KR100202149B1 - A eddy-current classifying device of automatic soldering machine - Google Patents

Abstract

The present invention relates to a primary nozzle spring vortex sorting apparatus of an automatic soldering machine which can prevent unsold defects of small chips attached to a printed circuit board after automatic soldering and to prevent the hole of the primary nozzle from being blocked. The primary nozzle spring vortex sorting apparatus of the automatic soldering machine is an automatic soldering apparatus for assembling chip components on a printed circuit board, wherein the chip component is provided at an upper end of the primary nozzle for classifying the lead provided in the solder tank of the automatic soldering apparatus. In order to prevent defects of soldering, a plurality of holes are formed in a corrugated shape so that the lead wave crest is formed into an embossed shape, and grooves are formed to prevent the hole from being blocked by the lead. One third of the holes are formed to overlap. The primary nozzle spring flow vortex classification device of the automatic soldering machine has a plurality of holes formed in a wave shape at the upper end of the primary nozzle when soldering chip components to a printed circuit board, and grooves are left and right so that a part of the holes overlap. It is formed in the direction so that it is possible to prevent the defect of chip unsoldness and the blockage of the hole by the lead when soldering the chip component to the printed circuit board, and to perform the precise soldering regardless of the size and shape of the chip component. Also, since the entire surface of the primary nozzle is coated with Teflon (registered trademark), lead and foreign substances do not adhere to the surface of the primary nozzle during soldering, thereby improving soldering quality and product quality. It has an effect.

Description

Primary Nozzle Spring Vortex Sorting Device for Automatic Soldering Machine

1 is a schematic diagram illustrating a process of an automatic soldering machine for assembling chip components onto a printed circuit board in general.

Figure 2 is a perspective view showing the configuration of the primary nozzle in the prior art.

3 is a perspective view showing the configuration of a primary nozzle according to the present invention.

* Explanation of symbols for main parts of the drawings

10: primary nozzle 12: hole

14: home

The present invention relates to an automatic soldering apparatus for assembling chip components to a printed circuit board, and in particular, to prevent unsold defects of small chips attached to the printed circuit board after automatic soldering, and to prevent the hole of the primary nozzle from being clogged. A primary nozzle spring water vortex sorting device for an automatic soldering machine.

In general, the process of an automatic soldering machine for assembling chip components on a printed circuit board will be described with reference to FIG. 1.

After bonding to the chip 34 parts such that the leads of the chip 34 parts are positioned on the lands of the patterns formed on the printed circuit board 32, the high temperature 1500 is attached to the printed circuit board 32. After drying for at least 90 seconds, after flashing in the hollows foaming tank (36), which is an accelerator, to the portion to be soldered, the foamed material is heated in the preheating tank (38). After preheating and drying, the first nozzle 40a and the second nozzle 40b in which the printed circuit board 32 is installed in the lead bath 40 while the chip 34 is attached to the printed circuit board 32. Passing by 2400 50 To the extent that lead is attached to the land, the chip 34 components are automatically soldered to the printed circuit board 32.

Therefore, in the present specification, the configuration and operation state of the primary nozzle in the automatic soldering apparatus operated as described above will be described.

However, in the automatic soldering machine configured in FIG. 1, only the primary nozzle 40a differs from each other in the present invention and the related art, and the rest of the configuration is the same. Therefore, other configurations other than the primary nozzle will be described with reference to FIG. 1 in the prior art and the configuration and operation of the present invention.

2 is a perspective view showing the configuration of the primary nozzle 20. Conventionally, in order to solder the chip 34 parts to the printed circuit board 32 on the upper end of the primary nozzle 20 installed in the solder tank 40 of the automatic soldering apparatus, the lead flows out in a spring water method, which is a one-time soldering method. To this end, a plurality of holes 22 are formed at intervals of 2 mm in the vertical direction and the horizontal direction, respectively.

At this time, each of the holes 22 is 3mm in diameter, and the plurality of holes 22 formed at both ends of the central axis of the primary nozzle 20 are formed to be inclined 15 degrees in the center direction.

As shown in FIG. 1, the primary nozzle 20 configured as described above has the primary nozzle 20 when the printed circuit board 32 moves along the conveyor and is located in the lead bath 40. That is, the components of the chip 34 are soldered to the printed circuit board 32 in such a manner that lead is raised convexly upward.

Since the primary nozzle using the above method automatically solders the chip components to the printed circuit board in a spring water method, the unsatisfactory defects of the small chip components attached to the pattern surface of the printed circuit board may occur. As a result, different solder joints may cause chip parts to fall from the printed circuit board. Since a plurality of holes formed at the upper end of the primary nozzle have a diameter of 3 mm, lead flows to both centers of the holes and flows to both sides of the chip. The front part of the part is well soldered, but the back part is unpaid, and only some of the lead flowing out of the spring through a plurality of holes formed in the upper part of the primary nozzle solders the chip to the printed circuit board. Since the rest flows into the central portion of the primary nozzle, the plurality of holes are frequently blocked. It was.

SUMMARY OF THE INVENTION In order to solve the above problems, an object of the present invention is to provide a primary nozzle spring vortex classification apparatus of an automatic soldering machine which can improve soldering quality when soldering a chip component to a printed circuit board.

Another object of the present invention to provide a device that can prevent the phenomenon that the hole formed in the upper end of the primary nozzle is blocked by lead.

It is still another object of the present invention to provide a device capable of preventing a small chip unpaid defect by a spring water vortex classification method.

Another object of the present invention is to provide an apparatus capable of precise soldering regardless of the size and shape of the chip component.

Still another object of the present invention is to provide an apparatus capable of improving soldering quality and product quality.

Still another object of the present invention is to provide a device in which the primary nozzle is treated with Teflon (registered trademark) so that lead and foreign matters are not buried at the time of lead classification.

In order to achieve the above object, the present invention provides an automatic soldering apparatus for assembling chip components on a printed circuit board, wherein the upper part of the primary nozzle for sorting the lead provided in the solder tank of the automatic soldering apparatus is provided with the chip component. In order to prevent defects of soldering, a plurality of holes are formed in a corrugation shape so that the lead wave height is formed into an embossed shape, and grooves are formed to prevent the hole from being blocked by the lead. It is characterized in that the 1/3 of the formed to overlap.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used for the same components even though they are shown in different drawings. In describing the present invention, it should be noted that specific descriptions of well-known functions or configurations are omitted in order not to disturb the gist of the present invention.

As shown in FIG. 3, the primary nozzle 10 of the automatic soldering machine according to the present invention has a printed circuit board on the upper end of the primary nozzle 10 installed in the solder tank 40 of the automatic soldering apparatus. A plurality of holes 12 are each fixed so that the fractional crests of lead are discharged by the spring vortex method so that the lead wave crest is formed into an embossed shape in order to prevent the unpaid defect of the chip 34 at the time of soldering the component of the chip 34. It is formed in a wave shape (ie, zigzag shape) while maintaining equal intervals. At this time, the lower surface (bottom surface) of each hole 12 is rounded in order to allow the lead to be classified while maintaining a smooth curve in the upper direction. Further, each of the holes 12 has a diameter of 4 mm, and among the holes 12 formed in the wave shape, the first interval (interval of A shown in FIG. 3): 5 mm, the second interval (FIG. 3) Spacing of B) is formed to maintain a spacing of 8 mm. In this way, by rounding the openings of the respective holes 120 formed in the primary nozzle 10 so as to maintain a gentle curve, it is possible to obtain a sorting in the upper direction suitable for soldering. By rounding the bottom surface, clogging of the opening by oxide can be prevented, so that good soldering can be continued even when lead is separated for a long time.

When the chip 34 is soldered to the printed circuit board 32 around the central axis of the primary nozzle 10 in the left and right directions of the center of the primary nozzle 10, the lead flows to each of the primary nozzles 10. Grooves 14 are formed to prevent the hole 12 from clogging. At this time, the groove 14 is formed by overlapping a part of each of the holes 12, that is, about 1/3 of the respective holes 12 in the left and right directions with respect to the central axis of the primary nozzle 10. In addition, the groove 14 is formed with a width of 3mm, a depth of 2mm. Forming a third of the holes of the primary nozzle 10 by overlapping one third of the holes can prevent the holes 12 formed in the primary nozzle 10 from being blocked by lead, thereby preventing the soldering of the chip. have. That is, at the time of classifying lead, the gas generated at the time of soldering falls to the center direction of the groove 14. The more efficient discharge of the gas generated in this way can prevent the respective holes 12 formed in the primary nozzle 10 from being clogged by lead, which can be prevented by unsoldering.

In the present invention, focusing on the above matters, the shape of effectively discharging the gas is examined. As a result, the grooves 14 have left and right sides on the central axis of the primary nozzle 10. It was found that a part of), i.e., one-third overlapping was most effective.

In addition, when the chip 34 is soldered to the printed circuit board 32, the Teflon (registered trademark) is formed on the entire primary nozzle 10 so that the lead and foreign substances do not adhere to the surface of the primary nozzle 10. A) It is constructed by coating.

Referring to the operation and effects of the present invention configured as described above are as follows.

As shown in FIG. 1, when the primary nozzle 10 moves along the conveyor to the printed circuit board 32 and is located in the lead bath 40, the primary nozzle 10 uses a spring water vortex classification method. In the upper direction through the plurality of holes 12 are formed in an embossed shape to solder the chip 34 components to the printed circuit board (32).

At this time, the lead flowing out into the plurality of holes 12 solders the chip 34 to the printed circuit board 32 and flows into the groove 14 while completely returning the chip 34 to the printed circuit board 32. Solder).

According to the present invention as described above, the primary nozzle spring vortex sorting apparatus of the automatic soldering machine has a plurality of holes formed in a wave shape at the upper end of the primary nozzle when soldering chip components to a printed circuit board, and a part of the holes overlaps. Since the grooves are formed in the left and right directions so that the grooves are formed in the printed circuit board, it is possible to prevent defects in chip unsatisfactory and to prevent the hole from being blocked by lead when soldering the chip component to the printed circuit board. In addition, precise soldering can be performed regardless of the size and shape of the chip parts. Also, since the entire surface of the primary nozzle is coated with Teflon (registered trademark), lead and foreign substances do not get on the surface of the primary nozzle during soldering. And, this has the effect of improving the soldering quality and product quality.

Claims (7)

In an automatic soldering apparatus for assembling chip components on a printed circuit board, the soldering of the chip 34 components is unsoldered at the upper end of the primary nozzle 10 for sorting the lead provided in the solder bath 40 of the automatic soldering apparatus. In order to prevent the failure of the lead is formed a plurality of holes (12) formed in a corrugated wave shape so that the wave height of the embossed shape, and the grooves (14) for preventing the hole 12 is blocked by the lead is formed, The groove (14) is a primary nozzle spring vortex sorting device of the automatic soldering device, characterized in that the 1/3 of each of the holes (12) overlap. 2. The primary nozzle spring vortex sorting device according to claim 1, wherein each of the holes has a diameter of 4 mm. 2. The primary nozzle spring vortex sorting device according to claim 1, wherein the groove (14) has a width of 3 mm and a depth of 2 mm. 2. The primary nozzle spring vortex classification apparatus according to claim 1, wherein the primary nozzle (10) is a nozzle for soldering the chip (34) to the printed circuit board (32) by a spring water vortex classification method. 5. The method of claim 4, wherein the primary nozzles 10 have a spherical shape, and the holes 12 formed in a wave shape in the primary nozzles 10 are respectively spaced at a first interval in a short direction of the primary nozzles 10. A primary nozzle spring vortex sorting device, characterized in that adjacent to the second interval in the longitudinal direction and the first interval is 5mm. 6. The primary nozzle spring water vortex classification device according to claim 5, wherein the second interval is 8 mm. In an automatic soldering apparatus for assembling chip components on a printed circuit board, the upper end of the primary nozzle (10) provided in the solder tank 40 of the automatic soldering apparatus is used to prevent the defect of the soldering of the chip (34). A plurality of holes 12 are formed in a wave form so that the classification wave height is formed in an embossed shape, and the grooves 14 for preventing a phenomenon that each hole 12 is blocked by the lead are left and right centered on the central axis. The hole 12 is formed to overlap one-third and at the same time, a coating treatment by Teflon (registered trademark) is applied to the entire primary nozzle 10 to prevent the lead and foreign substances from sticking to each other. Primary nozzle spring water vortex sorting device of automatic soldering device characterized by load.