JPS57165169A - Soldering method for electrical parts - Google Patents

Soldering method for electrical parts

Info

Publication number
JPS57165169A
JPS57165169A JP4724481A JP4724481A JPS57165169A JP S57165169 A JPS57165169 A JP S57165169A JP 4724481 A JP4724481 A JP 4724481A JP 4724481 A JP4724481 A JP 4724481A JP S57165169 A JPS57165169 A JP S57165169A
Authority
JP
Japan
Prior art keywords
soldering
foam
solder
parts
finish
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4724481A
Other languages
Japanese (ja)
Other versions
JPS588944B2 (en
Inventor
Makoto Matsuura
Katsuhiko Tsuchikura
Akira Sugano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Group Corp
Original Assignee
Aiwa Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aiwa Co Ltd filed Critical Aiwa Co Ltd
Priority to JP4724481A priority Critical patent/JPS588944B2/en
Publication of JPS57165169A publication Critical patent/JPS57165169A/en
Publication of JPS588944B2 publication Critical patent/JPS588944B2/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To perform sure titled soldering free from short circuiting and malfunction by soldering electrical parts to the prescribed copper foil parts of a printed wiring substrate in the build-up parts of the surface of a solder soln. produced by foam then applying finish soldering. CONSTITUTION:In a foam introduction type soldering tank 1, foam is produced from release holes 3, 3' through an introduction pipe 2. Here, a printed wiring substrate 4 is introduced and the electrodes 7 of chip elements 6 are soldered to copper foil parts 8 near the peaks of the build-up of the surface of the solder soln. by the foam. In this case, the solder does not scatter to the surface opposite to the soldering surface 5 through the through-holes 9 of the substrate 4, but the sticking of the solder spatters on the surface 5 on account of bursting of the foam can occur. Therefore, if finish soldering is applied in a static type soldering tank 10, the thorough soldering is accomplished and the stuck solder spatters are removed. The similar effect is obtained by using a jet type soldering tank is this finish soldering stage.
JP4724481A 1981-04-01 1981-04-01 How to solder electrical parts Expired JPS588944B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4724481A JPS588944B2 (en) 1981-04-01 1981-04-01 How to solder electrical parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4724481A JPS588944B2 (en) 1981-04-01 1981-04-01 How to solder electrical parts

Publications (2)

Publication Number Publication Date
JPS57165169A true JPS57165169A (en) 1982-10-12
JPS588944B2 JPS588944B2 (en) 1983-02-18

Family

ID=12769811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4724481A Expired JPS588944B2 (en) 1981-04-01 1981-04-01 How to solder electrical parts

Country Status (1)

Country Link
JP (1) JPS588944B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59229826A (en) * 1983-05-31 1984-12-24 Rohm Co Ltd Apparatus for supplying semiconductor pellet to lead frame
JPS60189228A (en) * 1984-03-08 1985-09-26 Shinkawa Ltd Chip taping apparatus
JPS60213036A (en) * 1984-04-09 1985-10-25 Shinkawa Ltd Chip bonding device

Also Published As

Publication number Publication date
JPS588944B2 (en) 1983-02-18

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