JPS56155553A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPS56155553A
JPS56155553A JP5974980A JP5974980A JPS56155553A JP S56155553 A JPS56155553 A JP S56155553A JP 5974980 A JP5974980 A JP 5974980A JP 5974980 A JP5974980 A JP 5974980A JP S56155553 A JPS56155553 A JP S56155553A
Authority
JP
Japan
Prior art keywords
package
frame
main body
wirings
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5974980A
Other languages
Japanese (ja)
Other versions
JPS6041863B2 (en
Inventor
Eiji Hagimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP5974980A priority Critical patent/JPS6041863B2/en
Publication of JPS56155553A publication Critical patent/JPS56155553A/en
Publication of JPS6041863B2 publication Critical patent/JPS6041863B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain the multipurpose package generating no short-circuiting at the circumference of connection of the semiconductor device by a method wherein in a concave part of the package main body being provided with inside wirings and the concave part for the equipment of the semiconductor device, a frame having metal parts to be connected to the inside wirings is inserted to be integrated in one body with the main body. CONSTITUTION:The concave part 2 for the equipment of the device is provided at the center of a ceramic laminate 1, and end parts of the inside wirings 3 are led out to the sides to form terminals 3a. The frame member 5 is formed utilizing a punched part of rubbverlike plate of the ceramic, and the wiring metals 6 are soldered 10 on the frame 5 corresponding to the inside wirings 3 to constitute inside leads 7. A metal 8 at the lower face of the frame and a metal face 4 of the equipping part of the package main body 1 are soldered to fix the frame. By this constitutinon, the package can be applied in common for plural kinds of semiconductor devices without generating short-circuiting at the circumferential part, and to change the package with each kind of semiconductor becomes needlessly.
JP5974980A 1980-05-06 1980-05-06 Package for semiconductor devices Expired JPS6041863B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5974980A JPS6041863B2 (en) 1980-05-06 1980-05-06 Package for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5974980A JPS6041863B2 (en) 1980-05-06 1980-05-06 Package for semiconductor devices

Publications (2)

Publication Number Publication Date
JPS56155553A true JPS56155553A (en) 1981-12-01
JPS6041863B2 JPS6041863B2 (en) 1985-09-19

Family

ID=13122192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5974980A Expired JPS6041863B2 (en) 1980-05-06 1980-05-06 Package for semiconductor devices

Country Status (1)

Country Link
JP (1) JPS6041863B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112057A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Semiconductor device
JPH0742296U (en) * 1993-12-24 1995-07-21 ホシデン株式会社 headphone

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57112057A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Semiconductor device
JPH0742296U (en) * 1993-12-24 1995-07-21 ホシデン株式会社 headphone

Also Published As

Publication number Publication date
JPS6041863B2 (en) 1985-09-19

Similar Documents

Publication Publication Date Title
CA2230903A1 (en) Mounting assembly of integrated circuit device and method for production thereof
GB1185857A (en) Improvements in or relating to Integrated Circuit Assemblies
JPS56155553A (en) Package for semiconductor device
JPS5718347A (en) Mounting structure of ic
EP0286440A3 (en) Connector assembly
JPS5715447A (en) Production of substrate for carrying components
JPS6481609A (en) Device for detachably attaching wiring fixture
JPS6420693A (en) Ic mounting device
JPS57165169A (en) Soldering method for electrical parts
GB0318434D0 (en) Solder connect assembly and method of connecting a semiconductor package and a printed wiring board
JPH01161707A (en) Chip component
JPS55123151A (en) Integrated circuit device
JPS558025A (en) Electronic circuit device
JPS6410634A (en) Semiconductor integrated circuit device
JPS57210650A (en) Electronic parts
JPS6489550A (en) Ic socket
JPS5710956A (en) Tape carrier
JPH031469U (en)
JPS57111048A (en) Integrated circuit device
JPS6489440A (en) Chip carrier
JPS57197843A (en) Lead pin for integrated circuit device
JPS6421935A (en) Tape carrier
JPS5778146A (en) Integrated circuit device
JPS6490591A (en) Connection of conductor of printed board laminate
JPS6477991A (en) Printed circuit board