JPS6418569A - Soldering wave former - Google Patents

Soldering wave former

Info

Publication number
JPS6418569A
JPS6418569A JP17461587A JP17461587A JPS6418569A JP S6418569 A JPS6418569 A JP S6418569A JP 17461587 A JP17461587 A JP 17461587A JP 17461587 A JP17461587 A JP 17461587A JP S6418569 A JPS6418569 A JP S6418569A
Authority
JP
Japan
Prior art keywords
solder
wave former
circuit board
printed circuit
back wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17461587A
Other languages
Japanese (ja)
Other versions
JPH0783934B2 (en
Inventor
Mitsugi Shirai
Toshitaka Murakawa
Hideaki Sasaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62174615A priority Critical patent/JPH0783934B2/en
Publication of JPS6418569A publication Critical patent/JPS6418569A/en
Publication of JPH0783934B2 publication Critical patent/JPH0783934B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To solder a printed circuit board of large thermal capacity with a high quality by always feeding the antioxidant liquid having higher m. p. than that of a molten solder onto the molten solder at the part where a printed circuit board is separated from a wave former. CONSTITUTION:A soldering is executed by jetting a molten solder 2 to flow down along the shape of a front wave former 3 and back wave former 4 and traveling a flux 7 coated printed circuit board 1 in an arrow mark direction. At this time the opening part 8 from which the molten solder 2 is flowed down is provided on the back wave former 4, an antioxidant liquid discharging nozzle 6 is installed at the upper part of this opening part 8 and the antioxidant liquid 5 fed by a pump 9 from a tank 10 is discharged into the back wave former 4 from the nozzle 6. Since this antioxidant liquid 5 has smaller specific gravity than that of the solder 2 it is floated on the solder 2 and filled up in the space between the solder 2 and back wave former 4. Even the multilayer printed circuit board having large thermal capacity is soldered without generating a bridge, an icicle, etc.
JP62174615A 1987-07-15 1987-07-15 Solder Wave Former Expired - Lifetime JPH0783934B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62174615A JPH0783934B2 (en) 1987-07-15 1987-07-15 Solder Wave Former

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62174615A JPH0783934B2 (en) 1987-07-15 1987-07-15 Solder Wave Former

Publications (2)

Publication Number Publication Date
JPS6418569A true JPS6418569A (en) 1989-01-23
JPH0783934B2 JPH0783934B2 (en) 1995-09-13

Family

ID=15981687

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62174615A Expired - Lifetime JPH0783934B2 (en) 1987-07-15 1987-07-15 Solder Wave Former

Country Status (1)

Country Link
JP (1) JPH0783934B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06210444A (en) * 1993-01-14 1994-08-02 Kuroda Denki Kk Method for soldering by utilizing liquid environment

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089964U (en) * 1983-11-18 1985-06-20 ローム株式会社 jet solder bath
JPS6216876A (en) * 1985-07-17 1987-01-26 Tamura Seisakusho Co Ltd Soldering method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6089964U (en) * 1983-11-18 1985-06-20 ローム株式会社 jet solder bath
JPS6216876A (en) * 1985-07-17 1987-01-26 Tamura Seisakusho Co Ltd Soldering method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06210444A (en) * 1993-01-14 1994-08-02 Kuroda Denki Kk Method for soldering by utilizing liquid environment

Also Published As

Publication number Publication date
JPH0783934B2 (en) 1995-09-13

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