JP2803663B2 - Nozzle structure of automatic soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an automatic soldering apparatus for assembling chip components on a printed circuit board, and more specifically, to an unsoldered small chip mounted on a printed circuit board after performing automatic soldering. The present invention relates to a nozzle structure of an automatic soldering apparatus that can prevent defects and prevent a nozzle hole from being caught.

[0002]

2. Description of the Related Art Generally, the steps of an automatic soldering apparatus for assembling chip components on a printed circuit board will be described with reference to FIG.

After bonding the components of the chip 34 so that the leads of the components of the chip 34 are located on the lands of the pattern formed on the printed circuit board 32, the printed circuit board 3
After drying at a high temperature of 150 ° C. or more for 90 seconds so as to adhere with 2, the flux is foamed in the flux foaming tank 36 of the accelerator at the portion to be soldered. After that, 1
After being preheated to 00 ° C. and dried, the printed circuit board 32 is mounted with the components of the chip 34 attached to the printed circuit board 32.
The lead is attached to the land at about 240 ° C. ± 5 ° C. while passing through the primary nozzle 40a and the secondary nozzle 40b installed in the lead tank 40, and the components of the chip 34 are automatically soldered to the printed circuit board 32.

[0004] Details of the configuration and operation of the nozzle relating to the present invention in the automatic soldering apparatus operating as described above will be described later. That is, in the automatic soldering apparatus shown in FIG. 2, the primary nozzle or the secondary nozzle is different from the present invention and the conventional technique, and the other components are the same.
Therefore, a primary nozzle in the related art will be described below as an example.

FIG. 5 is a perspective view showing the structure of a primary nozzle 50 according to the prior art. Lead bath 40 of automatic soldering equipment
In order to solder the components of the chip 34 to the printed circuit board 32, a number of holes 52 are vertically formed at the upper end of the primary nozzle 50 installed in the It is formed at intervals of 2 mm in the direction and the lateral direction. Each of the holes 22 has a diameter of 3 mm, and a large number of holes 22 formed at both ends around the central axis of the primary nozzle 20 are formed obliquely at 15 degrees toward the center.

[0006] The primary nozzle configured as above is shown in FIG.
When the printed circuit board 32 moves along the conveyor 30 and is positioned in the lead tank 40 as shown in FIG. 7, the primary nozzle 50 has a chip mounted on the printed circuit board 32 in a manner in which lead rises upward in a convex shape. Solder 34 parts.

[0007]

However, in such a primary nozzle 50, the components of the chip 34 are automatically soldered to the printed circuit board 32 in such a manner that lead rises upward in a convex shape. However, there is a problem that unsoldering failure of the components of the small chip 34 attached to the pattern surface occurs. In addition, since the solder portion varies depending on the thickness of the component of the chip 34, there is a problem that the component of the chip 34 may fall off the printed circuit board 32. Further, since the number of holes 52 formed at the upper end of the primary nozzle 50 is 3 mm, the number of holes 52 is large.
After the lead is jetted into the center of the chip 34, it flows to both sides, and the front part of the component of the chip 34 is desirably soldered. . In addition, only a part of the lead flowing out through the large number of holes 52 formed at the upper end of the primary nozzle 50 has the chip 34 soldered to the printed circuit board 32, and the rest flows to the center of the primary nozzle 50. There is also a problem that a large number of holes 52 can be used well because they come together.

The present invention solves the above-mentioned problems of the prior art, and improves the shape of a nozzle for soldering a chip component to a printed circuit board, thereby improving the quality of soldering. Is to provide.

Another object of the present invention is to provide a nozzle structure of an automatic soldering apparatus which can prevent a hole formed in an upper end portion of a primary nozzle from being caught by lead.

It is still another object of the present invention to provide a nozzle structure of an automatic soldering apparatus which can prevent unsoldering of small chips by a vortex jet method.

It is a further object of the present invention to provide a nozzle structure of an automatic soldering apparatus capable of performing precise soldering regardless of the size and shape of a chip component.

Another object of the present invention is to provide a nozzle structure of an automatic soldering apparatus capable of improving the quality of soldering and the quality of a product.

Another object of the present invention is to provide a primary nozzle vortex flow of an automatic soldering apparatus which can prevent the adhesion of lead and foreign matter during a lead jet by applying a coating process to the primary nozzle with Teflon (registered trademark). An object of the present invention is to provide a jet device.

[0014]

According to the present invention, there is provided an automatic soldering apparatus for assembling chip components on a printed circuit board, wherein the lead provided in a lead tank of the automatic soldering apparatus is provided. A large number of holes formed in a wave shape so that the height of the jet flow of lead is formed in an embossing shape at the upper end of the nozzle to be jetted to prevent unsoldering of chip components, and the phenomenon that the holes are caught by lead Grooves are formed to prevent lead, and lead is loosened upward in each hole.
The bottom is rounded so that it is jetted while maintaining the kana curve
Has been processed. Also, according to the present invention, printing
Automatic soldering equipment that assembles chip components on circuit boards,
Jet this lead provided in the lead bath of the automatic soldering machine
Prevent unsoldering of chip components at the upper end of the nozzle
The lead jet wave height is formed in embossing shape to stop
Many holes formed in a corrugated form
A groove is formed to prevent frog phenomena.
One-third of each hole is formed so as to overlap.

Further, according to the present invention, there is provided an automatic soldering apparatus for assembling chip components on a printed circuit board, in order to prevent unsoldering failure of a chip at the upper end of a nozzle provided in a lead bath of the automatic soldering apparatus. A number of holes are formed in a waveform so that the height of the jet flow of lead is formed in an embossing shape, and a groove is formed in the left and right direction around the center axis to prevent a phenomenon that each hole is caught by lead. Teflon (registered trademark) over the entire nozzle to prevent foreign matter
The coating process is performed, each of the holes by,
Lead is jetted while maintaining a gentle upward curve
So that the bottom is rounded. Again
According to Ming, automatic assembly of chip components on printed circuit boards
Soldering equipment was installed in the lead bath of the automatic soldering equipment
At the top of the nozzle, prevent unsoldering of the chip
The height of the lead jet is embossed
A large number of holes are formed in a corrugation, and lead
Grooves around the central axis to prevent
Is formed in the left-right direction, and 1 /
3 is formed so as to overlap, and lead and foreign substances are not attached.
The entire nozzle is coated with Teflon (registered trademark)
Has been processed.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the nozzle structure of the automatic soldering apparatus according to the present invention will be described below in detail with reference to the accompanying drawings.

The nozzle structure of the automatic soldering apparatus according to the present invention is, for example, a lead tank 40 of the automatic soldering apparatus shown in FIG.
This applies to the primary nozzle installed in FIG. 1 is a perspective view showing an embodiment when the nozzle structure of the automatic soldering apparatus according to the present invention is applied to a primary nozzle 10.

As shown in FIG. 1, the upper end of the primary nozzle 10 has a rectangular shape. When the components of the chip 34 are soldered to the printed circuit board 32, the upper end of the primary nozzle 10 is not soldered. It has a structure to prevent defects. Specifically, when the tip 34 is transported in the direction of the arrow C, the lead jet wave height is formed in an embossing shape. While maintaining, it is formed in a wave shape, that is, a zigzag.

The lower surface (bottom surface) is rounded as shown in the sectional view of the hole 12 in FIG. 3 so that lead is jetted into each hole 12 while maintaining a gentle curve in the upper direction. Is being processed. Each of these many holes 12 is formed with a diameter of 4 mm. Further, FIG.
As shown in FIG. 2, the corrugated adjacent holes 12 have a first interval “A” in the short direction of the nozzle (an interval from the center of the adjacent holes 12 to the center) of 5 mm and a first interval “A” in the longitudinal direction. 2
(The distance between the centers of adjacent holes 12) is maintained at 8 mm.

A groove 1 is formed in the center of the primary nozzle 10 to prevent a phenomenon in which lead flows and many holes 12 are caught when the chip 34 is soldered to the printed circuit board 32.
4 are formed in the left-right direction about the central axis in the longitudinal direction. The groove 14 has a width of 3 mm and a depth of 2 mm, and both side surfaces are formed so as to overlap a part of each hole 12, that is, about ３ in the left-right direction.

Further, when the chip 34 is soldered to the printed circuit board 32, the entirety of the primary nozzle 10 is made of Teflon (registered trademark) so that lead and foreign matter do not adhere to the surface of the primary nozzle 10. A coating process has been applied.

Next, the operation and effect of the present embodiment configured as described above will be described as follows.
As shown in FIG. 2, when the printed circuit board 32 moves along the conveyor and is located in the lead tank 40, the number of holes 12 using the vortex jet method of the primary nozzle 10 causes the printed circuit board 32 to move.
Lead in the lead tank 40 is jetted upward through the primary nozzle 10 to form an embossing shape, and the components of the chip 34 of the printed circuit board 32 are soldered.

At this time, the lead flowing out from the large number of holes 12 solders the chip 34 to the printed circuit board 32 and, at the same time, flows into the groove 14 to further completely solder the chip 34 to the printed circuit board 32.

In this embodiment, as shown in FIG. 1, the primary nozzle 10 having two rows of holes 12 is shown. However, the present invention is not particularly limited to two rows, and three or more rows are provided. It may be. FIG. 4 shows a case in which the holes 12 are arranged in three rows. Even in this case, the lead in the lead tank 40 is jetted upward through the primary nozzle 10 by a large number of holes 12 to form an embossing shape and print. The components of the chip 34 of the circuit board 32 are soldered. Further, in the present embodiment, the present invention is applied to the primary nozzle, but the present invention is also applicable to the secondary nozzle provided in the lead tank 40.

[0025]

As described above, in the nozzle structure of the automatic soldering apparatus according to the present invention, when soldering a chip component to a printed circuit board, a large number of holes are formed at the upper end of the nozzle in a waveform. A groove is formed in the left-right direction so that a part of the hole overlaps. This prevents unsoldering of the chip when soldering the chip components to the printed circuit board, prevents the holes from being caught by lead, and ensures precision regardless of the size and shape of the chip components. Soldering becomes possible. By coating the entire surface of the primary nozzle with Teflon (registered trademark) , lead and foreign substances do not adhere to the surface of the primary nozzle at the time of soldering. There is an effect that can improve.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a nozzle structure of an automatic soldering apparatus according to the present invention.

FIG. 2 is a schematic view showing steps of an automatic soldering apparatus for assembling chip components on a general printed circuit board.

FIG. 3 is a sectional view of a hole formed in the nozzle shown in FIG. 1;

FIG. 4 is a perspective view showing another embodiment of the nozzle structure of the automatic soldering apparatus according to the present invention.

FIG. 5 is a perspective view showing a configuration of a nozzle according to a conventional technique.

[Explanation of symbols]

 10 Primary nozzle 12 Hole 14 Groove

Claims (18)

(57) [Claims] 1. An automatic soldering apparatus for assembling a chip component on a printed circuit board, wherein an unsoldered portion of the chip component is attached to an upper end of a lead jet nozzle provided in a lead tank of the automatic soldering device. a plurality of holes the jet height of lead in order to prevent the failure of the formed waveform to be formed on the embossing shape, and a groove for preventing a phenomenon in which the hole is lodged is formed by the lead, said In each hole, the lead is bent gently upward.
The bottom is rounded so that it is jetted while maintaining the line
Of automatic soldering equipment characterized by being
Nozzle structure. 2. The nozzle structure for an automatic soldering apparatus according to claim 1, wherein said groove is formed so that a part of each of said holes overlaps. 3. The primary nozzle of an automatic soldering apparatus according to claim 2 , wherein the groove is formed so that one-third of the respective holes overlap. Construction. 4. The nozzle structure for an automatic soldering apparatus according to claim 1, wherein each of said holes has a diameter of 4 mm. 5. The nozzle structure according to claim 1, wherein the groove has a width of 3 mm and a depth of 2 mm.
A nozzle structure for an automatic soldering apparatus, characterized in that: 6. The nozzle structure for an automatic soldering apparatus according to claim 1, wherein said nozzle is a primary nozzle. 7. A nozzle structure for an automatic soldering apparatus according to claim 6 , wherein said primary nozzle is a nozzle for soldering a chip to said printed circuit board by a swirling jet method. The nozzle structure of the device. 8. The nozzle structure for an automatic soldering apparatus according to claim 1, wherein said nozzle has a rectangular shape, and each of the holes formed in the nozzle has a first gap in a short direction of the nozzle. And adjacent to each other in the longitudinal direction.
The nozzle structure of the automatic soldering apparatus, wherein the nozzles are adjacent to each other at an interval of 5 mm, and the first interval is 5 mm. 9. The nozzle structure for an automatic soldering apparatus according to claim 8 , wherein said second interval is 8 mm. 10. An automatic soldering apparatus for assembling chip components on a printed circuit board, wherein lead is provided at an upper end of a nozzle provided in a lead tank of the automatic soldering apparatus to prevent unsoldering of chips. A large number of holes are formed in a waveform so that the jet wave height of the jet is formed in an embossing shape, and a groove for preventing a phenomenon that each hole is caught by the lead is formed in the left-right direction about a central axis, and the lead is formed. and coating treatment with Teflon throughout the nozzle as foreign matter does not stick is applied, wherein the respective holes, loose songs the lead in the upper direction
The bottom is rounded so that it is jetted while maintaining the line
Of automatic soldering equipment characterized by being
Nozzle structure. 11. Assembling chip components on a printed circuit board
In automatic soldering equipment, Jetting this lead provided in the lead bath of the automatic soldering device
At the upper end of the nozzle to be soldered,
Embossing height of lead jet to prevent defects
A number of holes formed in a corrugation as formed in the A groove for preventing the lead from holding the hole
Is formed, The groove is formed so that 1/3 of the respective holes overlap.
Nozzle of an automatic soldering apparatus characterized by being processed
Construction. 12. The automatic soldering apparatus according to claim 11,
In the nozzle structure, each of the holes has a diameter of 4 mm.
Nozzle configuration of the automatic soldering apparatus
Build. 13. The automatic soldering apparatus according to claim 11,
In the nozzle structure, the groove has a width of 3 mm and a depth of 2 mm.
mm automatic soldering equipment Nozzle
Construction. 14. The automatic soldering apparatus according to claim 11,
In the nozzle configuration, this nozzle must be a primary nozzle.
And a nozzle structure of the automatic soldering apparatus. 15. The automatic soldering apparatus according to claim 11, wherein
In the nozzle structure, the primary nozzle is a vortex jet method.
A nozzle for soldering a chip to the printed circuit board.
The nozzle structure of the automatic soldering apparatus, characterized in that: 16. The automatic soldering apparatus according to claim 11, wherein
In the nozzle structure, the nozzle has a rectangular shape.
Each corrugated hole in the nozzle is
Adjacent at a first interval in the transverse direction and in the longitudinal direction
Adjacent at a second spacing, wherein the first spacing is 5 mm
A nozzle structure for an automatic soldering apparatus, characterized in that: 17. The automatic soldering apparatus according to claim 16,
In the nozzle structure, the second interval is 8 mm.
And a nozzle structure of the automatic soldering apparatus. 18. Assembling chip components on a printed circuit board
In automatic soldering equipment, The upper end of the nozzle provided in the lead bath of the automatic soldering device
To prevent unsoldering failure of the chip,
Numerous holes so that the jet height is embossed
Is formed into a waveform, To prevent the phenomenon that each hole is caught by the lead
When the groove for the hole is formed in the left and right direction about the center axis
The holes are formed so that 1/3 of the holes overlap each other.
Of the nozzle so that the lead and foreign matter do not adhere.
Coating treatment with Teflon (registered trademark)
Primary of an automatic soldering machine characterized by being applied
Nozzle structure.