JPS57115970A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS57115970A
JPS57115970A JP56000858A JP85881A JPS57115970A JP S57115970 A JPS57115970 A JP S57115970A JP 56000858 A JP56000858 A JP 56000858A JP 85881 A JP85881 A JP 85881A JP S57115970 A JPS57115970 A JP S57115970A
Authority
JP
Japan
Prior art keywords
solder
nozzle
solder wave
contacts
wave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56000858A
Other languages
Japanese (ja)
Other versions
JPH0117791B2 (en
Inventor
Chuichi Matsuda
Keiji Saeki
Takao Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56000858A priority Critical patent/JPS57115970A/en
Priority to EP81106768A priority patent/EP0055323B1/en
Priority to DE8181106768T priority patent/DE3176527D1/en
Priority to CA000385236A priority patent/CA1159156A/en
Publication of JPS57115970A publication Critical patent/JPS57115970A/en
Priority to US06/920,142 priority patent/US4824010A/en
Publication of JPH0117791B2 publication Critical patent/JPH0117791B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Abstract

PURPOSE:To prevent the generation of soldering defects of chip parts, etc., and to improve the quality of soldering by ejecting molten solder from two pieces of ejection ports in opposite directions, and passing a printed substrate, in such a way that it contacts the molten solder at an upward facing angle. CONSTITUTION:A printed substrate 4 first contacts the solder wave 10 flowing from the 1st nozzle 9 in the same direction as the advance direction. Thence, it contacts the solder wave 12 flowing from the 2nd nozzle 11 in the direction opposite from the advancing direction. In this case, for chip parts 3, the solder wave 12 caused by the nozzle 11 has an effect on the front part 6 with respect to the advancing direction of the substrate 4 and the solder wave 10 caused by the nozzle 9 has an effect on the rear part 8. Since the solder wave 12 by the nozzle 10 and the substrate 4 are inclined with respect to the advancing direction, the excess solder is removed by the solder wave, and normal solder build- ups 7 are obtained.
JP56000858A 1980-12-26 1981-01-06 Soldering method Granted JPS57115970A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP56000858A JPS57115970A (en) 1981-01-06 1981-01-06 Soldering method
EP81106768A EP0055323B1 (en) 1980-12-26 1981-08-29 Apparatus for soldering chip type components
DE8181106768T DE3176527D1 (en) 1980-12-26 1981-08-29 Apparatus for soldering chip type components
CA000385236A CA1159156A (en) 1980-12-26 1981-09-04 Process of soldering printed circuit boards and apparatus employed therefor
US06/920,142 US4824010A (en) 1980-12-26 1986-10-17 Process and apparatus for soldering printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56000858A JPS57115970A (en) 1981-01-06 1981-01-06 Soldering method

Publications (2)

Publication Number Publication Date
JPS57115970A true JPS57115970A (en) 1982-07-19
JPH0117791B2 JPH0117791B2 (en) 1989-04-03

Family

ID=11485348

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56000858A Granted JPS57115970A (en) 1980-12-26 1981-01-06 Soldering method

Country Status (1)

Country Link
JP (1) JPS57115970A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139993A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Method and device for soldering printed board
JPS60106192A (en) * 1983-11-14 1985-06-11 松下電器産業株式会社 Method of soldering printed board
WO2010087374A1 (en) * 2009-01-27 2010-08-05 千住金属工業株式会社 Jet solder bath

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57139993A (en) * 1981-02-23 1982-08-30 Matsushita Electric Ind Co Ltd Method and device for soldering printed board
JPS6257428B2 (en) * 1981-02-23 1987-12-01 Matsushita Electric Ind Co Ltd
JPS60106192A (en) * 1983-11-14 1985-06-11 松下電器産業株式会社 Method of soldering printed board
WO2010087374A1 (en) * 2009-01-27 2010-08-05 千住金属工業株式会社 Jet solder bath
JPWO2010087374A1 (en) * 2009-01-27 2012-08-02 千住金属工業株式会社 Jet solder bath

Also Published As

Publication number Publication date
JPH0117791B2 (en) 1989-04-03

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