direction (arrow A direction) of the printed circuit board 1. A crank device is shown as an example. 15 is a rod, one end of which is connected to the jet fluid 12, and the other end connected to the flywheel 16. 17 is a motor for driving the crank device 14. Incidentally, the crank device 14 is provided apart from the travel path so as not to interfere with the travel of the printed circuit board 1. Reference numeral 18 denotes a jet fluid provided at the jet port 11, which is formed by forming a cylinder whose both ends are closed so that its cross section in the direction perpendicular to the axial direction is fan-shaped with a desired size. 18A and 18B indicate a first jet fluid and a second jet fluid of the jet fluid 18. 19 and 20 are the respective jet fluids 18A and 18B.
21 is the rotation axis of the first jet 18A, and 22 is the second jet 18.
In the rotation axis B, each rotation axis 21 and 22 has a common axis c, and this axis c is the rotation axis of the jet fluids 18A and 18B.
It is set so as to be at the center of rotation and perpendicular to the running direction of the printed circuit board 1 (direction of arrow A). Numerals 23 and 24 are engagement portions for engaging spanners or the like used when rotating the rotation shafts 21 and 22, and 25 is an engagement portion for forming an overflow wave (described later) of the solder melt 7. The jet plate 26 is a weir plate that adjusts the overflow wave of the solder melt 7, and 27 is a screw that fixes the weir plate 26.
次に、動作について説明する。 Next, the operation will be explained.
１次槽４内のはんだ融液６は図示しないモータ
の駆動により加圧され、第１の噴流槽８から噴流
口１０内を上昇して噴流体１２に達し、各透孔１
３Ａ，１３Ｂから斜め上方に勢いよく噴出してそ
れぞれプリント基板１の走行方向の前方と後方に
凹凸波６ａ，６ｂが形成される。同時にクラン装
置１４の往復駆動により噴流体１２が矢印Ｂ方向
に往復動作を繰り返すので、多数の凹凸波６ａ，
６ｂも矢印Ｂ方向に往復移動を繰り返す。 The solder melt 6 in the primary tank 4 is pressurized by the drive of a motor (not shown), rises from the first jet tank 8 through the jet port 10, reaches the jet fluid 12, and flows through each through hole 1.
3A and 13B forcefully eject diagonally upward, forming uneven waves 6a and 6b in the front and rear of the running direction of the printed circuit board 1, respectively. At the same time, the squirting fluid 12 repeats reciprocating motion in the direction of arrow B due to the reciprocating drive of the crank device 14, so that a large number of uneven waves 6a,
6b also repeats reciprocating movement in the direction of arrow B.
プリント基板１は、電子部品２を接着剤等で仮
付けした後、乾燥され、次にフラツクス処理され
てから予備加熱装置で予備加熱され、はんだ槽３
へ搬送される。はんだ槽３でプリント基板１は第
１図ｂに示すように、水平線に対して上昇角度θ1
で矢印Ａ方向に走行する。そしてプリント基板１
の走行方向（矢印Ａ方向）と交差して交互に移動
する多数の凹凸波６ａ，６ｂによりはんだ付けさ
れ、電子部品２の後方部分や、電子部品２が近接
して凹部となつている部分の気泡が取り除かれ
る。プリント基板１はさらに進んで２次槽５に達
し、はんだ融液７によりはんだ付けが行われる。 After the electronic components 2 are temporarily attached to the printed circuit board 1 using an adhesive or the like, the printed circuit board 1 is dried, then subjected to a flux treatment, and then preheated in a preheating device.
transported to. The printed circuit board 1 is placed in the solder bath 3 at an upward angle θ 1 with respect to the horizontal line, as shown in FIG. 1b.
and travel in the direction of arrow A. And printed circuit board 1
Soldering is performed by a large number of concave and convex waves 6a and 6b that alternately move across the running direction (direction of arrow A), and the rear part of the electronic component 2 and the part where the electronic component 2 is close to each other and have a concave part are soldered. Air bubbles are removed. The printed circuit board 1 further advances and reaches the secondary tank 5, where it is soldered using the solder melt 7.
２次槽５においては、はんだ融液７が図示しな
いモータの回転により加圧され、第２の噴流槽９
内に入り、第２図ｇに示すように、各噴流体１８
Ａ，１８Ｂによつて形成された流入口１９を通つ
てプリント基板１の走行方向（矢印Ａ方向）と逆
方向に噴流波７ａを噴出せしめるものである。な
お、各噴流体１８Ａ，１８Ｂに鋸歯状の吹き口を
設けることにより粗い噴流波７ａを噴出せしめる
こともできる。 In the secondary tank 5, the solder melt 7 is pressurized by the rotation of a motor (not shown), and is transferred to a second jet tank 9.
each jet 18 as shown in FIG. 2g.
A jet wave 7a is ejected in a direction opposite to the running direction of the printed circuit board 1 (direction of arrow A) through an inlet 19 formed by A and 18B. Incidentally, by providing each jet fluid 18A, 18B with a sawtooth-shaped blowing port, coarse jet waves 7a can be ejected.
このように、両噴流体１８Ａ，１８Ｂによつて
流出口２０が幅の狭い長孔状に形成されているの
で、噴流波７ａは厚みが薄く、板状に形成され、
かつ噴出する速度が速いため、１次槽４のはんだ
付けによつて発生したプリツジ、つららまたはは
んだかすをを融解し、飛散させて取り除くことが
できる。このため、品質の良いプリント基板１の
はんだ付けが得られる。 In this way, since the outlet 20 is formed in the shape of a narrow elongated hole by both jets 18A and 18B, the jet wave 7a is thin and formed in a plate shape.
In addition, since the spouting speed is fast, it is possible to melt, scatter, and remove the ridges, icicles, or solder scum generated by soldering in the primary tank 4. Therefore, high quality soldering of the printed circuit board 1 can be achieved.
第３図ａ〜ｂは第２図ａ〜ｃに示す噴流体１２
の他の形状を示すもので、第３図ａは平面図、第
３図ｂ，ｃ，ｄはそれぞれ第３図ａの−線、
−線、−線による断面図である。これら
の図において、第１図、第２図と同一符号は同一
部分を示し、３１Ａ，３１Ｂは前記噴流体１２の
上方の円周面から噴流口１０に向つて垂直にピツ
チｐで形成した多数の透孔で、透孔３１Ａの列と
透孔３１Ｂの列とは互いにＰ／２の長さ程度だけ
ずらして千鳥状に形成されている。そして、透孔
３１Ａは噴流体１２の軸心から半径方向に対して
鉛直に設定される鉛直中心線Ｃからプリント基板
１の走行方向の少し前方に、また、透孔３１Ｂは
前記鉛直中心線Ｃからプリント基板１の走行方向
（矢印Ａ方向）に対して後方の位置となるように
形成されている。 Figures 3a-b are the jet fluids 12 shown in Figures 2a-c.
Fig. 3a is a plan view, Fig. 3b, c, and d are the - lines of Fig. 3a, respectively.
- line, - line is sectional drawing. In these figures, the same reference numerals as in FIGS. 1 and 2 indicate the same parts, and 31A and 31B are a plurality of holes formed with a pitch p vertically from the upper circumferential surface of the jet 12 toward the jet port 10. The rows of the through holes 31A and the rows of the through holes 31B are formed in a staggered manner with a distance of about P/2 from each other. The through hole 31A is located slightly forward in the running direction of the printed circuit board 1 from the vertical center line C, which is set perpendicularly to the radial direction from the axis of the jet fluid 12, and the through hole 31B is located slightly forward of the vertical center line C, which is set perpendicularly to the radial direction from the axis of the jet fluid 12. It is formed so as to be located at a rear position with respect to the traveling direction of the printed circuit board 1 (direction of arrow A).
そして、図示しないモータの駆動により加圧さ
れ、各噴流槽８，９内に入る。１次槽４内のはん
だ融液６は、第１の噴流槽８から噴流口１０内に
上昇して噴流体１２に達し、各透孔３１Ａ，３１
Ｂから上方へ噴出してそれぞれプリント基板１の
走行方向の前方と後方に流れて噴流波６ｃ，６ｄ
を形成するとともに、多数の凹凸波６ｅ，６ｆが
形成される。そして、噴流波６ｃ，６ｄの頂面に
プリント基板１の走行方向（矢印Ａ方向）と交差
する方向に対して多数の凹凸波６ｅ，６ｆが千鳥
状に形成される。 Then, it is pressurized by the drive of a motor (not shown) and enters each of the jet tanks 8 and 9. The solder melt 6 in the primary tank 4 rises from the first jet tank 8 into the jet port 10, reaches the jet 12, and enters each through hole 31A, 31.
Jet waves 6c and 6d are ejected upward from B and flow forward and backward in the running direction of the printed circuit board 1, respectively.
, and a large number of uneven waves 6e and 6f are also formed. A large number of uneven waves 6e and 6f are formed on the top surfaces of the jet waves 6c and 6d in a staggered manner in a direction intersecting the running direction of the printed circuit board 1 (arrow A direction).
同時にクランク装置１４の往復駆動により噴流
体１２が矢印Ｂ方向に往復動作を繰り返すので、
多数の凹凸波６ｅ，６ｆも矢印Ｂ方向に往復移動
を繰り返す。 At the same time, the jet fluid 12 repeatedly moves back and forth in the direction of arrow B due to the reciprocating drive of the crank device 14.
The large number of uneven waves 6e and 6f also repeat reciprocating movement in the direction of arrow B.
第４図は第２図ｄ〜ｆに示す噴流体１８の他の
形状を示す側断面図で、第１図、第２図と同一符
号は同一部分を示し、４１は噴流槽、４２は噴流
口で、プリント基板１の走行方向（矢印Ａ方向）
と反対方向の部分が閉そくされている。４３は噴
流体で、その形状は第２図の第２の噴流体１８Ｂ
と同様である。４４は回動軸、４５は流出口で、
噴流波７ａを噴出してにる態様を示す。 FIG. 4 is a side sectional view showing another shape of the jet 18 shown in FIGS. 2 d to f, in which the same symbols as in FIGS. 1 and 2 indicate the same parts, 41 is a jet tank, and 42 is a jet In the direction of travel of the printed circuit board 1 (direction of arrow A)
The part in the opposite direction is blocked. 43 is a jet, and its shape is similar to the second jet 18B in FIG.
It is similar to 44 is the rotation axis, 45 is the outlet,
A mode in which a jet wave 7a is ejected is shown.
第５図は第２図ｄ〜ｆに示す噴流体１８のさら
に他の形状を示す側断面図で、第１図、第２図と
同一符号は同一部分を示し、５１は噴流槽、５２
は噴流口、５３は噴流体、５４は回動軸、５５は
流出口、５６は噴流板で、噴流体５３を回動し
て、噴流口５２を閉そくして噴流波７ａを噴出さ
せる態様を示す。 FIG. 5 is a side sectional view showing still another shape of the jet fluid 18 shown in FIGS. 2 d to f, in which the same reference numerals as in FIGS.
53 is a jet port, 53 is a jet fluid, 54 is a rotating shaft, 55 is an outlet port, and 56 is a jet plate, which rotates the jet fluid 53 to close the jet port 52 and emit jet waves 7a. show.
第６図ａ，ｂはこの発明の他の実施例を示すも
ので、第６図ａは側断面図、第６図ｂは第６図ａ
の一部破断平面図である。これらの図において、
６１は噴流槽、６２は前記噴流槽６１の噴流口、
６３は前記噴流口６２に設けた円筒形の噴流体、
６４は前記噴流体６３に形成された流入口で、噴
流槽６１内のはんだ融液７を流入する。６５は前
記流入したはんだ融液７を所要の上昇角度θ2で噴
流させるため、その長手方向がプリント基板１の
走行方向（矢印Ａ方向）と直角方向に形成したス
リツト状の透孔で、噴流波７ａをプリント基板１
の走行方向（矢印Ａ方向）と反対方向に噴出させ
る。６６は前記透孔６５から噴出した噴流波７ａ
を一時的に貯溜する貯溜槽。６７は前記貯溜槽６
６内のはんだ融液７を第１図に示す２次槽５内へ
還流する排出口、６８は前記噴流体６３の内部に
設けた内筒、６９は前記噴流体６３と内筒６８と
を一体に固定した側板、７０は前記側板６９に固
着した支軸で、噴流体６３を噴流槽６１に対して
回動可能に支承している。７１は前記噴流体６３
を回動して透孔６５を所定の位置で設定させるた
めのねじである。 6a and 6b show other embodiments of the present invention, FIG. 6a is a side sectional view, and FIG. 6b is a side sectional view of FIG. 6a.
FIG. In these figures,
61 is a jet tank, 62 is a jet port of the jet tank 61,
63 is a cylindrical jet provided at the jet port 62;
Reference numeral 64 denotes an inlet formed in the jet fluid 63, into which the solder melt 7 in the jet tank 61 flows. 65 is a slit-shaped through hole whose longitudinal direction is perpendicular to the direction of travel of the printed circuit board 1 (direction of arrow A) in order to jet the inflowing solder melt 7 at a required rising angle θ 2 . Wave 7a to printed circuit board 1
It is ejected in the opposite direction to the traveling direction (direction of arrow A). 66 is a jet wave 7a ejected from the through hole 65.
A storage tank that temporarily stores water. 67 is the storage tank 6
A discharge port through which the solder melt 7 in 6 flows back into the secondary tank 5 shown in FIG. The integrally fixed side plate 70 is a support shaft fixed to the side plate 69, and rotatably supports the jet fluid 63 relative to the jet tank 61. 71 is the jet fluid 63
This is a screw for rotating the through hole 65 to set the through hole 65 at a predetermined position.
上記のように構成されたはんだ付け装置におい
ては、はんだ融液７が図示しないモータの回転に
より加圧され、噴流槽６１の中に入り、噴流体６
３の流入口６４を経て噴流体６３と内筒６８との
間に入つて透孔６５から上昇角度θ2で噴出して噴
流波７ａを形成し、プリント基板１へ吹き付けて
電子部品２のはんだ付けが行われる。次いで、は
んだ付けを終了した噴流波７ａは貯溜槽６６内に
落下し、一時的に貯溜される。貯溜されたはんだ
融液７は排出口６７から２次槽５内に入る。 In the soldering apparatus configured as described above, the solder melt 7 is pressurized by the rotation of a motor (not shown), enters the jet tank 61, and the jet fluid 6
3 enters between the jet 63 and the inner cylinder 68 through the inlet 64 and is jetted out from the through hole 65 at an ascending angle θ 2 to form a jet wave 7a, which is sprayed onto the printed circuit board 1 to solder the electronic component 2. Attachment is performed. Next, the jet wave 7a that has finished soldering falls into the storage tank 66 and is temporarily stored therein. The stored solder melt 7 enters the secondary tank 5 through the discharge port 67.
なお、噴流波７ａが噴流する上昇角度θ2を変え
るときは、ねじ７１をゆるめ、噴流体６３を内周
方向に所定の位置まで回動させた後、ねじ７１を
締め付けて噴流体６３を固定する。 Note that when changing the rising angle θ 2 at which the jet wave 7a flows, loosen the screw 71, rotate the jet 63 in the inner circumferential direction to a predetermined position, and then tighten the screw 71 to fix the jet 63. do.
第７図は第２図ｄ〜ｆに示す各噴流体１８Ａ，
１８Ｂを回動して噴流板２５上にはんだ融液７の
溢流波７ｂを形成した場合を示す側面図で、リー
ド線を有する電子部品２ａを装着したプリント基
板１のはんだ付けを行うフローデイツプ式のはん
だ付け装置としても使用できる。 FIG. 7 shows each jet fluid 18A shown in FIG. 2 d to f,
18B is a side view showing the case where an overflow wave 7b of the solder melt 7 is formed on the jet plate 25 by rotating the flow dip type soldering method for soldering a printed circuit board 1 on which an electronic component 2a having a lead wire is attached. It can also be used as a soldering device.
第７図において、はんだ融液７は噴流板２５上
に噴出し貯留され、リード線を有する電子部品２
ａを装着したプリント基板１のフローデイツプ式
の溢流波７ｂが形成される。溢れ出たはんだ融液
７は、２次槽５内に入る。 In FIG. 7, a solder melt 7 is ejected and stored on a jet plate 25, and an electronic component 2 having a lead wire is
A flow-dip type overflow wave 7b of the printed circuit board 1 mounted with the circuit board 1a is formed. The overflowing solder melt 7 enters the secondary tank 5.
以上説明したようにこの発明の第１の発明は、
電子部品を装着したプリント基板の走行方向に対
して順次配列した１次槽内と２次槽内にそれぞれ
はんだ融液を収容したはんだ槽を用い、１次槽に
おいて、プリント基板の走行方向と交差する方向
に対して往復移動する多数の凹凸波が形成された
はんだ融液の噴流波によりプリント基板に１次の
はんだ付けを行い、２次槽において、はんだ融液
をプリント基板の走行方向と反対方向に所定の上
昇角度で、かつその長手方向がプリント基板の走
行方向と交差する方向に噴出させて薄い板状の噴
流波として２次のはんだ付けを行うので、１次の
はんだ付けによつてプリント基板に発生したプリ
ツジ、つららまたははんだかすを確実に取り除く
ことができ、品質の良いプリント基板のはんだ付
けが得られる利点がある。
As explained above, the first invention of this invention is
A primary tank and a secondary tank each containing solder melt are arranged sequentially with respect to the running direction of the printed circuit board on which electronic components are mounted. Primary soldering is performed on the printed circuit board using a jet wave of the solder melt, which has many uneven waves that move back and forth in the direction of travel. Since secondary soldering is performed as a thin plate-shaped jet wave by ejecting it at a predetermined rising angle in the direction in which the longitudinal direction intersects the running direction of the printed circuit board, secondary soldering is performed by This method has the advantage that it is possible to reliably remove prickles, icicles, or solder scum generated on printed circuit boards, resulting in high-quality soldering of printed circuit boards.
また、この発明の第２の発明は、はんだ槽をプ
リント基板の走行方向に対して順次配列した１次
槽と２次槽の２槽に形成し、１次槽内と２次槽内
にそれぞれはんだ融液を収容し、これらのはんだ
融液を羽根車により加圧して強制的に還流させる
ため１次槽に第１の噴流槽を、２次槽に第２の噴
流槽を設け、これらの噴流槽の上方にそれぞれ噴
流口を設け、かつ第１の噴流槽の噴流口からプリ
ント基板の走行方向と交差する方向に対し多数の
凹凸波を形成させる多数の透孔を形成した円柱状
の噴流体を噴流口に設け、また、噴流体をプリン
ト基板の走行方向と交差する方行に往復移動させ
る装置を設け、両端側が閉そくされた円筒がその
軸心方向に対して直角方向の断面が扇形となるよ
うに形成され２次槽内のはんだ融液を噴出する噴
流体を第２の噴流槽の噴流口に回動可能に設けた
ので、噴流波の厚みと量と噴流速度とを任意に設
定でき、種々のプリント基板に対応できるため、
生産性の向上を図ることができる利点を有する。 In addition, the second aspect of the present invention is to form the solder bath into two tanks, a primary tank and a secondary tank, which are arranged sequentially in the running direction of the printed circuit board, and the solder tank is formed into two tanks, a primary tank and a secondary tank, respectively. A first jet tank is provided in the primary tank, and a second jet tank is installed in the secondary tank to accommodate the solder melt and pressurize the solder melt with an impeller to forcefully circulate the solder melt. A cylindrical jet stream with a jet port provided above each jet tank and a large number of through holes that form a large number of uneven waves in a direction intersecting the running direction of the printed circuit board from the jet port of the first jet tank. A body is provided at the jet port, and a device is provided for reciprocating the jet fluid in a direction intersecting the running direction of the printed circuit board. Since the jet which spews out the solder melt in the secondary tank is rotatably provided at the jet port of the second jet tank, the thickness and amount of the jet wave and the jet velocity can be adjusted arbitrarily. configurable and compatible with various printed circuit boards,
This has the advantage of improving productivity.
さらに、この発明の第３の発明は、２次槽内の
はんだ融液を噴出するスリツト状の透孔が、その
長手方向に形成された円筒形の噴流体を第２の噴
流槽の噴流口に回動可能に設けたので、噴流波が
噴出する上昇角度をプリント基板の種類に対応し
任意に設定でき、噴流波の厚みが薄く噴流速度が
速いため、１次のはんだ付けによつてプリント基
板に発生したプリツジ、つらら、またははんだか
すを確実に取り除くことができ、品質の良いプリ
ント基板が得られる利点を有する。 Furthermore, the third aspect of the present invention is such that the slit-shaped through hole that spouts out the solder melt in the secondary tank directs the cylindrical jet formed in the longitudinal direction to the jet port of the second jet tank. Since the jet wave is rotatable, the rising angle at which the jet wave is ejected can be set arbitrarily depending on the type of printed circuit board.Since the jet wave is thin and the jet speed is fast, it can be easily printed by the first soldering. This method has the advantage of being able to reliably remove prickles, icicles, or solder scum generated on the board, resulting in a high-quality printed board.
第１図ａ，ｂはこの発明の一実施例を示すもの
で、第１図ａは概略斜視図、第１図ｂは第１図ａ
の−線による拡大断面図、第２図ａ〜ｇは第
１図の要部を示したもので、第２図ａは第１図ａ
の第１の噴流槽の部分を示す拡大平面図、第２図
ｂ，ｃは第２図ａの−線、−線による断
面図、第２図ｄは第１図ａの第２の噴流槽の部分
を示す拡大平面図、第２図ｅは第２図ｄの回動軸
部分を拡大して示した断面図、第２図ｆは第２図
ｅの正面図、第２図ｇは第２図ｄの−線によ
る断面図、第３図ａ〜ｄは第２図ａ〜ｃに示す噴
流体の他の形状を示すもので、第３図ａは平面
図、第３図ｂ，ｃ，ｄはそれぞれ第３図ａの−
線、−線、−線による断面図、第４図
は第２図ｄ〜ｆに示す噴流体の他の形状を示す側
断面図、第５図は第２図ｄ〜ｆに示す噴流体のさ
らに他の形状を示す側断面図、第６図ａ，ｂはこ
の発明の他の実施例を示すもので、第６図ａは側
断面図、第６図ｂは第６図ａの一部破断平面図、
第７図は第２図ｄ〜ｆに示す噴流体を回動してフ
ローデイツプ式のはんだ付け装置として使用した
場合を示す側面図である。
図中、１はプリント基板、２は電子部品、３は
はんだ槽、３ａは仕切壁、４は１次槽、５は２次
槽、６，７ははんだ融液、６ａ，６ｂは凹凸波、
７ａは噴流波、８は第１の噴流槽、９は第２の噴
流槽、１０，１１は噴流口、１２は噴流体、１３
Ａ，１３Ｂは透孔、１４はクランク装置、１８は
噴流体、１８Ａは第１の噴流体、１８Ｂは第２の
噴流体、１９は流入口、２０は流出口、２１，２
２は回動軸である。
1A and 1B show an embodiment of the present invention, FIG. 1A is a schematic perspective view, and FIG. 1B is a schematic perspective view of FIG. 1A.
Figures 2a to 2g show the main parts of Figure 1, and Figure 2a is an enlarged cross-sectional view taken along the - line.
FIG. 2b and c are cross-sectional views taken along lines - and - in FIG. 2a, and FIG. 2d is the second jet tank in FIG. 1a. 2e is an enlarged cross-sectional view of the rotating shaft portion of 2d, 2f is a front view of 2e, and 2g is an enlarged sectional view of the rotating shaft portion of 2d. 2d is a sectional view taken along the - line, and FIGS. 3a to 3d show other shapes of the jet fluid shown in FIGS. 2a to c. FIG. 3a is a plan view, and FIGS. , d are - in Fig. 3a, respectively.
4 is a side sectional view showing another shape of the jet shown in FIGS. 2 d to f, and FIG. 5 is a side sectional view of the jet shown in FIGS. Figures 6a and 6b are side sectional views showing other shapes, and Figure 6a is a side sectional view, and Figure 6b is a part of Figure 6a. Broken plan view,
FIG. 7 is a side view showing a case where the jet fluid shown in FIGS. 2d to 2f is rotated and used as a flow dip type soldering device. In the figure, 1 is a printed circuit board, 2 is an electronic component, 3 is a solder tank, 3a is a partition wall, 4 is a primary tank, 5 is a secondary tank, 6 and 7 are solder melt, 6a and 6b are uneven waves,
7a is a jet wave, 8 is a first jet tank, 9 is a second jet tank, 10 and 11 are jet ports, 12 is a jet fluid, 13
A, 13B are through holes, 14 is a crank device, 18 is a jet fluid, 18A is a first jet fluid, 18B is a second jet fluid, 19 is an inlet, 20 is an outlet, 21, 2
2 is a rotation axis.
Claims (1)
に対して順次配列した１次槽内と２次槽内にそれ
ぞれはんだ融液を収納したはんだ槽を用い、前記
１次槽において、前記プリント基板の走行方向と
交差する方向に対して往復移動する多数の凹凸波
が形成されたはんだ融液の噴流波により前記プリ
ント基板に１次のはんだ付けを行い、前記２次槽
において、はんだ融液を前記プリント基板の走行
方向と反対方向に所定の角度で、かつその長手方
向が前記プリント基板の走行方向と交差する方向
に噴出させて薄い板状の噴流波として２次のはん
だ付けを行うことを特徴とするプリント基板のは
んだ付け方法。 ２ はんだ槽をプリント基板の走行方向に対して
順次配列した１次槽と２次槽の２槽に形成し、前
記１次槽内と２次槽内にそれぞれはんだ融液を収
容し、これらのはんだ融液を羽根車により加圧し
て強制的に還流させるため前記１次槽に第１の噴
流槽を、前記２次槽に第２の噴流槽を設け、これ
らの噴流槽の上方にそれぞれプリント基板の走行
方向と交差する方向に噴流口を設け、前記プリン
ト基板の走行方向と交差する方向に対し多数の凹
凸波を形成させる多数の透孔を形成した円柱状の
噴流体を前記第１の噴流槽の噴流口に設け、前記
噴流体を前記プリント基板の走行方向と交差する
方向に往復移動させる装置を設け、さらに、両端
側が閉そくされた円筒がその軸心方向に対して直
角方向の断面が扇形となるように形成され前記２
次槽内の前記はんだ融液を噴出する噴流体を前記
第２の噴流槽の噴流口に回動可能に設けたことを
特徴とするプリント基板のはんだ付け装置。 ３ はんだ槽をプリント基板の走行方向に対して
順次配列した１次槽と２次槽の２槽に形成し、前
記１次槽内と２次槽内にそれぞれはんだ融液を収
容し、これらのはんだ融液を羽根車により加圧し
て強制的に還流させるため前記１次槽に第１の噴
流槽を、前記２次槽に第２の噴流槽を設け、これ
らの噴流槽の上方にそれぞれプリント基板の走行
方向と交差する方向に噴流口を設け、前記プリン
ト基板の走行方向と交差する方向に対し多数の凹
凸波を形成させる多数の透孔を形成した円柱状の
噴流体を前記第１の噴流槽の噴流口に設け、前記
噴流体を前記プリント基板の走行方向と交差する
方向に往復移動させる装置を設け、さらに、前記
２次槽内の前記はんだ融液を噴出するスリツト状
の透孔がその長手方向に形成された円筒形の噴流
体を前記第２の噴流槽の噴流口に回動可能に設け
たことを特徴とするプリント基板のはんだ付け装
置。[Scope of Claims] 1. Using a solder tank in which melted solder is stored in a primary tank and a secondary tank that are arranged sequentially in the running direction of a printed circuit board on which electronic components are mounted, in the primary tank, , primary soldering is performed on the printed circuit board using jet waves of solder melt in which a large number of uneven waves are formed that move back and forth in a direction intersecting the running direction of the printed circuit board, and in the secondary tank, Secondary soldering is performed by ejecting the solder melt at a predetermined angle in a direction opposite to the running direction of the printed circuit board and in a direction whose longitudinal direction intersects with the running direction of the printed circuit board as a thin plate-shaped jet wave. A printed circuit board soldering method characterized by performing the following steps. 2 The solder baths are formed into two tanks, a primary tank and a secondary tank, which are arranged sequentially in the running direction of the printed circuit board, and the solder melt is stored in the primary tank and the secondary tank, respectively. A first jet tank is provided in the primary tank and a second jet tank is provided in the secondary tank in order to pressurize the solder melt with an impeller and force it to flow back. A cylindrical jet having a jet opening in a direction intersecting the running direction of the printed circuit board and having a large number of through holes forming a large number of uneven waves in the direction intersecting the running direction of the printed circuit board is applied to the first A device is provided at the jet port of the jet tank to reciprocate the jet fluid in a direction intersecting the running direction of the printed circuit board, and further, a cylinder whose both ends are closed has a cross section perpendicular to its axial direction. is formed so that it is fan-shaped, and the above-mentioned 2
A printed circuit board soldering apparatus, characterized in that a jet for spouting out the solder melt in a second tank is rotatably provided at a jet port of the second jet tank. 3 The solder baths are formed into two tanks, a primary tank and a secondary tank, which are arranged sequentially in the running direction of the printed circuit board, and the solder melt is stored in the primary tank and the secondary tank, respectively. A first jet tank is provided in the primary tank and a second jet tank is provided in the secondary tank in order to pressurize the solder melt with an impeller and force it to flow back. A cylindrical jet having a jet opening in a direction intersecting the running direction of the printed circuit board and having a large number of through holes forming a large number of uneven waves in the direction intersecting the running direction of the printed circuit board is applied to the first A device is provided at the jet port of the jet tank to reciprocate the jet fluid in a direction intersecting the running direction of the printed circuit board, and further includes a slit-shaped through hole through which the solder melt in the secondary tank is spouted. 1. A printed circuit board soldering apparatus, characterized in that a cylindrical jet formed in the longitudinal direction is rotatably provided at the jet port of the second jet tank.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62081116A JPS63248566A (en) | 1987-04-03 | 1987-04-03 | Method and device for soldering printed circuit board |
| KR1019870012444A KR920008948B1 (en) | 1987-02-12 | 1987-11-05 | Soldering apparatus |
| DE8787310891T DE3785663T2 (en) | 1987-02-12 | 1987-12-10 | LOETGERAET. |
| EP87310891A EP0278166B1 (en) | 1987-02-12 | 1987-12-10 | Soldering apparatus |
| US07/133,087 US4848642A (en) | 1987-02-12 | 1987-12-15 | Soldering apparatus |
| CN 88100905 CN1013017B (en) | 1987-02-12 | 1988-02-11 | Soldering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62081116A JPS63248566A (en) | 1987-04-03 | 1987-04-03 | Method and device for soldering printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63248566A JPS63248566A (en) | 1988-10-14 |
| JPH0513029B2 true JPH0513029B2 (en) | 1993-02-19 |
Family
ID=13737409
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62081116A Granted JPS63248566A (en) | 1987-02-12 | 1987-04-03 | Method and device for soldering printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63248566A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007098450A (en) * | 2005-10-06 | 2007-04-19 | Toshiba Tec Corp | Soldering method |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0771741B2 (en) * | 1990-12-27 | 1995-08-02 | 株式会社ピーエフユー | Soldering equipment |
| JP3306468B2 (en) * | 1997-10-30 | 2002-07-24 | セレスティカ・ジャパン・イーエムエス株式会社 | Automatic soldering mechanism, apparatus using the mechanism, and soldering method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59153570A (en) * | 1983-02-22 | 1984-09-01 | Kenji Kondo | Solder tank |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH028602Y2 (en) * | 1984-11-30 | 1990-03-01 |
-
1987
- 1987-04-03 JP JP62081116A patent/JPS63248566A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59153570A (en) * | 1983-02-22 | 1984-09-01 | Kenji Kondo | Solder tank |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007098450A (en) * | 2005-10-06 | 2007-04-19 | Toshiba Tec Corp | Soldering method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63248566A (en) | 1988-10-14 |
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