KR20050009016A - A nozzle of soldering machine - Google Patents

Abstract

PURPOSE: A nozzle of a soldering machine is provided to prevent an erroneous welding by removing a flux gas generated during the welding operation on a printed circuit board. CONSTITUTION: A nozzle of a soldering machine ejects a fused solder tin from a solder tin tub in a wave form. The soldering nozzle includes a plurality of dividers(23) punched on a planar nozzle plate(20) implemented on the solder tin tub. The dividers are arranged in a plurality of columns in a zig-zag formation with respect to a length direction of the nozzle plate. A cylinder(24), in communication with an inner portion of the solder tin tub, is exposed to an upper portion of the divider.

Description

Nozzle of Soldering Equipment {A NOZZLE OF SOLDERING MACHINE}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering apparatus for a printed board, and more particularly, to a nozzle of a soldering apparatus for soldering a predetermined portion or a chip part of a printed circuit with a wave-like molten solder ejected from a nozzle of a soldering tank. When printed boards with chip components are brought into contact with the wave-like molten solder ejected from the nozzle of the soldering vessel, they prevent unsoldering, minimize solder shorts between component leads, and always maintain a constant shape without clogging the molten solder ejection outlet. The present invention relates to a nozzle of a soldering apparatus capable of dividing.

In general, printed circuit boards used in various electronic devices are mounted with various chip components according to the characteristics of the electronic device, and soldered by an automatic soldering device.

The soldering apparatus is composed of a fluxer, a heater, a soldering tank, and a cooler, and a conveyor, which is a conveying apparatus, is provided on the upper portion of the soldering apparatus.

The soldering of the printed circuit board by the automatic soldering apparatus will be described briefly. First, when the printed circuit board is fixed to a conveyor and travels on the soldering apparatus, flux is first applied to the soldered surface by a fluxer. do.

Next, the flux-coated printed circuit board is preheated by a heater. If the flux remains on the printed circuit board, there is a risk that the molten solder will be scattered in the next contact process with the molten solder. Contact with the high temperature fusion solder may cause thermal shock on the printed circuit board or the chip components mounted on the printed circuit board. If the printed circuit board at normal temperature contacts the molten solder, the temperature of the molten solder may be lowered and the solderability may deteriorate. Therefore, the heater is preheated.

The printed board preheated by the heater is transferred to a solder bath and subjected to soldering by contact of molten solder.

In general, a solder nozzle of an automatic soldering apparatus is provided with a primary nozzle and a secondary nozzle, and a printed circuit board is soldered by continuously contacting the primary nozzle and the secondary nozzle. Spheres are formed and the molten solder is ejected in an inclined wave form, and it penetrates into the corners of chip parts and printed circuit boards where the molten solder is difficult to penetrate, or between the gaps between the leads and through holes of the electronic parts. To solder.

In addition, the secondary nozzle is formed with a wide nozzle, the ejection of the molten solder is not roughly ejected in the form of a gentle wave so that the bridge or icicle generated in the primary nozzle is removed by contacting the gentle wave of the secondary nozzle The printed board is in a clean soldered state.

The splitter formed on the flat top plate of the primary nozzle has a plurality of rows formed in a line with respect to the longitudinal direction. When the molten solder is ejected through the fractionation rules of the primary nozzle, the molten solder has a simple shape and the same row. Since the sprayed through the small-diameter sorting sphere, respectively, the waveform of the molten solder ejected through each sorting sphere has a convex shape, respectively, but the molten solder ejected through the neighboring sorting spheres are overlapped with each other, so that the primary The shape of the waveform ejected through the nozzle is inclined than the waveform of the molten solder ejected through the secondary nozzle, but the gentle form, that is, the valley (lowest point) between the peak (highest point) and the peak (highest point) of the corrugated wave is clearly formed. To remove the flux gas that is often generated during soldering of printed circuit boards with integrated chip components with high density. It failed to sufficiently secure the (bone between the jet port) remnants of the gas is accumulated in the chip components of the printed circuit board has a problem of generating US napttaemreul.

In addition, during the soldering process of the printed circuit board, a precipitate is generated and the melt is ejected together when the molten solder is ejected through the spout of the primary nozzle, due to the gentle wave shape of the molten solder ejected through the primary nozzle. Sediment continues to accumulate in the solder tank between the flow splitters and the deposit is hardened by carbonization of the slug component of the flux when the deposit is kept at a high temperature for a long time. There is a problem that the soldering defect is generated in the printed circuit board.

In addition, due to the gentle wave shape of the blown molten solder does not penetrate every corner of the chip component of the lower portion of the printed board, there is a problem that does not form a perfect solder and unsolder solder is generated.

In order to solve the problems of the primary nozzle of the automatic soldering apparatus as described above, the following method has been proposed.

First, the soldering method and the soldering apparatus disclosed in Japanese Patent Laid-Open No. 2002-368405 shown in FIG. 15 are equipped with a nozzle cylinder having a jet port for generating a Z wave of molten solder.

The nozzle cylinder has a dome-shaped upper surface, and has two rows of ejection openings, and the ejection openings are formed in a zigzag shape, and the waveform of the molten solder classified through each ejection opening is abruptly inclined because the side of the nozzle cylinder is formed in a rounded shape. However, since the height of the waveform has a height similar to that of a general flat plate, there is a problem of unsoldered parts due to the penetration of a printed circuit board having a multi-density chip component, and the nozzle cylinder is formed in a dome shape. Can not form more than two rows of molten solder is ejected is limited, there is a problem that a small amount of solder on the printed circuit board, there is a problem that can remove the flux gas generated during the soldering of the printed circuit board Insufficient passage (corrugation between the spouts) can cause gas residue to accumulate on the chip components of the printed board. There is the problem that caused the US napttaemreul.

In the primary nozzle spring water vortex sorting apparatus of the automatic soldering machine disclosed in Korean Patent No. 202149 shown in FIG. A plurality of holes formed in a wave shape (zigzag form) to be formed, and a groove for preventing the hole from being blocked by the lead is formed, the groove has a structure formed so that 3/1 of the respective holes overlap each other. .

The primary nozzle spring water vortex sorting device of the automatic soldering machine prevents the hole from clogging because the groove is formed in the left and right directions so that a part of the hole overlaps, but the wave of the molten solder does not have a sharp inclination due to the formation of the groove. There is a problem that can not be soldered to the precise portion of the printed board because it has a gentle form.

In addition, the soldering method and classification solder bath of the printed circuit board disclosed in Korean Patent Laid-Open Publication No. 2003-0043615, the primary classification nozzle is composed of a base and a sowing portion, a rectifying plate having a plurality of holes is formed in the lower portion of the base, the sowing portion It has a structure connected to the base.

The waveguide according to the first embodiment of the soldering method and the classification solder tank of the printed board is formed with a wave plate having a plurality of holes formed thereon, the molten solder is classified through the hole of the wave plate, according to the second embodiment The sowing part consists of a pair of nozzle plate and a pair of nozzle side plate, the upper part between the pair of nozzle plate is very narrow and the lower part is formed wide so that a long bar is installed in the narrow part of the upper part, and both ends of the bar are formed by a spring. When a small force is applied, the molten solder is sorted by rotation. The waveguide according to the third embodiment includes a nozzle plate and a nozzle side plate having the same structure as in the second embodiment, and a pair of nozzle side plates are provided between the nozzle side plates. A slit forming member is installed so that one side of the slit forming member roughens the molten solder, and the other slit forming member separates the molten solder from side to side. Uh, the first embodiment is suitable for soldering a land portion of a printed board, the second embodiment is suitable for a corner portion of a component mounted on a rear surface of a printed board, and the third embodiment is thin for a laminated board. It has characteristics suitable for through holes.

However, since the waveguide plate of the waveguide according to the first embodiment has a general flat plate shape, the ejection form of the molten solder has a gentle curve, which forms a gentle wave shape similar to that of the prior art. .

In addition, the waveguide according to the second embodiment ejects the molten solder between the rods. Since the rods are fixed by a spring, the rods are flowed by the flow rate of the molten solder to classify the molten solder. Since the waveform is not constant, there is a problem of not penetrating into the minute portion of the printed circuit board in which the dense chip component is embedded, and the waveguide according to the third embodiment has a thin portion of the molten solder on both sides of the slit forming member. Chip parts can penetrate, but there is a problem that a sufficient amount of solder is not supplied.

In addition, when soldering a variety of printed circuit boards having different characteristics, it is necessary to replace the sowing part according to the characteristics of the printed board, there is a problem that the soldering operation is inconvenient.

The present invention was devised to solve the conventional problems as described above, an object of the present invention is to form a jet sphere of the nozzle plate for forming a solder wave is formed in a zigzag form, the jet sphere is formed with a cylinder to the top, The solder wave sorted through the splitter has a steep inclination, and the soldering of the printed circuit board containing the chip components with the multi-distribution density can be effectively performed to prevent the occurrence of unsoldered solder and the flux gas before the ejection of the molten solder. The present invention provides a nozzle of a soldering apparatus, which is provided with a passage through which smoothly escapes, to prevent the occurrence of a solder short, and to prevent a spout from clogging even if deposits accumulate between the spouts, thereby completing a high-quality printed circuit board.

In addition, another object of the present invention is to provide a nozzle of a soldering apparatus which is provided with a variable nozzle that can adjust the height of the splitter in the nozzle plate for forming the solder wave, can freely adjust the ejection height and the ejection range of the molten solder have.

1A is an exploded perspective view showing the structure of a nozzle of a soldering apparatus according to a first embodiment of the present invention;

1B is an enlarged perspective view of the nozzle plate illustrated in FIG. 1A;

2A is a perspective view showing a state in which a nozzle of a soldering apparatus according to a first embodiment of the present invention is installed in an automatic soldering apparatus;

FIG. 2B is a front sectional view showing a state in which molten solder is ejected by FIG. 2A;

3A and 3B are cross-sectional views illustrating a solder wave ejected through a nozzle plate and a printed circuit board soldered through the nozzle;

4A and 4B are perspective views of a nozzle plate showing a state in which one side of a cylinder formed in the nozzle plate according to the first embodiment of the present invention is partially or entirely cut;

5A and 5B are cross-sectional views showing waveforms of solder waves ejected through the nozzle plate shown in FIGS. 4A and 4B;

6 is a perspective view showing the structure of a nozzle of a soldering apparatus according to a second embodiment of the present invention;

7 is a cross-sectional view showing a waveform of molten solder ejected through the nozzle plate shown in FIG.

8 is an exploded perspective view showing another structure of the nozzle plate according to the second embodiment;

9A, 9B, and 9C are perspective views illustrating a state in which the variable nozzles shown in FIG. 8 are fixed to different heights, respectively;

10A, 10B, and 10C are cross-sectional views illustrating waveforms of molten solder ejected through FIGS. 9A, 9B, and 9C, respectively;

10D is a cross-sectional view illustrating a printed board to be soldered when the positions of the variable nozzles installed at the two ends of the support nozzles are different;

FIG. 11 is an exploded perspective view illustrating a cylinder formed on the nozzle plate of FIG. 8;

12 is a perspective view illustrating a state in which the variable nozzle of FIG. 11 is installed at the same height as the support end;

FIG. 13 is a perspective view illustrating a waveform of a solder wave ejected through FIG. 12;

14 is a cross-sectional view showing a waveform of molten solder ejected through a nozzle of a general soldering apparatus,

15 and 16 are perspective views showing nozzles of a soldering apparatus used in the related art.

* Description of the symbols for the main parts of the drawings *

1: solder tank 2: primary nozzle

3: secondary nozzle 4: power unit

5: impeller 6: printed board

7: heater 8: molten solder

9: solder wave 11: impeller tube

12: Top 14: Solder Jetting Part

15: Upper part open part 16: Lower part open part

17: side wall 18, 19: flange

20: nozzle 21: flange

22: bending 23: classification sphere

24, 25: cylinder 26: cutting

30: nozzle plate 31: flange

32: bending end 33: support

34: Category 35: Supporting end

36: guide groove 37: coupling hole

38: Cylinder 40: Variable nozzle

41: recess groove 42: insertion hole

50: adjustment member

SUMMARY OF THE INVENTION An object of the present invention is a nozzle of a soldering apparatus for ejecting molten solder in a wave form from a solder bath, wherein a plurality of flow holes are formed in a flat nozzle plate provided on an upper portion of the solder bath; The splitter is arranged in a plurality of rows of zigzag shapes with respect to the longitudinal direction of the nozzle plate; The upper part of the splitter is achieved by a nozzle of a soldering apparatus, characterized in that the cylinder communicating with the inside of the solder tank protruded.

In addition, the fractionation sphere and the cylinder formed in the nozzle plate is formed by an even number of rows, the pair of opposing cylinders is achieved by the nozzle of the soldering apparatus, characterized in that the inner portion is partially or entirely cut about the center.

Further, in a nozzle of a soldering apparatus for ejecting molten solder in a wave form from a solder bath, a nozzle end provided on an upper portion of the solder bath has a support end protruding in a longitudinal direction to have a step with an upper surface thereof; A pair of splitters is formed in each of the support ends; The pair of nozzles is achieved by a nozzle of a soldering apparatus, characterized in that arranged in a zigzag form staggered with each other.

In addition, the support end is formed with a concave guide groove in the longitudinal direction so that a pair of splitter is a semi-circular shape, the coupling hole is formed in the front and rear ends of the guide groove; The nozzle plate is formed in the same size as the guide groove, semicircular concave grooves are formed in a zigzag form on both sides so that the splitter is in a circular shape, and a coupling hole is formed in the front and rear ends thereof to the guide groove. A variable nozzle to be inserted; And a control member inserted into the coupling hole so that the variable nozzle is moved in the guide groove.

In addition, the outer side of the pair of spout facing the support end is achieved by the nozzle of the soldering apparatus, characterized in that the cylinder is projected.

In addition, the cylinder is achieved by the nozzle of the soldering apparatus, characterized in that the outer peripheral surface is formed in a tapered form toward the top.

Hereinafter, with reference to the accompanying drawings, the nozzle of the soldering apparatus according to the present invention that can be specifically carried out the object and the configuration and embodiments will be described in detail. In particular, the embodiment of the nozzle of the soldering apparatus according to the present invention is applied to the primary nozzle 2 which generates the solder wave 9 in the automatic soldering apparatus equipped with the primary nozzle 2 and the secondary nozzle 3. It shall be.

1A is an exploded perspective view showing the structure of a nozzle of a soldering apparatus according to a first embodiment of the present invention, and FIG. 1B is an enlarged perspective view of the nozzle plate of FIG. 1A, and the primary nozzle 2 is a solder ejecting portion ( 14) and the nozzle plate 20, wherein the solder ejection portion 14 is fixed to the impeller tube 11 installed into the solder tank 1.

The impeller tube 11 is installed inside the solder tank 1, and the impeller 5 is connected to the power unit 4 and rotates inside the impeller tube 11. In addition, an inlet (not shown) is formed on an outer circumferential surface of the impeller tube 11 so that the molten solder 8 contained in the solder tank 1 flows in, and the upper surface 12 has molten solder contained in the solder tank 1. An opening (not shown) of the same size as the lower open portion 16 of the solder ejection portion 14 is formed so that 8 is introduced into the solder ejection portion 14 described later.

The solder ejection portion 14 is formed in a rectangular parallelepiped shape in which upper and lower portions are opened for ejecting the molten solder 8 contained in the solder bath 1, and the upper open portion (8) is formed to effectively eject the molten solder (8). 15 is formed with a smaller area than the lower opening 16, the side wall 17 is formed to be inclined, and the bolt hole for fixing the nozzle plate 20 to be described later is formed at the front and rear ends of the upper opening 15 A flange 18 is formed to extend, and the flange 19 formed with a bolt hole extending outward so as to be perpendicular to each side wall 17 on all sides of the lower opening portion 16 is formed, and the solder ejection portion 14 is formed. ) Is seated on the impeller tube 11 is fixed by bolts.

The nozzle plate 20 shown in detail in FIG. 1B is a means for causing the molten solder 8 ejected through the solder ejection portion 14 to have an abrupt waveform and ejected to the outside. Silver is formed in the shape of a flat plate having the same size as the size of the upper opening 15 of the solder ejection portion 14, and the nozzle plate 20 is formed at the front and rear ends of the flange of the solder ejection portion 14. A flange 21 having a bolt hole is formed to extend in contact with and to be fixed to 18), and at both ends thereof, a bent end 22 vertically bent downward so that the nozzle plate 20 is seated on the solder ejection portion 14. This extension is formed, and a plurality of flow holes 23 are formed on the upper surface thereof so that the molten solder 8 ejected through the solder ejection portion 14 is sorted to the outside.

The splitter 23 is formed to have a plurality of rows in the longitudinal direction of the nozzle plate 20, and when the splitter 23 is viewed in pairs of two rows, the splitter 23 faces the pair. ), The sorting holes 23 are arranged in a staggered manner so that they are alternate with each other, and the sorting holes 23 arranged in the width direction when the rows of the sorting holes 23 are formed in two or more pairs have a wide interval. That is, it is preferable that the space | interval between the sorting slots 23 arrange | positioned in the width direction is 8-10 mm, and the inner diameter of the sorting slot 23 has about 4-5 mm.

In addition, a cylinder 24 having a cylindrical shape is formed on the upper portion of the splitter 23 to have a predetermined height while communicating with the inside of the solder tank 1.

The cylinder 24 has an inner circumferential surface having the same diameter as the inner circumferential surface of the splitter 23, the height is formed to a height of about 2.5 ~ 3.5mm, the nozzle plate 20 has an embossed form of the overall shape is convex It is worn. In addition, the outer circumferential surface of the cylinder 24 is inclined from the upper end to the lower end, that is, formed in a tapered shape toward the upper end, and the molten solder 8 ejected through the splitter 23 is a protruding cylinder ( The molten solder 8, which is ejected in the form of high peaks by 24) and which is ejected and falls, flows downward while contacting the inclined outer circumferential surface of the cylinder 24, so that the nozzle 23 of the nozzle plate 20 is discharged. And the solder wave 9 ejected through the cylinder 24 has a rough waveform having a large difference between the highest point and the lowest point.

2A is a perspective view showing a state in which a nozzle of a soldering apparatus according to the first embodiment of the present invention is installed in an automatic soldering apparatus, and FIG. 2B is a front sectional view showing a state in which molten solder is ejected by FIG. 2A.

The nozzle of the soldering apparatus according to the first embodiment of the present invention is installed in the primary nozzle 2 of the automatic soldering apparatus. Here, the automatic soldering apparatus is a soldering tank (1) having a heater (7) installed at an inner circumference of the solder 7 to apply flux to a portion to be soldered and to solder the printed circuit board 6 transported in a dried state. Inside the 1), the primary nozzle 2 and the secondary nozzle 3 are installed in the conveying direction of the printed circuit board 6, and the molten solder 8 is transferred to the primary nozzle 2 and the secondary nozzle 3. Each power unit 4 and impeller 5 are installed to supply

First, when the impeller 5 is rotated by operating each power unit 4 while the heater 7 installed in the solder tank 1 is operated to melt the solder, the molten solder 8 is the primary nozzle 2. And starting to be ejected into the secondary nozzle 3, the solder wave 9 generated by the primary nozzle 2 is ejected in the form of an abrupt wave, and the molten solder 8 is ejected by the secondary nozzle 3. ) Is ejected in the form of a gentle wave so as to be almost flat, and the printed circuit board 6 coated with flux (fulx) is conveyed by the conveyor to solder the chip component.

FIG. 3A is a cross-sectional view showing a waveform of molten solder that ejects the nozzle plate shown in FIG. 1. The nozzle 23 of the nozzle plate 20 is formed in a zigzag shape and has an upper portion of the nozzle 23. The furnace pillar-shaped cylinder 24 is formed to protrude, so that the molten solder 8 is soared upward by the height of the cylinder 24 to be ejected with a large drop.

The waveform of the molten solder according to FIG. 3A is compared with the flat nozzle plate shown in FIG. 14 as follows. At this time, the thickness of the nozzle plate 20 and the conventional nozzle plate 70 of the present invention has the same thickness as Amm (A = positive number), and the molten solder 8 ejected by the rotational force of the impeller 5 The pressure has the same pressure.

The molten solder 8 ejected through the conventional nozzle plate 70 is ejected through the fractionation port 71 formed in the plate plate nozzle plate 70, so that the ejection height of the molten solder 8 is about 2A. Is blown out.

On the other hand, in the molten solder 8 ejected through the nozzle plate 20 of the present invention, the height of the cylinder 24 formed in the nozzle 23 of the nozzle plate 20 is B (B = positive number). Assuming, the height of the cylinder 24 ejected through the nozzle plate 20 of the present invention is ejected to a height of about 2 (A + B), so that the highest point (peak) of the solder wave 9 is X ₁ . It is formed at the position and has a sharp difference from the conventional nozzle plate 20 and is formed high, so that the lowest point, which is a valley portion between the ejection peak (highest point) and the peak (highest point), is naturally formed deep in the position of Y ₁ The waveform of the solder wave 9 is shown in the form of an abrupt waveform with a large drop of the highest point and the lowest point.

Then, the highest point of the solder wave 9 is formed at the position of X ₁ which is the center position of the splitter 23 and the cylinder 24, and the lowest point is Y ₁ between the cylinder 24 and the cylinder 24. As shown in FIG. 3B, the overall shape of the solder wave 9 ejected through the nozzle plate 20 is formed to swing at a predetermined height and range, so that a chip component having a multidistribution density is formed. It easily penetrates into the mounted printed board 6 and soldering is completed perfectly.

In addition, the molten solder 8 ejected from the cylinder 24 has a large inclination and falls and immediately flows the sediment accumulated on the upper surface of the nozzle plate 20 by the drop acceleration to the solder bath 1, The sorting port 23 is prevented from being blocked.

4A is a perspective view showing another form of the nozzle plate according to the first embodiment of the present invention, and is a perspective view of the nozzle plate showing a state in which one side of the cylinder formed in the splitter is partially cut.

In the nozzle plate 20, two pairs of sorting holes 23 arranged in a staggered manner are staggered from each other, and each of the sorting holes 23 is formed with a columnar cylinder 25 protruding upward. The pair of opposing cylinders 25 has a cut 26 in which walls facing inwardly are cut to a predetermined length about a diameter across the center of each cylinder 25. That is, the nozzle plate 20 is a state in which the inside of the cylinder 25 formed in each of the sorting holes 23 is cut 2/1 or more, based on a pair of sorting holes 23 formed in zigzag.

In addition, as shown in FIG. 4B, the cylinder 25 formed in the facing spout 23 has a cut portion 26 in which an entire wall facing inwardly is cut about a diameter across the center of each cylinder 25. Is formed, the cylinder 25 may be semi-circular.

FIG. 5A is a cross-sectional view illustrating waveforms of molten solder ejected through the nozzle plate of FIG. 4A. Four nozzles 25 are formed in the nozzle plate 20 to sequentially sequence the rows of the cylinders 25. When referred to as a row, two rows, three rows, and four rows, since the cut portions 26 having a length shorter than the outer side are formed on the inner side of the first row and the second row, the walls of the cylinders 24 of the first row and the second row facing each other The molten solder 8 ejected through the outside of the cylinder 25 is moved outward and positioned at X ₂ of a slightly lower height than X ₁ , which is the highest point of the solder wave 9 formed in FIG. 2C. The molten solder 8 ejected to the outside of the wall has a steep inclination and is ejected from the inside of the wall because the highest point of the solder wave 9 ejected through the first and second rows of cylinders 25 is moved to X ₂ . Overlapping portions of the molten solder 8 ejected through the Lowest point is slightly below the solder wave (9) to reach the position of the Y ₂ than Y ₁ is shown in the form of a smooth wave that has a wide range of ejecting a whole.

Therefore, the solder wave 9 ejected from the cylinders 24 of the 1st and 2nd row or the 3rd and 4th row which are the pairs which face each other is located at the outermost point (peak) low, and the smooth wave form with wide space | interval between peaks is formed. Since the printed circuit boards 6, in which the lands of the chip parts are widely formed, are easily soldered, and the cylinders 24 in the two rows and three rows adjacent to each other are not cut, so that the outer walls are not adjacent to each other. Since the waveform of the molten solder 8 formed by this has a steep inclination and the peaks and valleys have a large drop, the solder gas can be easily prevented and the generation of the solder short can be prevented.

FIG. 5B is a cross-sectional view illustrating a waveform of molten solder ejected through the nozzle plate of FIG. 4B, wherein a cylinder formed in the nozzle of the nozzle plate is formed in a semicircle to form a solder wave ejected through the nozzle and the cylinder. The waveform of the shape is more gentle than the waveform of FIG. 5A.

6 is a perspective view showing the structure of the nozzle of the soldering apparatus according to the second embodiment of the present invention, wherein the primary nozzle 2 is composed of a solder ejection portion 14 and a nozzle plate 30, and the solder ejection portion (14) is fixed to the impeller tube (11) provided inside the solder bath (1). In particular, the impeller tube 11 and the solder ejection portion 14 provided inside the solder tank 1 have the same structure as the first embodiment of the present invention, and the primary nozzle 2 of the same automatic soldering apparatus. It will be installed and working on.

The nozzle plate 30 is a means for causing the molten solder 8 ejected through the solder ejection portion 14 to be ejected to the outside with a sharp waveform, and the nozzle plate 30 is the solder ejection portion 14. It is formed in the form of a flat plate having the same size as the size of the upper opening 15 of the, and the front and rear ends of the bolt so that the nozzle plate 30 is fixed to the flange 18 of the solder ejection portion 14 A flange 31 having a ball is formed to extend, and at both ends thereof, a bent end 32 vertically bent downward is formed so that the nozzle plate 30 is seated on the solder ejection portion 14. The support end 33 which has a shape of and protrudes upward is formed in a plurality of rows.

The pair of sorting holes 34 formed in two rows are formed in the support end 33 in a zigzag manner, that is, the sorting holes 34 are punched in the support end 33 protruding upward from the nozzle plate 30. ) Has a height higher than that of the general flat type sorter, so that the highest point of the molten solder 8 ejected through the sorting tool 34 is ejected higher than that of the general flat type sorter.

FIG. 7 is a cross-sectional view illustrating a state in which the nozzle plate illustrated in FIG. 6 is installed in a primary nozzle to eject molten solder.

In each of the two rows of support ends 33 formed in the nozzle plate 30, a pair of flow holes 34 are zigzag-punched, so that the molten solder 8 is high in proportion to the height of the support end 33. The top end of the solder wave 9 is formed at Z ₁ , which is the center of the splitter 34, because the support end 33 is ejected and is flat.

In addition, since the molten solder 8 overlaps the inside of the solder wave 9 ejected from the pair of split holes 34, the lowest point is formed at the position of W ₁ , and the split holes 23 in the second and third rows are provided. The solder wave 9 to be ejected is overlapped on the upper surface of the nozzle plate 20 between the support end 35 and the support end 35, so that the intersection point is formed at the position of T ₁ lower than W ₁ , so that the solder wave The overall waveform of (9) is formed in the form of two convex peaks, and the upper part has a slightly swinging shape, so that the soldering on the printed circuit board 6 having the multi-distribution density chip components is completed. .

8 is a perspective view showing another structure of the nozzle plate 30 according to the second embodiment of the present invention, wherein the nozzle plate 30 has a support end 35 having a guide groove 36 and a variable nozzle 40. ) And the adjusting member 50.

On the support end 35 protruding from the upper surface of the nozzle plate 30, two rows of split holes 34 through which the molten solder 8 is ejected are perforated in a zigzag form, and a central portion of the support end 35 is formed. Is a guide having a predetermined depth to the bottom so that the inner side of the facing splitter 34 is cut and left in a semicircle shape, and is cut in the longitudinal direction of the support end 35 to have a yaw shape. Grooves 36 are formed.

The front and rear ends of the guide groove 36 are formed with coupling holes 37 into which the adjustment members 50 to be described later are inserted, respectively, and threaded bones are formed on the inner circumferential surface of the coupling holes 37 to guide the grooves. When the variable nozzle 40 to be described later to 36 is installed, the adjusting member 50 is inserted into the coupling hole 37 of the support end 35 and the coupling hole 42 of the variable nozzle 40. .

The variable nozzle 40 is to adjust the waveform of the molten solder 8 is inserted into the guide groove 36 of the support end 35 and ejected, the guide groove 36 to be inserted into the guide groove 36 Is formed in a shape corresponding to the shape of the guide groove 36, but is formed to have a thickness smaller than the sidewall thickness of the guide groove 36, so that the upper surface of the support end 35 is protruded when inserted into the guide groove 36. .

In addition, the variable nozzle 40 has a semi-circular shape on both left and right sides of the variable nozzle 40 so that the sorting hole 34 of the support end 35 maintains a circular shape when inserted into the guide groove 36. Concave groove 41 is formed in a zigzag, and formed at the same position as both side coupling hole 37 of the guide groove 36 at the front and rear ends of the variable nozzle 40, the guide groove 36 The coupling hole 42 having a larger diameter than that of the coupling hole 37 is formed in the hole, and the adjustment member 50 is inserted therein.

The adjusting member 50 is a means for moving the variable nozzle 40 installed at the support end 35 so as to be arranged in a vertical direction when the variable nozzle 40 is inserted into the guide groove 36. Since the variable nozzle 40 has to be moved up and down after being inserted into the coupling holes 37 and 42, the coupling hole of the guide groove 36 has a length longer than that of the coupling holes 37 and 42 arranged in a line. Corresponding to 37) is formed in the form of bolts formed with threads on the outer peripheral surface.

In order to move the variable nozzle 40 by installing the variable nozzle 40 in the guide groove 36 of the support end 35, the adjusting member 50 and the variable nozzle 40 are fixedly coupled. Should be, the adjustment member 50 and the nozzle plate 20 should be in a screwed state. However, since the inner circumferential surface of the coupling hole 42 of the variable nozzle 40 has a diameter larger than that of the outer circumferential surface of the adjustment member 50, the adjustment member 50 is attached to the coupling hole 42 of the variable nozzle 40. Inserted and fixed by a fixing means such as a washer (washer), the variable nozzle 40 is fixed to the control member 50 is inserted into the guide groove 36 while inserting the control member 50 to the guide groove 36 When screwed into the coupling hole 37 of the), since the adjustment member 50 is rotatably fixed in the coupling hole 42 of the variable nozzle 40, the adjustment member 50 is a guide groove When descending along the coupling hole 37 of 36, the variable nozzle 40 is also lowered together.

Therefore, when the adjusting member 50 is adjusted in a clockwise or counterclockwise direction, the adjusting member 50 is elevated along the coupling hole 37 of the guide groove 36 and is fixedly coupled to the adjusting member 50 accordingly. The variable nozzle 40 is also movable up and down, and the variable nozzle 40 is in a state in which it is in equilibrium with the upper surface of the support end 35, as shown in FIGS. 9A, 9B, and 9C. The molten solder is ejected by adjusting the height of the variable nozzle 40 according to the chip component mounted on the printed circuit board 6, since the position can be changed from the lowered state to the raised end of the support end 35. The waveform of (8) can be adjusted.

10A, 10B, and 10C are cross-sectional views showing waveforms of molten solder sorted through the nozzle plates shown in FIGS. 9A, 9B, and 9C.

10A shows the same effect as the nozzle plate 30 shown in FIG. 6 in a state where the variable nozzle 40 is in a plane with the upper surface of the support end 35. The peak of the solder wave 9 ejected from the splitter 34 is formed at Z ₁ , which is the center of the splitter 34, while the solder wave 9 flowing inside the facing splitter 34 melts. the crossing of the solder wave (9) flowing the solder (8) is overlapped between the support end is formed at the position of W is small, the free fall of the peaks and valleys flop _1, 35 and the supporting stage 35 is of T ₁ Formed in position.

10B is a cross-sectional view illustrating a state in which the molten solder is ejected while the variable nozzle is lowered along the guide groove of the support end, and the pair of flow holes 34 facing the support end 35 are variable nozzles ( 40 is lowered so that the support end 35, which is the outer side of the spout 34, is protruded, and the highest point of the solder wave 9 ejected through the pair of spout 34 is outward from Z ₁ . Formed at a position of Z _{2 that} is moved and slightly lower, and because the peak of the solder wave 9 has moved to Z ₂ , the width between the peak and the peak of the solder wave 9 becomes wider and the lower point is slightly lower than W ₁ . The solder wave 9 which is formed at a lower position of W ₂ and flows between the support end 35 and the support end 35 has the highest point formed at Z ₂ and the intersection point formed at a position of T ₂ higher than T _1. Thus, the solder wave 9 has a low overall height The above is displayed in large gentle waveform.

10C is a cross-sectional view illustrating a state in which the molten solder is ejected while the variable nozzle is raised along the guide groove of the support end, and the pair of flow holes 34 facing the support end 35 are variable nozzles ( 40 is raised so that the inner side protrudes, and the highest point of the molten solder 8 ejected through the pair of outlets 34 is moved inward from Z ₁ and is formed at a position of slightly higher Z ₃ , Since the peak of the molten solder 8 wave is moved to Z ₃ , the width between the peak and the peak of the solder wave 9 is narrowed and the lowest point is increased to be formed at the position of W ₃ higher than W ₁ , and the support The solder wave 9 flowing between the end 35 and the support end 35 has the highest point formed at Z ₃ and the intersection point formed at the position of T ₃ lower than T ₁ , so that the solder wave 9 has a large acid as a whole. Has a convex waveform of the form, Cross is displayed as a turbulent wave.

FIG. 10D is a perspective view illustrating a state in which a printed circuit board conveyed in an inclined state by molten solder that is fixed and ejected at two different positions of the variable nozzles provided at two support ends formed on the nozzle plate is soldered. Here, the support end 35 of the first row formed on the nozzle plate 30 is referred to as the support end F, and the support end 35 of the second row is arbitrarily referred to as the support end S.

The variable nozzle 40 installed at the support end F 35 of the first row is lowered to the lower portion of the center guide groove 36 so that the outside of the variable nozzle 40 is ejected through the splitter 34. The highest point of 9) is formed at the position of Z ₂ , and the lowest point between the peaks is formed at W ₂ , so that the solder wave 9 ejected through the supporting end F 35 has a large area and has a gentle waveform as a whole. Will have

The variable nozzle 40 installed in the support end S 35 of the second row rises to the upper portion of the guide groove 36 in the center, and the inside of the variable nozzle 40 is ejected through the splitter 34. ) Is formed at the position of Z ₃ , and the lowest point between the peaks is formed at W ₃ so that the solder wave 9 ejected through the support end S 35 has a central convex portion and an inclined outer portion as a whole. You will have a sudden waveform.

The solder wave 9 jetted between the support end F 35 and the support end S 35 is at the position of W ₂ where the highest point of the support end F 35 is formed outside and lower than W ₁ , the support only the peak of the S (35) is because the position of the W ₃ formed inside and above the W _1, the support stage F (35) and the support stage crossing of S (35) is substantially the same T ₁ 'and T ₁ of Formed in position.

Therefore, the support end F 35 ejects the molten solder 8 in a wide and gentle form, and the support end S 35 ejects the molten solder 8 in a high and narrow convex form, thereby reducing the size of the chip component. When soldering the variously mounted printed circuit board 6, the solder wave 9 having a different waveform can completely solder the printed circuit board 6 on which the various chip components are mounted.

FIG. 11 is a perspective view illustrating a cylinder formed on an upper part of a nozzle formed in the nozzle plate of FIG. 8, wherein the nozzle plate 30 has a guide groove 36 having the same structure and shape as the nozzle plate 30 of FIG. 8. The support end 35 and the guide groove 36 formed therein is made of a variable nozzle 40 and a control member 50 for adjusting the position of the variable nozzle 40, the support end 35 The cylinder 38 protrudes from the upper part of each sorting hole 34 which has a semicircle by the guide groove 36 formed in the figure.

FIG. 12 is a perspective view illustrating a state in which a variable nozzle is installed in a guide groove of the nozzle plate, and FIG. 13 is a cross-sectional view illustrating molten solder ejected through a nozzle of the nozzle plate illustrated in FIG. 12. The variable nozzle 40 is installed in the) is fixed to be in parallel with the upper surface of the support end 35, so that the outer side of the pair of facing flow spherical 34 is protruded by the cylinder 38.

Thus, the highest point of the solder wave 9 ejected through the pair of split holes 34 and the cylinder 38 facing the support end 35 is moved outwardly from Z ₁ by the projecting cylinder 38. And formed at a higher Z ₄ position, and because the peak of the solder wave 9 has moved to Z ₄ , the solder wave 9 has a steep slope while the width between the peak and the peak of the solder wave 9 is wide. And a deeper valley is formed so that the lowest point is formed at the position of W ₄ lower than W ₁ , and the solder wave 9 flowing between the support end 35 and the support end 35 is formed by the cylinder 38. The peak is formed in Z ₄ moved outward so that the solder wave 9 has a larger inclination and descends so that the intersection point is formed at a position of T ₄ lower than T ₁ , so that the solder wave 9 has a large mountain shape as a whole. Has a convex waveform of, the top of the You will have a rocking waveform.

In addition, the waveform of the solder wave 9 ejected by the cylinder 39 may be adjusted higher or lower by adjusting the position of the variable nozzle 40 of the support end 35.

According to the nozzle of the soldering apparatus according to the present invention, a pillar-shaped cylinder protrudes from a nozzle arranged in a row in a zigzag pattern on a nozzle plate, and the jet shape of the molten solder is convex by a nozzle and a cylinder formed in a zigzag shape. Solder wave having a deeper valley between the peaks is formed, and the flux gas is smoothly removed when soldering the printed circuit board to prevent unsoldering, and the solder wave falls when it falls sharply and has a sharp inclination. Due to the impact force of the acceleration, the wave shape of the appropriate fluctuation is formed as a whole, and the solder wave penetrates into every corner of the printed board on which the chip parts of the multi-distribution density are mounted, thereby providing a soldering device nozzle capable of achieving perfect solderability. .

In addition, the splitter formed in the nozzle plate is formed in an even number of rows, the cylinder of the pair of facing splitter is formed with a cut portion cut part or all of the inside, the solder wave ejected by the splitter and the cylinder is overall low and wide Provided is a nozzle of a soldering apparatus, which is formed in a gentle waveform having a range, and which can easily solder a printed circuit board having a large land of chip parts.

In addition, according to the nozzle of the soldering apparatus according to the present invention, a plurality of support ends are formed on an upper surface of the nozzle plate, and a splitter for ejecting molten solder is formed in a zigzag on the upper surface of the support end, and the molten solder ejected is formed. The solder wave of is formed with a convex waveform having a high ejection height and a wide ejection range, thereby providing a nozzle of a soldering apparatus which easily penetrates into corner portions of a printed circuit board chip part and prevents the occurrence of unsolder.

In addition, the support end is formed with a guide groove which is cut inside the pair of sorting sphere, the variable nozzle having a shape corresponding to the guide groove is inserted into the guide groove is made of a structure that is movable to the adjustment member. According to the adjustment of the adjustment member, the movable nozzle of the variable nozzle can be freely made by moving the movable nozzle freely, so that the solder wave of the molten solder can be variable. Soldering provided a nozzle for the soldering device to complete the perfect product.

In addition, since the fractionation hole and the cylinder formed on the support end are protruded, the molten solder is ejected to the outside by the nozzle plate, the support end, and the cylinder, so that the ejection peak of the solder wave is formed higher and the valley between the peak and the peak is It is formed deeper, the solder wave is easy to penetrate into the corners of the chip component mounted on the printed board to prevent the occurrence of unsoldering, and the variable nozzle of the support end is adjustable to position the waveform of the solder wave Since it can be freely adjusted to provide the nozzle of the soldering device that can complete the perfect product by adjusting the solder wave in accordance with the shape and type of the chip parts mounted on the printed board.

Claims (6)

A nozzle of a soldering apparatus for ejecting the molten solder 8 in a wave form from the solder tank 1, A plurality of dividing holes 23 are formed in the flat plate-shaped nozzle plate 20 provided above the solder bath 1; The spouts 23 are arranged in a plurality of rows of zigzag shapes with respect to the longitudinal direction of the nozzle plate 20; The nozzle of the soldering apparatus, characterized in that the upper portion of the flow outlet (23) protrudes the cylinder (24, 25) in communication with the inside of the solder tank (1). The method of claim 1, The fractionator 23 and the cylinder 25 formed in the nozzle plate 20 are formed in even rows. A pair of opposing cylinders (25) is a nozzle of the soldering apparatus, characterized in that the inner portion is partially or entirely cut about the center. A nozzle of a soldering apparatus for ejecting the molten solder 8 in a wave form from the solder tank 1, A plurality of support ends (33, 35) protruding to have a step with an upper surface are formed in the nozzle plate (30) provided on the solder tank (1) in the longitudinal direction; A pair of sorting holes 34 is formed in each of the support ends 33 and 35; The pair of nozzles (34) is a nozzle of the soldering apparatus, characterized in that arranged in a zigzag form staggered with each other. The method of claim 4, wherein The support end 35 has a concave guide groove 36 is formed in the longitudinal direction such that a pair of splitters are semi-circular, the coupling hole 37 is formed in the front and rear ends of the guide groove 35; The nozzle plate 30, It is formed in the same size as the guide groove 36, semi-circular concave groove 41 is formed in a zigzag form on both sides so that the sorting hole 34 has a circular shape, the coupling hole 42 in the front and rear ends A variable nozzle 40 is formed and inserted into the guide groove 36; And The nozzle of the soldering apparatus, characterized in that the variable nozzle (40) further comprises an adjustment member (50) inserted into the coupling hole (37, 42) so as to move in the guide groove (36). The method according to claim 3 or 4, The nozzle of the soldering apparatus, characterized in that the cylinder (38) is protruded on the outer side of the pair of split holes (34) facing the support end (33, 35). The method according to claim 1 or 4, The cylinder (24, 38) of the nozzle of the soldering apparatus, characterized in that the outer peripheral surface is formed in a tapered form toward the top.