SU819992A1 - Device for removing solder excess from apertures and from surface of printed circuit boards - Google Patents
Device for removing solder excess from apertures and from surface of printed circuit boards Download PDFInfo
- Publication number
- SU819992A1 SU819992A1 SU792729410A SU2729410A SU819992A1 SU 819992 A1 SU819992 A1 SU 819992A1 SU 792729410 A SU792729410 A SU 792729410A SU 2729410 A SU2729410 A SU 2729410A SU 819992 A1 SU819992 A1 SU 819992A1
- Authority
- SU
- USSR - Soviet Union
- Prior art keywords
- printed circuit
- boards
- circuit boards
- apertures
- removing solder
- Prior art date
Links
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- Manufacturing Of Printed Wiring (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
(54) УСТРОЙСТВО дл УДАЛЕНИЯ ИЗЛИШКОВ ПРИПОЯ ИЗ ОТВЕРСТИЙ И С ПОВЕРХНОСТИ ПЕЧАТНЫХ ПЛАТ(54) DEVICE FOR REMOVING ITS SURFACES FROM HOLES AND FROM THE SURFACE OF THE PCB
Изобретение относитс к производству печатных плат и может быть использовано при обработке, плат после нанесени на них покрыти лужением.The invention relates to the manufacture of printed circuit boards and can be used in the processing of boards after being coated with a tin plating.
Известно устройство дл удалени излишков припо с печатных плат после лужени , содержаш,ее ванну, направл юш.ие дл перемешени печатных плат и сопла дл подачи жидкого теплоносител на верхнюю и нижнюю поверхности плат 1.A device is known for removing excess solder from printed circuit boards after tinning, containing, its bath, direction for mixing printed circuit boards and a nozzle for supplying a heat transfer fluid to the upper and lower surfaces of the boards 1.
Недостатком известного устройства вл етс неудовлетворительное качества удалени излишков припо с поверхности и особенно из отверстий плат, обусловленное тем, что подача жидкого теплоносител осуш ,ествл етс способом струйно-фонтанного полива.A disadvantage of the known device is the unsatisfactory quality of removing excess solder from the surface, and especially from the holes of the boards, due to the fact that the flow of the liquid heat-drying medium is determined by the method of jet-flowing irrigation.
Известно также устройство дл оплавлени покрыти на печатных платах, содержашее направл юш,ие дл перемещени печатных плат и щелевидные сопла дл подачи жидкого теплоносител на нижнюю и верхнюю поверхности плат 2.It is also known a device for melting a coating on printed circuit boards, containing directions for moving the printed circuit boards and slit nozzles for supplying a heat transfer fluid to the lower and upper surfaces of the boards 2.
Недостатком этого устройства вл етс то, что удаление припо происходит одновременно с обеих поверхностей платы, чтоThe disadvantage of this device is that soldering is removed simultaneously from both surfaces of the board, which
может приводить к образованию натеков припо на нижнюю поверхность платы.may lead to the formation of solders on the bottom surface of the board.
Цель изобретени - улучшение качества удалени излишков припо - достигаетс тем, что в устройстве дл удалени излишковThe purpose of the invention is to improve the quality of removal of excess solder - is achieved by the fact that in a device for removing excess
припо из отверстий и с поверхности печатных плат, содержаш,ем верхнее и нижнее шелевидные сопла дл подачи жидкого теплоносител и механизм перемещени плат, сопла установлена наклонно к плоскостиsolder from holes and from the surface of printed circuit boards, containing upper and lower slit-shaped nozzles for supplying heat transfer fluid and a mechanism for moving the boards; the nozzles are mounted inclined to the plane
перемещени плат, причем нижнее сопло смещено относительно верхнего в сторону перемещени плат.movement of the boards, with the lower nozzle offset from the top in the direction of movement of the boards.
На фиг. 1 изображен общий вид устройства; на фиг. 2 - схема удалени излишков припо .FIG. 1 shows a general view of the device; in fig. 2 is a circuit for removing excess solder.
Устройство содержит ванну 1 дл жидкого теплоносител , механизм перемещени печатных плат, состо щий из четырех пар ведущих валиков 2, щелевидные сопла 3 и 4, установленные под углом к плоскостиThe device comprises a bath 1 for a heat transfer fluid, a mechanism for moving printed circuit boards consisting of four pairs of drive rollers 2, slit nozzles 3 and 4 mounted at an angle to the plane
платы, к которым насосом 5 через фильтр 6 подаетс жидкий теплоноситель из ванны, поддон 7 дл сбора удаленных с печатной платы 8 излишков припо .the boards to which the pump 5 through the filter 6 supplies the heat-transfer fluid from the bath; the tray 7 to collect 8 excess solders removed from the printed circuit board.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU792729410A SU819992A1 (en) | 1979-02-26 | 1979-02-26 | Device for removing solder excess from apertures and from surface of printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SU792729410A SU819992A1 (en) | 1979-02-26 | 1979-02-26 | Device for removing solder excess from apertures and from surface of printed circuit boards |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| SU819992A1 true SU819992A1 (en) | 1981-04-07 |
Family
ID=20812136
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| SU792729410A SU819992A1 (en) | 1979-02-26 | 1979-02-26 | Device for removing solder excess from apertures and from surface of printed circuit boards |
Country Status (1)
| Country | Link |
|---|---|
| SU (1) | SU819992A1 (en) |
-
1979
- 1979-02-26 SU SU792729410A patent/SU819992A1/en active
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