JP2965470B2 - Jet type soldering equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet type soldering apparatus for performing soldering by bringing a wiring board into contact with a jet wave of a solder melt.

[0002]

2. Description of the Related Art In a wiring board on which chip-type electronic components and the like are mounted, a soldered portion becomes finer and irregularities are formed on the surface thereof. When soldering a wiring board having such a three-dimensional structure with a jet-type soldering apparatus, it is important to determine how to supply a solder melt to every minute corner of the three-dimensional structure. It is an important technology for obtaining the character.

FIGS. 8 (a) and 8 (b) are views showing an example of a conventional jet tank. FIG. 8 (a) is a side sectional view of a jet nozzle, and FIG. It is a top view which shows the shape of the blowing hole seen from the upper part. FIG. 8 is a diagram of Japanese Patent Publication No. 63-51939.
No. 1 (hereinafter referred to as "known example 1").

In FIGS. 8A and 8B, reference numeral 1 denotes a wiring board on which chip-type electronic components are temporarily attached. 2 is a nozzle,
Reference numeral 3 denotes a solder melt, 4 denotes a jet outlet, 5 denotes a jet wave, 6 denotes a jet plate, 7 denotes a saw-toothed outlet, and 8 denotes a conveyor.

[0005] That is, the rough solder jet 3 is formed by ejecting the solder melt 3 from the serrated blow-off port 7, so that the solder melt can be supplied to the fine portion and stay there. This is a technique in which the gas is expelled, and the wiring board 1 held by the transport conveyor 8 and transported in the transport direction A can be securely soldered.

FIG. 9 is a view showing another example of a conventional outlet, and FIGS. 9 (a) to 9 (d) are plan views viewed from above the outlet, and FIGS. 9 (a) and 9 (b). FIG. 9 is an excerpt from Japanese Utility Model Laid-Open No. 3-42367 (hereinafter referred to as known example 2).
(C) and (d) are excerpts from Japanese Utility Model Laid-Open No. 6-61364 (hereinafter referred to as known example 3).

[0007] These figures are all shown in FIG.
9 (a) and 9 (b), a narrow slot hole 12 and a large diameter slot 13 formed by a nozzle plate piece 11 are provided. 14 formed by disposing zigzags in a zigzag pattern
This is a technique for forming irregularities in the height of a jet wave (not shown) ejected from the nozzle. As a result, a coarse portion is formed by forming a rough and rough jet wave as in the prior art of the known example 1 in FIG. This technology enables the supply of the solder melt to the furnace.

The same applies to the technique of the known example 3 shown in FIGS. 9 (c) and 9 (d), wherein the shapes of the narrow slot 12 and the blowing port 14 formed in the nozzle plate piece 11 are shown in FIG. 9 (c). And also
This is a technique of forming a jet wave (not shown) that fluctuates irregularly by forming the blowing ports 14 in a staggered shape as shown in FIG. 9D, ie, a fluctuating jet wave. 8A and 8B show a technique which enables the supply of a solder melt to a fine portion by forming a rough jet wave in the same manner as in the prior art shown in FIGS. 8 (a) and 8 (b).

[0009]

As for the solderability when soldering the wiring board 1 on which chip-type electronic components are mounted, an excellent action is exhibited even in the above-mentioned prior art. However, the miniaturization of chip-type electronic components and the increase in packaging density, and the resulting finer pitch of soldered parts, etc. have been further developed,
Along with this, further improvement in solderability is required, that is, it is required to further improve the solder supply power to the miniaturized portion, the wettability, and the driving force of stagnant gas.

SUMMARY OF THE INVENTION It is an object of the present invention to supply a solder melt to a soldered portion of a wiring board having a miniaturized three-dimensional structure by mounting chip-type electronic components and to obtain sufficient wettability. A possible jet-type soldering device is to be realized. Another object of the present invention is to prevent dross, which tends to be generated when the jet port of the solder melt is small, to realize a clean and stable soldering process environment, and to eliminate the maintenance work of the jet port. As a result, the object is to realize a favorable soldering process environment and an excellent operating environment for a wiring board having a high-density fine pitch.

[0011]

Means for Solving the Problems Claim 1 according to the present invention.
In the invention described in the above, slit nozzles are provided in the nozzle in a direction intersecting with the transfer direction of the wiring board, and a plurality of sub-injection holes adjacent to and communicating with the slit-like nozzles are provided along the slit-like nozzles, The communicating portion between the ejection hole and the slit-shaped ejection port is formed in a narrow path narrowed with respect to the size of the sub ejection hole.

Further, according to the invention described in claim 2, the nozzle is provided with an adjusting means for adjusting at least one of a horizontal interval, a horizontal facing position, and a vertical interval of the slit-shaped ejection ports. It is provided.

[0013]

According to the first aspect of the present invention, the solder melt spouted from the slit-shaped spout forms a jet wave having a ridge-like apex (main ridge) towering along the slit. Then, the solder melt spouting from the sub spout hole adjacent to the jet wave forms a number of sub-tops, which are other tops.

Therefore, when the wiring board is brought into contact with such a jet wave while being conveyed, the sub apex of the jet wave ensures the penetration of the solder melt into the fine portion of the wiring board by its sharp dynamic pressure. Then, the main ridge ensures the entire contact with the soldered surface of the wiring board. In addition, since the main ridge formed by jetting from the slit-shaped jet port has a towering shape, it contacts the fine portion entirely.

Further, the dross is prevented from adhering to the blow port due to the large flow of the solder melt blown out from the slit-shaped blow port.

According to the second aspect of the present invention, the size of the main peak portion of the jet wave can be adjusted by adjusting the horizontal interval between the slit-shaped jet ports. That is, the contact time between the wiring board and the jet wave can be adjusted. Therefore, it is possible to select and adjust the optimal contact time for the wiring board.

Further, by adjusting the horizontal opposing position of the sub-ejection hole communicating with the slit-shaped ejection port, it is possible to adjust the relative position of the sub-top ejecting from the sub-ejection hole. Therefore, it is possible to adjust the position of the sub-top which is optimal for the wiring board, that is, the dynamic pressure distribution of the jet wave.

By adjusting the vertical interval between the slit-shaped ejection ports, the ejection directivity of the solder melt can be adjusted. That is, it is possible to adjust the flow direction of the solder melt forming the main peak portion of the jet wave, so that it is possible to select and form the optimum jet direction for the wiring board.

[0019]

Next, practical examples of how the jet-type soldering apparatus according to the present invention can be embodied will be described.

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIGS. 2 (a) and 2 (b) are views showing the shape of a nozzle from which the solder melt of FIG. 1 is ejected. FIG. 2B is a plan view, and FIG. 2B is a cross-sectional view taken along line II of FIG.

In these figures, the same reference numerals as those in FIG. 8 denote the same parts, and the nozzle 21 is formed of side plates 22 on both sides, a lower nozzle body 23 and an upper nozzle body 24, and two front and rear jet plates 25. Also, the wiring board 1 of FIG.
2B is also divided into a lower nozzle body 23 and an upper nozzle body 24 as shown in FIG. 2B.

The lower nozzle body 23 and the upper nozzle body 24 on the carry-in side of the wiring board 1 are shown in FIGS.
As shown in FIG.
The structure is fixed with. Thereby, the lower nozzle body 23
Is fixed to the side plate 22, and an adjustment mechanism is formed which can adjust the upper nozzle body 24 on the carry-in side by sliding back and forth in the transport direction A along the joint 26. The upper nozzle body 24 on the carry-out side is provided with an adjustment mechanism that can be adjusted by sliding in the vertical direction. The lower nozzle body 23 and the upper nozzle body 24 may be vertical without being inclined.

Further, the jet plate 25 is fixed to the upper portion 29 side of the upper nozzle body 24 by the long holes 27 and the screws 28.

In FIG. 2 (a), an adjustment mechanism is formed so that the carry-in side jet plate 25 can be vertically slid to adjust the vertical interval, and the carry-out side jet plate 25 has two side plates in the longitudinal direction. An adjustment mechanism is formed which is slightly shorter than the distance (interval) between the nozzles 22 and can slide in a horizontal direction intersecting the transport direction A of the wiring board 1 to adjust the horizontal opposition of the jet plate 25. .

For this reason, the horizontal spacing, vertical spacing, and horizontal facing position of the slit-shaped ejection port 30 can be adjusted by these adjusting mechanisms.

Further, the slit-shaped jet port 30 is formed between the two jet plates 25. A plurality of arc-shaped concave portions corresponding to the sub-ejection holes 31 are provided at the end 30a of the jet plate 25 on the slit-shaped ejection port 30 side. The portion where the sub-ejection hole 31 communicates with the end 30 a of the jet plate 25 on the side of the slit-like ejection port 30 is made smaller and narrower than the diameter of the sub-ejection hole 31 so as to form a narrow passage 32.

The upper nozzle body 24 on the carry-out side is shown in FIG.
As shown in (a) and (b), it is formed so as to extend to the upper portion 29 of the jet plate 25 and overlap with the jet plate 25. Therefore, in order to enable the ejection of the solder melt 3 from the sub ejection hole 31, the upper nozzle body 24 on the ejection side has a cutout portion 24 a in the upper portion 29.

FIG. 3 is a perspective view showing an example of the shape of the jet wave 5.

Next, the operation will be described. A ridge-shaped main ridge 33 rising from the jet wave 5 ejected from the slit-shaped outlet 30 is formed. A large number of sub-tops 34 are formed adjacent to the main ridge 33 by the jet wave 5 ejected from the sub-ejection hole 31. ing. In FIG. 3, the number of the sub-tops 33 is reduced for the sake of simplicity, but actually, the number of sub-injection holes 31 shown in FIG. 1 is formed. In a state where the wiring board 1 is not in contact with the jet wave 5, the fluctuation of the shear flow also exists at the main peak 33 and the sub-top 34.

FIGS. 4 (a) to 4 (c) are views showing the adjustment of the jet plate 25 and the manner of soldering to the wiring board 1. FIG. 4 (a) adjusts only the horizontal spacing of the slit-shaped jet ports 30. 4 (b) is a side sectional view illustrating an example in which the horizontal interval and the vertical interval of the slit-shaped ejection port 30 are adjusted, and FIG. 4 (c) is different from FIG. 4 (b). It is a sectional side view explaining the example adjusted so that ejection directionality of the opposite direction might be shown.

[Adjustment Example 1] That is, in the adjustment example of FIG. 4A, a large number of sub-tops 34 are formed adjacent to both sides of the main peak 33 (positions in front and rear with respect to the transport direction A of the wiring board 1). Is done. Therefore, when the wiring board 1 is brought into contact with such a jet wave 5 while being conveyed, first, the sub-top portion 34 of the jet wave 5 comes into contact with the wiring substrate 1, and then the main peak portion 33.
Contact the entire surface of the wiring board 1 without any leakage. After that, the sub-top 34 comes into contact with the wiring board 1 again. In this case, the sub-top portion 34 enters a minute portion of the surface to be soldered due to the sharpness of the dynamic pressure distribution. The main peak 3
Since 3 has a towering shape, it comes into contact with the surface to be soldered evenly while contacting a fine portion, and a necessary contact time can be secured.

Even if the main peak 33 and the sub-top 34 of the jet wave 5 are flattened on the surface of the wiring board 1 due to the contact of the wiring board 1, the jet pressure and the dynamic pressure distribution resulting from the flow motion are flat. Instead, they are distributed along the main peak 33 and the sub-top 34. Therefore, it operates similarly in such a case. This is the same in the following embodiments.

Therefore, it is possible to solder a fine part and to reliably wet the solder, and it is possible to satisfactorily solder the wiring board 1 having a high-density mounting and fine pitch.

Further, a large flow of the solder melt 3 ejected from the slit-shaped ejection port 30 prevents dross from adhering to the slit-shaped ejection port 30 and the sub-ejection hole 31.
The same applies to the following embodiments.

[Adjustment Example 2] On the other hand, the adjustment example shown in FIG. 4B is an adjustment example in which the horizontal interval of the slit-shaped ejection ports 30 is reduced and the vertical interval is increased.

In the case of this adjustment example, as shown in FIG. 4B, the jet wave 5 jetted from the slit-shaped jet port 30 has directivity flowing to the right side in the figure, that is, to the loading side of the wiring substrate 1, and The formed main ridge portion 33 and the sub-top portion 34 formed by ejecting from the sub-ejection hole 31 on the right side in the drawing overlap. Therefore, an uneven main peak portion 33 in which the sub-top portion 34 is slightly formed on the main peak portion 33 is formed. Then, the jet wave 5 ejected from the sub-ejection hole 31 on the left side in FIG.
It is formed similarly to (a).

The jet wave 5 is applied to the wiring board 1.
Are brought into contact with each other while being transported, first, the main peak portion 33 having an uneven shape comes into contact with the wiring board 1, and then, the sub-top portion 34
Contacts the wiring board 1. In this case, the main peak portion 3 having an uneven shape
Reference numeral 3 secures a contact time while penetrating into a minute portion of the surface to be soldered. Also, the sub-top 34 enters the minute portion. Furthermore, since the ejection directivity of the main peak 33 is opposite to the transport direction A of the wiring board 1, the dynamic pressure at which the jet wave 5 flows on the wiring board 1 increases. Therefore, the force for expelling gas from the surface to be soldered of the wiring substrate 1 having a three-dimensional structure and the supply pressure (dynamic pressure) of the solder melt 3 to the minute portion are increased.

Therefore, the soldering of the minute portion and the reliable solder wetting can be performed. Then, it is possible to satisfactorily solder the wiring board 1 having a surface-mounting fine pitch in which the surface to be soldered has a three-dimensional structure.

[Adjustment Example 3] The adjustment example shown in FIG. 4C is such that the horizontal direction of the slit-shaped ejection ports 30 is adjusted so as to obtain the ejection directivity opposite to that of the adjustment example shown in FIG. 4B. This is an example of adjustment in which the vertical interval is widened when the vertical axis is sandwiched.

In the case of this adjustment example, when the wiring substrate 1 is brought into contact with the substrate while being transported, first, the sub-top portion 34
Then, the soldering liquid 3 is supplied to the fine portion, and then the main peak portion 33 having an uneven shape comes into contact with the wiring board 1. In this case, the uneven main peak portion 33 secures the contact time while entering the minute portion of the surface to be soldered.

Since the jet directivity of the main ridge 33 is the same as the transport direction A of the wiring board 1, the dynamic pressure at which the jet wave 5 flows on the wiring board 1 is slightly reduced, but at the peel back point. It is possible to reduce the difference between the transport speed of the wiring substrate 1 and the flowing speed of the jet wave 5, and it is possible to achieve both good thickness and good fillet shape and good separation of the solder melt 3, The possibility of occurrence of the solder bridge phenomenon can be reduced.

Therefore, unnecessary phenomena such as solder bridges can be eliminated while ensuring the solderability of the fine portion.

[Example of Adjustment of Horizontal Opposition Position] FIG. 5 also shows an example of adjustment of the jet wave shape and an example of a soldering mode of the wiring board 1. FIG. 5 (a) is a view of FIG. FIG. 5B is an adjustment example in which the relative positions of the sub-ejection holes 31 are staggered, FIG.
FIG. 4A is a view of FIG. 4A as viewed from above, and is an example of adjustment in which the relative positions of the sub-ejection holes 31 are arranged so as to face each other.

That is, FIG. 5A shows an example in which the relative position of the sub-ejection holes 31 is adjusted to be staggered as illustrated in FIG. Appear staggered. When the wiring board 1 is conveyed and comes into contact with the jet wave 5, the sub-top 34
, The gas is expelled by the dynamic pressure, and the solder melt 3 is supplied to the fine portion. Of course the main peak 3
No. 3 contacts the entire surface without leakage due to substantially uniform dynamic pressure.

When the positions of the sub-ejection holes 31 are adjusted so as to face each other as illustrated in FIG. 5B, the sub-tops 34 located on both sides of the main peak 33 come to appear continuously. And this forms unevenness (ripple-shaped unevenness) at the wave front of the main peak portion 33. As a result, main peak 3
A jet wave 5 is formed by forming a streak-like flow on both sides of 3. Therefore, when the wiring board 1 is conveyed and comes into contact with the jet wave 5, this streak-like flow enters the fine portion of the wiring board 1, and the main ridge portion 33 is entirely contacted without leakage. That is, the fine portion is soldered.

Naturally, the vertical space and the horizontal space of the jet plate 25 are adjusted as shown in FIG. 4 (b) or FIG. 4 (c), and the sub jet holes are formed as shown in FIG. 5 (a) or FIG. 5 (b). The relative position of 31 can be adjusted. In these cases, the appearance of the sub-top 34 is substantially the same as the example of FIG.

[Dynamic Pressure Distribution] FIGS. 6A to 6D are diagrams showing the dynamic pressure distribution of the jet wave 5 using isobars.
(A) is a dynamic pressure distribution diagram of the jet wave 5 according to FIG. 5 (a) of the present invention, FIG. 6 (b) is a dynamic pressure distribution diagram of the jet wave 5 according to FIG. 5 (b) of the present invention, and FIG. 9) is a dynamic pressure distribution diagram of the jet wave 5 according to FIG. 9 (a) or 9 (b) of the conventional example, and FIG. 6 (d) is a dynamic pressure distribution diagram of the jet wave 5 according to FIG. 9 (c). In addition, the part shown by the broken line in the figure represents the shape of the slit-shaped outlet 30, the sub-outlet 31, the narrow slot 12, the large-diameter hole 13, and the outlet 14.

That is, as shown in FIGS. 6 (a) and 6 (b), in the case of the present invention, the narrow passage 32 is formed by narrowing the communication passage portion between the sub-outlet 31 and the slit-like outlet 30 in FIG. Therefore, the dynamic pressure of the jet wave 5 ejected from the sub-ejection hole 31 and the dynamic pressure of the jet wave 5 ejected from the slit-shaped outlet 30 form independent peaks. Then, in a portion where the dynamic pressure is low, a continuous dynamic pressure distribution is shown. In other words, the dynamic pressure is distributed so that each has an independent peak portion and the base portion shows the same skirt, and the independence and continuity of the sub-ejection hole 31 and the slit-shaped ejection port 30 are compatible.

Therefore, it is possible to make the peak of the dynamic pressure distribution sharp, and the jet wave 5 ejected from the sub ejection hole 31 and the jet wave 5 ejected from the slit-shaped ejection port 30 are formed.
In addition, an independent action on the wiring board 1 can be given. In other words, it is possible to increase the supply force of the solder melt 3 to the minute portion of the surface to be soldered having a three-dimensional structure, that is, the dynamic pressure, and to apply multiple effects.

On the other hand, in the case of FIGS. 6 (c) and 6 (d), the connection between the large-diameter hole 13 or the blow port 14 in a semicircular or square portion and the narrow slot 12 in the slit shape portion. Since there is no narrowed portion in the passage portion, the peaks of the dynamic pressure distribution do not show independent distributions, and the peaks vary, but form continuous ridges. Therefore, the dynamic pressure distribution cannot be formed sharp and has a dull distribution. Further, since a continuous ridge is formed, the dynamic pressure cannot be applied to the wiring board 1 in a multiplex manner. Therefore, the ability to supply the solder melt 3 to the minute portion of the surface to be soldered having a three-dimensional structure is inferior.

[Other Embodiments] FIGS. 7 (a) to 7 (c)
5A and 5B are diagrams showing other shapes of the jet plate 25, all of which show the jet plate 25 viewed from above.

That is, FIG. 7 (a) shows a configuration in which the shape of the sub-ejection hole 31 is rectangular, and the portion communicating with the slit-like ejection port 30 is narrowed to form a bottleneck 32. FIG.
(B) shows a shape in which the shape of the sub-ejection hole 31 is triangular, and similarly, the sub-ejection hole 31 communicates with the slit-like ejection port 30 through a narrow path 32.
FIG. 7 (c) shows the shape of the sub-jet port 31 as a triangle opposite to that shown in FIG. 7 (b), and cuts off a portion near the apex of the triangle to form a bottleneck 32 and communicates with the slit-shaped jet port 30. It is a thing.

By deforming the shape of the sub-ejection hole 31 in this way, it becomes possible to deform the dynamic pressure distribution of the jet wave 5 ejected from the sub-ejection hole 31, resulting from the component layout of the wiring board 1 and the like. It is possible to match the three-dimensional structure with the gas purge path and the flow path of the solder melt 3 on the surface to be soldered. That is, by selecting an optimum shape for the wiring board 1, it is possible to bring out a more excellent effect.

Further, it is also possible to change the form of the fluctuation peculiar to the jet flow of the solder melt 3 spouted from the sub jet hole 31, that is, the shear flow.

[0055]

As described above, according to the present invention, there are the following effects corresponding to each claim.

According to the first aspect of the present invention,
The nozzle is provided with a slit-shaped ejection port in a direction intersecting with the direction in which the wiring board is conveyed, and a plurality of sub-ejection holes adjacent to and communicated with the slit-shaped ejection port are provided along the slit-shaped ejection port. Since the communication part with the outlet was formed in a narrow path narrowed with respect to the size of the sub-ejection hole, it became possible to supply the solder melt to the part to be soldered which is finer and has a three-dimensional structure, A sufficient contact time can be ensured, and all the soldered portions can be reliably soldered with good wettability. As a result, it is possible to perform reliable and favorable soldering of a wiring board having a high-density mounting and fine pitch.

Further, dross does not adhere even to a small ejection hole such as a sub-ejection hole, so that a clean and stable soldering process environment can be realized and maintenance work for the ejection hole is unnecessary. be able to. As a result, an excellent driving operation environment can be realized.

According to a second aspect of the present invention, there is provided an adjusting means for adjusting at least one of a horizontal interval, a horizontal facing position, and a vertical interval of the slit-shaped ejection ports. Therefore, in addition to the effects of claim 1, the shape and directivity of the jet wave, the contact time with the wiring board,
And the like can be adjusted, and an optimal process can be set for a wiring board to be soldered.
Therefore, it is possible to perform more reliable and favorable soldering of the wiring board having a high-density mounting and fine pitch.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a view showing a shape of a nozzle of FIG. 1;

FIG. 3 is a perspective view showing an example of a shape of a jet wave.

FIG. 4 is a diagram showing a mode of adjustment of a jet plate and soldering to a wiring board.

FIG. 5 is a view showing a shape of a jet wave.

FIG. 6 is a diagram showing a dynamic pressure distribution of a jet wave.

FIG. 7 is a view showing another shape of the jet plate.

FIG. 8 is a diagram showing an example of a conventional jet tank.

FIG. 9 is a view showing another example of a conventional blow outlet.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wiring board 3 Solder melt 5 Jet wave 21 Nozzle 23 Lower nozzle body 24 Upper nozzle body 25 Jet plate 26 Joint part 30 Slit-shaped ejection port 31 Sub-ejection hole 32 Bottleneck

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-63-93469 (JP, A) JP-A-63-137569 (JP, A) 42367 (JP, U) Japanese Utility Model Application No. 61-41459 (JP, U) Japanese Utility Model Application No. 2-76664 (JP, U) Japanese Utility Model Application No. 57-122770 (JP, U) (58) Field surveyed (Int. ⁶ , DB name) H05K 3/34 506 B23K 1/08 320

Claims (2)

(57) [Claims] 1. A jet type soldering device, comprising: a nozzle for ejecting a solder melt from an ejection port to form a jet wave, wherein the nozzle is brought into contact with the jet wave while carrying a wiring substrate to perform soldering on the wiring substrate. In the apparatus, a slit-shaped ejection port is provided in the nozzle in a direction intersecting with the transport direction of the wiring substrate, and a plurality of sub-ejection holes adjacent to and communicated with the slit-shaped ejection port are provided along the slit-shaped ejection port, A jet-type soldering apparatus, wherein a communicating portion between the sub-ejection hole and the slit-shaped ejection port is formed in a narrow path narrowed with respect to the size of the sub-ejection hole. 2. The nozzle according to claim 1, further comprising an adjusting means for adjusting at least one of a horizontal interval between the slit-shaped ejection ports, a horizontal facing position, and a vertical interval. Item 1. A jet type soldering apparatus according to Item 1.