JPS6418569A - Soldering wave former - Google Patents
Soldering wave formerInfo
- Publication number
- JPS6418569A JPS6418569A JP17461587A JP17461587A JPS6418569A JP S6418569 A JPS6418569 A JP S6418569A JP 17461587 A JP17461587 A JP 17461587A JP 17461587 A JP17461587 A JP 17461587A JP S6418569 A JPS6418569 A JP S6418569A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- wave former
- circuit board
- printed circuit
- back wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Abstract
PURPOSE:To solder a printed circuit board of large thermal capacity with a high quality by always feeding the antioxidant liquid having higher m. p. than that of a molten solder onto the molten solder at the part where a printed circuit board is separated from a wave former. CONSTITUTION:A soldering is executed by jetting a molten solder 2 to flow down along the shape of a front wave former 3 and back wave former 4 and traveling a flux 7 coated printed circuit board 1 in an arrow mark direction. At this time the opening part 8 from which the molten solder 2 is flowed down is provided on the back wave former 4, an antioxidant liquid discharging nozzle 6 is installed at the upper part of this opening part 8 and the antioxidant liquid 5 fed by a pump 9 from a tank 10 is discharged into the back wave former 4 from the nozzle 6. Since this antioxidant liquid 5 has smaller specific gravity than that of the solder 2 it is floated on the solder 2 and filled up in the space between the solder 2 and back wave former 4. Even the multilayer printed circuit board having large thermal capacity is soldered without generating a bridge, an icicle, etc.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62174615A JPH0783934B2 (en) | 1987-07-15 | 1987-07-15 | Solder Wave Former |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62174615A JPH0783934B2 (en) | 1987-07-15 | 1987-07-15 | Solder Wave Former |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6418569A true JPS6418569A (en) | 1989-01-23 |
JPH0783934B2 JPH0783934B2 (en) | 1995-09-13 |
Family
ID=15981687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62174615A Expired - Lifetime JPH0783934B2 (en) | 1987-07-15 | 1987-07-15 | Solder Wave Former |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0783934B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06210444A (en) * | 1993-01-14 | 1994-08-02 | Kuroda Denki Kk | Method for soldering by utilizing liquid environment |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6089964U (en) * | 1983-11-18 | 1985-06-20 | ローム株式会社 | jet solder bath |
JPS6216876A (en) * | 1985-07-17 | 1987-01-26 | Tamura Seisakusho Co Ltd | Soldering method |
-
1987
- 1987-07-15 JP JP62174615A patent/JPH0783934B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6089964U (en) * | 1983-11-18 | 1985-06-20 | ローム株式会社 | jet solder bath |
JPS6216876A (en) * | 1985-07-17 | 1987-01-26 | Tamura Seisakusho Co Ltd | Soldering method |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06210444A (en) * | 1993-01-14 | 1994-08-02 | Kuroda Denki Kk | Method for soldering by utilizing liquid environment |
Also Published As
Publication number | Publication date |
---|---|
JPH0783934B2 (en) | 1995-09-13 |
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