JPH0117791B2 - - Google Patents
Info
- Publication number
- JPH0117791B2 JPH0117791B2 JP56000858A JP85881A JPH0117791B2 JP H0117791 B2 JPH0117791 B2 JP H0117791B2 JP 56000858 A JP56000858 A JP 56000858A JP 85881 A JP85881 A JP 85881A JP H0117791 B2 JPH0117791 B2 JP H0117791B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- circuit board
- nozzle
- chip
- jet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 82
- 238000005476 soldering Methods 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 2
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、回路基板等を対象とする半田付方
法、特にチツプ部品を搭載した回路基板を対象と
する半田付方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a soldering method for circuit boards and the like, and particularly to a soldering method for circuit boards on which chip components are mounted.
回路基板に搭載されている部品の半田付方法と
しては一般に噴流式半田付方式が使用されてい
る。噴流式半田付方式とは回路基板を移動させな
がらその半田付面に溶融半田を噴き上げて半田付
を行なうものであり、第１図及び第２図に従来例
として最も一般的な噴流半田波形状を示した。 A jet soldering method is generally used as a method for soldering components mounted on a circuit board. The jet soldering method is a method of soldering by spraying molten solder onto the soldering surface of the circuit board while moving it. Figures 1 and 2 show the most common jet solder wave shape as a conventional example. showed that.
さらに工夫の加えられた半田付装置の先行技術
文献として米国特許4101066、米国特許1099330、
ソ連国特許530487、627934、特開昭50−51449な
どがある。 Prior art documents of soldering devices with further ingenuity include U.S. Patent 4101066, U.S. Patent 1099330,
There are Soviet patents 530487 and 627934, and Japanese Patent Application Laid-open No. 50-51449.
しかし、このような半田波形状は、特に角形の
チツプ抵抗あるいはチツプコンデンサ等のチツプ
部品を搭載した回路基板の半田付において、次の
ような欠点を持つている。 However, such a solder wave shape has the following drawbacks, particularly when soldering circuit boards on which chip components such as square chip resistors or chip capacitors are mounted.
すなわち、第１図の半田波形状は、ノズル１か
ら対称形状の半田波２となつており、チツプ部品
３等が搭載された回路基板４は図の左から右へ移
動するが、半田波２から回路基板４が離れるとき
半田波２は回路基板４の移動方向と同じ方向に流
れ落ちるため、過剰な半田が付物に付着し、急速
に冷却され、第３図に示すようにチツプ部品３の
半田付はつらら状肉盛５となつてしまう。 That is, the solder wave shape in FIG. 1 is a symmetrical solder wave 2 starting from the nozzle 1, and the circuit board 4 on which the chip components 3 etc. are mounted moves from left to right in the figure, but the solder wave 2 is symmetrical. When the circuit board 4 is separated from the circuit board 4, the solder wave 2 flows down in the same direction as the movement direction of the circuit board 4, so that the excess solder adheres to the object and is rapidly cooled, causing the chip component 3 to fall as shown in FIG. Soldering results in icicle-like build-up 5.
次に、このつらら状不良を防止するために第２
図に示す半田波形状を検討した。この半田波形状
は、ノズル１から左方へ、すなわち基板４の進行
方向と逆の方向へ半田波２として流れており、回
路基板４は進行方向に送して上方に傾いて半田波
２を通過している。確かに、この方法では、回路
基板４が半田波２と離れるときには、半田波２は
回路基板４の進行方向と逆の方向に流れ落ち、過
剰な半田が被半田付物に付着することがなく、つ
らら状肉盛５は発生しない。 Next, in order to prevent this icicle-like defect, a second
We investigated the solder wave shape shown in the figure. This solder wave shape flows from the nozzle 1 to the left, that is, in the opposite direction to the traveling direction of the board 4 as a solder wave 2, and the circuit board 4 is sent in the traveling direction and tilts upward to form the solder wave 2. is passing. Indeed, in this method, when the circuit board 4 separates from the solder wave 2, the solder wave 2 flows down in the direction opposite to the direction of movement of the circuit board 4, and excess solder does not adhere to the object to be soldered. Icicle-like overlay 5 does not occur.
しかし、特に回路基板の進向方向に電極を有す
るチツプ部品３に対して片側すなわち、右方から
左方へしか半田波２が作用しないため、第４図に
示すように、チツプ部品の回路基板４の進行方向
に対して前方部６には正常な半田肉盛７が得られ
るが、後方部８には全く半田が付かないことがあ
る。 However, since the solder wave 2 acts only on one side, that is, from the right to the left, on the chip component 3 having electrodes in the advancing direction of the circuit board, as shown in FIG. Although a normal solder overlay 7 is obtained on the front part 6 in the direction of movement of the solder 4, the rear part 8 may not be soldered at all.
例えば米国特許410166は、２つの半田波を利用
しているものの、第２半田波が回路基板の進行方
向に対し同一方向に流れ落ちるため、つらら状肉
盛が発生してしまう。又、英国特許1099330は、
第２ノズルが第１ノズルよりも低いため、つらら
状肉盛半田を除去する効果は得にくい。又第２ノ
ズルの半田圧力を上げると、チツプ部品が脱落す
ることもあることから充分な効果を得ることがで
きない。又ソ連国特許530487及び627934なども、
同様の理由から、チツプ部品への半田付け方法と
して不充分である。 For example, US Pat. No. 4,101,66 utilizes two solder waves, but since the second solder waves flow down in the same direction as the direction of travel of the circuit board, icicle-like build-up occurs. Also, British patent 1099330 is
Since the second nozzle is lower than the first nozzle, it is difficult to obtain the effect of removing the icicle-shaped overlay solder. Furthermore, if the soldering pressure of the second nozzle is increased, the chip parts may fall off, making it impossible to obtain a sufficient effect. Also, Soviet patents 530487 and 627934, etc.
For the same reason, this method is insufficient as a method for soldering chip parts.
又特開昭50−51449は、第２波の半田ノズルの
半田流れを回路基板の進行速度と同等にし回路基
板が離れる地点ではデイツプ状の半田付けを行う
ものであり第１波高か第２波高さより高くさらに
第２波のプリント基板進行方向に半田流れを生じ
させているため、これはチツプ部品電極に対し
て、半田肉盛りが多くなる点で不利である。 In addition, JP-A-50-51449 discloses a method in which the solder flow of the second wave solder nozzle is made equal to the advancing speed of the circuit board, and dip-shaped soldering is performed at the point where the circuit board leaves. This is disadvantageous in that the solder build-up increases with respect to the chip component electrodes because the solder flow is caused to flow higher than the second wave in the traveling direction of the printed circuit board.
以上のような結論になつたのは、前記した片波
噴流の観察からであつた。すなわち、回路基板の
進行方向と逆方向に流れる半田流れで、チツプ部
品電極の進行方向に対して前方の電極６に充分な
半田肉盛７をし、その後、片波噴流の半田溜り部
１４で、チツプ部品が離れる時、半田肉盛が取ら
れるという片波噴流独特な小さなスペースで、半
田付けと半田肉盛を少くするという２つのメカニ
ズムがチツプ部品の半田付け、特に、半田付けの
仕上げ用にする、最終の半田ノズルとして最適で
あると判断するに到つたのである。すなわち、片
波噴流で半田付けして、特に半田付かずの多い、
回路基板の進行方向に対して後方の電極８への半
田付けを行う最小限の半田噴流を前方に設けるこ
とを発明するに致つたのである。すなわち、本発
明は、回路基板を斜め上方に搬送するとともに、
溶融半田を上記回路基板の下面に接触するよう噴
流する第１のノズルと、同第１のノズルと独立し
て回路基板の搬送方向に沿つて配置され、同じく
回路基板の下面に接触するように噴流する第２ノ
ズルを用いて、上記斜め上方に搬送される回路基
板の下面に装着されたチツプ状電子部品の両端に
設けられた電極と回路基板の電導体部とを半田付
する方法において、上記第１のノズルは、溶融半
田を途中で加速することなく、少くとも回路基板
の搬送方向と同一方向に流出させるとともに、第
２のノズルは、同第１ノズルの高さより高い噴出
口を有し、回路基板の進行方向端縁部に半田溜り
を有する片波噴流であり、上記回路基板の搬送方
向と反対方向にのみ流出するようにした半田槽を
用いて、特に回路基板の進行方向に並列に取付け
られたチツプ部品の電極へまず第１ノズルで、回
路基板進行方向に対し、少くともチツプ部品の後
部電極に充分多量に半田付けしその後、第２ノズ
ルを用いて、チツプ部品前部電極に充分多量に半
田付けし、その後、半田溜り部の半田面からチツ
プ部品が出るに伴い、半田肉盛を少くすることを
特徴とする半田付方法である。 The above conclusion was reached from the observation of the one-wave jet described above. That is, the solder flow flowing in the opposite direction to the direction of movement of the circuit board applies sufficient solder overlay 7 to the electrode 6 in front of the chip component electrode in the direction of movement of the chip component electrode, and then the solder pool 14 of the single wave jet is applied. When the chip parts are separated, the solder build-up is removed in a small space unique to the single-wave jet flow, and the two mechanisms of soldering and reducing the solder build-up are useful for soldering chip parts, especially for finishing soldering. We came to the conclusion that it was the best choice for the final solder nozzle. In other words, when soldering with a single wave jet, there are many cases where the solder does not stick.
This invention led to the invention of providing a minimum amount of solder jet in front for soldering to the electrode 8 at the rear with respect to the direction of movement of the circuit board. That is, the present invention conveys the circuit board diagonally upward, and
a first nozzle that jets molten solder so as to contact the bottom surface of the circuit board; In the method of soldering the electrodes provided at both ends of the chip-shaped electronic component mounted on the lower surface of the circuit board conveyed diagonally upward and the conductor part of the circuit board using a second jet nozzle, The first nozzle allows the molten solder to flow out at least in the same direction as the conveyance direction of the circuit board without accelerating it midway, and the second nozzle has an ejection port higher than the height of the first nozzle. However, by using a solder bath which is a single-wave solder jet having a solder pool at the edge of the circuit board in the direction of travel, and which flows out only in the opposite direction to the direction in which the circuit board is transported, it is possible to To the electrodes of the chip parts installed in parallel, first use the first nozzle to solder a sufficient amount to at least the rear electrode of the chip part in the direction of circuit board movement, and then use the second nozzle to solder the front part of the chip part. This is a soldering method characterized in that a sufficiently large amount of solder is applied to the electrode, and then the solder build-up is reduced as the chip component comes out from the solder surface of the solder pool.
以下、図面に従い詳細に説明する。 Hereinafter, a detailed explanation will be given according to the drawings.
第５図に本発明の半田付装置の一実施例による
半田波形状を示す。回路基板４は先ず上向きに傾
斜方向１５に搬送され、第１のノズル９によつて
その進行方向と同じ方向に流れる半田波１０に接
触する。但し、この溶融半田波はノズル中で加速
することのない噴流ポンプ１３の半田圧を利用し
たゆるやかな流れである加速などの手段により半
田波表面が乱れていると、チツプ状電子部品電極
に半田付かず不良が生じてしまうため半田波表面
が層流な状態の流れが好ましい。次いで第２の片
波噴流ノズル１１からその進行方向と逆の方向へ
流れる半田波１２と接触する。１３は噴流用ポン
プのフアンであり、ノズル９，１１より半田を吐
出させるためのものである。この場合、チツプ部
品３は、第６図に示すように、回路基板４の進行
方向に対して前方部電極６はノズル１１による半
田波１２が作用し余剰の半田肉盛が形成される。
又後方部電極８はノズル１０による半田波９が作
用し余剰の半田肉盛りが形成され、かつ第２のノ
ズル１０による半田波１２と回路基板４が進行方
向に対して傾斜していることから半田肉盛りの少
いデイツプ半田槽の傾斜引き上げと同様になり、
余剰な半田は半田溜り１４により除去される。こ
のように、本発明の半田付方法により、正常な半
田肉盛７を得ることができる。 FIG. 5 shows a solder wave shape according to an embodiment of the soldering apparatus of the present invention. The circuit board 4 is first conveyed upward in an inclined direction 15 and is brought into contact by the first nozzle 9 with a solder wave 10 flowing in the same direction as its traveling direction. However, if the surface of this molten solder wave is disturbed by means such as acceleration, which is a gentle flow using the soldering pressure of the jet pump 13 that does not accelerate in the nozzle, the solder may be applied to the chip-shaped electronic component electrode. Since the solder wave surface is laminar, it is preferable to flow the solder wave surface in a laminar flow state, since the solder wave surface may not stick and cause defects. Then, it comes into contact with the solder wave 12 flowing from the second single wave jet nozzle 11 in the direction opposite to the direction of movement thereof. 13 is a fan of a jet pump, which is used to discharge solder from nozzles 9 and 11. In this case, as shown in FIG. 6, in the chip component 3, the solder wave 12 from the nozzle 11 acts on the front electrode 6 in the direction of movement of the circuit board 4, so that an excess solder overlay is formed.
In addition, the solder wave 9 from the nozzle 10 acts on the rear electrode 8, and excess solder build-up is formed, and the solder wave 12 from the second nozzle 10 and the circuit board 4 are inclined with respect to the advancing direction. This is similar to raising the slope of a deep solder tank with little solder build-up.
Excess solder is removed by a solder pool 14. In this manner, a normal solder overlay 7 can be obtained by the soldering method of the present invention.
尚、プリント基板の厚さｔに対し、第１ノズル
の半田波との接触深さは1/2ｔ〜ｔが好ましく、
第２ノズルの半田波との接触深さは1/2ｔ以下に
することが最良である。実施した半田付け装置の
傾斜角度は5゜であるが、4゜〜7゜であれば良い。 In addition, the contact depth of the first nozzle with the solder wave is preferably 1/2t to t relative to the thickness t of the printed circuit board,
It is best that the contact depth of the second nozzle with the solder wave is 1/2t or less. The inclination angle of the soldering device used was 5°, but any angle between 4° and 7° is sufficient.
以上の説明で明らかなように、本発明に従えば
半田付品質が向上し、半田付不良修正のための工
数が大幅に削減できる効果を奏し、その工業的価
値はきわめて大である。 As is clear from the above description, according to the present invention, the soldering quality is improved and the number of man-hours for correcting soldering defects can be significantly reduced, and its industrial value is extremely large.
第１図、第２図は従来の半田付装置による半田
波形状を示す図、第３図、第４図は従来の半田付
装置による半田付不良を示す図、第５図は本発明
の一実施例による半田波形状を示す図、第６図は
本発明による半田付状態を示す図である。第３，
４，６図中のＡはプリント基板の進行方向を示
す。
３……チツプ部品、４……回路基板、７……チ
ツプ部品前方電極、８……チツプ部品後部電極、
９……第１ノズル、１０……プリント基板の進行
方向と同方向の半田波、１１……片波噴流第２ノ
ズル、１２……プリント基板の進行方向と逆方向
の半田波、１３……噴流用ポンプ、１４……半田
溜り、１５……上向き傾斜搬送方向。
FIGS. 1 and 2 are diagrams showing solder wave shapes produced by a conventional soldering device, FIGS. 3 and 4 are diagrams showing soldering defects produced by a conventional soldering device, and FIG. FIG. 6 is a diagram showing a solder wave shape according to an embodiment, and FIG. 6 is a diagram showing a soldering state according to the present invention. Third,
A in Figures 4 and 6 indicates the direction of movement of the printed circuit board. 3... Chip component, 4... Circuit board, 7... Chip component front electrode, 8... Chip component rear electrode,
9... First nozzle, 10... Solder wave in the same direction as the traveling direction of the printed circuit board, 11... Single wave jet second nozzle, 12... Solder wave in the opposite direction to the traveling direction of the printed circuit board, 13... Jet pump, 14...Solder pool, 15...Upward inclined conveyance direction.
Claims (1)
融半田を上記回路基板の下面に接触するよう噴流
する第１のノズルと、同第１のノズルと独立して
回路基板の搬送方向に沿つて配置され、同じく回
路基板の下面に接触するように噴流する第２ノズ
ルを用いて、上記斜め上方に搬送される回路基板
の下面にチツプ状電子部品の両端に設けられた両
電極を結ぶ方向と回路基板の進行方向とが一致す
るように装着されたチツプ状電子部品の上記電極
と回路基板の電導体部とを半田付する方法におい
て、上記第１のノズルは、溶融半田を途中で加速
することなく、少くとも回路基板の搬送方向と同
一方向に流出させるとともに、第２のノズルは、
同第一ノズルの高さより高い噴出口を有し、回路
基板の進行方向端縁部に半田溜りを有する片波噴
流であり、上記回路基板の搬送方向と反対方向に
のみ流出するようにした半田槽を用いて、上記チ
ツプ状電子部品の電極へまず第１ノズルで、回路
基板進行方向に対し、少くともチツプ部品の後部
電極に過剰量半田肉盛し、その後第２ノズルを用
いて、チツプ部品前部電極に過剰量半田肉盛し、
その後、半田溜り部の半田面からチツプ部品が出
るに伴い、上記過剰の半田肉盛を除去することを
特徴とする半田付方法。1. A first nozzle that conveys the circuit board obliquely upward and jets molten solder so as to contact the bottom surface of the circuit board, and a first nozzle that is arranged along the conveyance direction of the circuit board independently of the first nozzle. Similarly, using a second nozzle that ejects a jet so as to come into contact with the bottom surface of the circuit board, a direction connecting both electrodes provided at both ends of the chip-shaped electronic component and the circuit board is placed on the bottom surface of the circuit board that is being conveyed diagonally upward. In the method of soldering the electrode of the chip-shaped electronic component mounted so that the traveling direction of the solder coincides with the conductor part of the circuit board, the first nozzle is configured to solder the molten solder without accelerating the molten solder midway. , at least in the same direction as the conveyance direction of the circuit board, and the second nozzle,
The jet has a jet nozzle higher than the height of the first nozzle, and has a solder pool at the edge of the circuit board in the direction of travel, and is a single-wave jet flow that allows the solder to flow out only in the direction opposite to the direction in which the circuit board is transported. Using a bath, first apply an excessive amount of solder to the electrodes of the chip-shaped electronic component using the first nozzle, at least to the rear electrode of the chip component in the direction of movement of the circuit board, and then use the second nozzle to overlay the chip. An excessive amount of solder is applied to the front electrode of the component.
Thereafter, as the chip component comes out from the solder surface of the solder pool, the excess solder build-up is removed.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56000858A JPS57115970A (en) | 1981-01-06 | 1981-01-06 | Soldering method |
| EP81106768A EP0055323B1 (en) | 1980-12-26 | 1981-08-29 | Apparatus for soldering chip type components |
| DE8181106768T DE3176527D1 (en) | 1980-12-26 | 1981-08-29 | Apparatus for soldering chip type components |
| CA000385236A CA1159156A (en) | 1980-12-26 | 1981-09-04 | Process of soldering printed circuit boards and apparatus employed therefor |
| US06/920,142 US4824010A (en) | 1980-12-26 | 1986-10-17 | Process and apparatus for soldering printed circuit boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56000858A JPS57115970A (en) | 1981-01-06 | 1981-01-06 | Soldering method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57115970A JPS57115970A (en) | 1982-07-19 |
| JPH0117791B2 true JPH0117791B2 (en) | 1989-04-03 |
Family
ID=11485348
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56000858A Granted JPS57115970A (en) | 1980-12-26 | 1981-01-06 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57115970A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57139993A (en) * | 1981-02-23 | 1982-08-30 | Matsushita Electric Ind Co Ltd | Method and device for soldering printed board |
| JPS60106192A (en) * | 1983-11-14 | 1985-06-11 | 松下電器産業株式会社 | Method of soldering printed board |
| WO2010087374A1 (en) * | 2009-01-27 | 2010-08-05 | 千住金属工業株式会社 | Jet solder bath |
-
1981
- 1981-01-06 JP JP56000858A patent/JPS57115970A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57115970A (en) | 1982-07-19 |
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