JPS6041863B2 - Package for semiconductor devices - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a main package body with standardized external dimensions, and a frame-shaped semiconductor device mounting portion of the main package body that has a minimum number of elements that can be changed depending on the type of semiconductor device. The present invention relates to a semiconductor device package including a package body into which members are fitted and integrated.

In terms of materials, ceramic packages are the second most expensive packages for semiconductor devices, followed by ceramic packages, with the mold type being the cheapest.

It is also proportional to the complexity of the package structure, with laminated hermetically sealed packages being the most expensive from a structural standpoint. However, hermetically sealed packages with laminated structures are the most reliable. In this way, not only laminated structures but also hermetically sealed packages are generally expensive, and some form of rationalization, for example, standard structures with standardized external dimensions to promote mass production, is needed to reduce prices. It is hoped that it will be lowered.

However, the requirements for assembling packages for semiconductor devices do not necessarily follow the above-mentioned standardization direction, but rather go against it and tend to require a wide variety of packages suitable for each semiconductor device. For example, the position of a specific electrode such as a ground potential electrode provided on a semiconductor device differs depending on the semiconductor device, and the position of a pin corresponding to the ground electrode on the package side is adjusted accordingly.
This means that a package with a GND pin (hereinafter referred to as a GND pin) must be prepared. Furthermore, if the outer dimensions of the mounting portion of a package on which a semiconductor device with a large outer diameter is mounted are smaller than those of the semiconductor device, it is of course impossible to physically mount it, and even in the reverse case, bonding wires, etc. When the bonding wire becomes too long, the shape of the bonding wire changes due to heat treatment such as thermal aging, resulting in an electrical short circuit called edge touch. An object of the present invention is to be commonly applicable to many types of semiconductor devices without causing bonding wire edge touching, etc.
Therefore, it is an object of the present invention to provide an economical package for a semiconductor device that makes it unnecessary to prepare a different package for each type of semiconductor device.

The semiconductor device package of the present invention includes a main package body in which internal wiring is provided on a base made of an insulating material and a recessed space for mounting the semiconductor device in the center, and a metal portion connected to the internal wiring. and a frame-like member that is fitted into the recessed space and integrated with the main package body.

Next, the present invention will be explained by examples.

FIG. 1 is an exploded perspective view of one embodiment of the present invention.

In FIG. 1, a main package body 1 is formed by laminating insulating substrates such as ceramics, and has a recessed space, that is, a mount part 2, for mounting a semiconductor device in the center thereof, and further includes internal wiring. 3, 3...
... are provided, and the wiring ends are led out to the lead frame connection terminal 3a on the side surface.

If the frame-shaped member 5 is applied to a ceramic package with a laminated structure, the ceramic slurry constituting one layer will be solidified in the manufacturing stage of the package. It can also be constructed from a punched part when punching a rubber-like plate material, which saves money in terms of materials, and the dimensional change after firing is the same, so it can be used in the package according to the present invention. This is a big advantage in some cases. Also,
Needless to say, the external dimensions of the mount portion of the standardized main package body 1 are such that the predetermined frame-like member 5 can be fitted therein, and the internal wiring 3 of the standardized main package body 1 can be used alone. In order to make it usable, the main package main body 1 side may have a length of internal leads that can be bonded. Only internal wiring of a certain length that can be brazed may be provided, and the main internal wiring may be provided as the wiring metal part 6 on the frame member 5 side. This is determined by the required external shape of the semiconductor device and the number of types with different GND pin positions. FIG. 2 is a partial cross-sectional view of a combined part in which the main package body 1 and the frame member 5 of FIG. 1 are integrated.

The internal wiring 3 provided on the standardized main package body 1 and the corresponding wiring metal part 6 provided on the upper surface of the frame-shaped member 5 are connected to each other by brazing 10 to establish electrical continuity. This constitutes the entire internal lead 7.

The frame member 5 is fixed to the main package body 1 by brazing the metal portion 8 provided on the lower surface of the frame member 5 to the metal surface 4 of the mount portion 2 of the main package body 1. In this case, the outer shape of the semiconductor device that can be mounted is restricted by the inner outer dimensions of the frame-like member. FIG. 3 is a partial cross-section of a combined portion of the main package body 1 and the frame member 5 according to the second embodiment of the present invention. In the example shown in Fig. 2, the structure was such that there was no electrical continuity between the mount part and specific internal leads, whereas in this example, specific internal wiring, such as GND
In order to establish electrical continuity with the pin, on the side surface of the frame member 5,
A feature is that a wiring metal part 9 is provided that extends to the bottom surface. In this way, packages with different GND pin positions can be constructed by preparing only frame-like members in accordance with the positions of specific pins. It is clear from its structure that the frame member 5 can be manufactured at a lower cost than the standardized main package body 1, and it promotes mass production instead of high-mix, low-volume production, resulting in a significant price reduction. It is something that can be achieved.

FIG. 4 is a partial sectional view of another example of the combination of the main package body 1 and the frame member 5 according to the third embodiment of the present invention.

In this example, in the examples shown in FIGS. 2 and 3, the internal wiring 3 of the main package body 1 and the corresponding wiring metal part 6 provided on the upper surface of the frame member are integrated by brazing, and the electrical However, it is characterized by having an independent wiring metal part on the frame-shaped member 5 instead of integrally brazing it. This example is particularly effective when the semiconductor device has many electrodes. In other words, the electrodes on the semiconductor device side are arranged in a regular row or in two or more rows in a staggered manner, and the wiring on the main package body side and the frame member side is arranged in a staggered manner. It is effective to shift their positions from each other.In this respect, in the examples shown in Figures 2 and 3, both wirings are arranged so that they are continuous because it is necessary to maintain electrical continuity. In wire bonding with the semiconductor device 11, it is sufficient to alternately connect the wiring on the main package body side and the frame-shaped member side.The wiring metal part in the frame-shaped member is connected to The internal wiring 13 leads to an external lead. In addition, this internal wiring is not only led out to the external lead as it is, but it is also natural to lower the conduction resistance of the package by making it electrically conductive by means such as through holes between each layer of the standardized main package body. It will be possible. FIGS. 5A and 5B are perspective views of a frame-like member having a full metal portion.

In contrast to the frame member having an internal lead shape as a wiring metal portion in FIGS. 2 to 4, full metal portions are provided on the upper and lower surfaces and conduction is provided on the side surfaces. That is, in the figure a, a band-shaped metal part 14 is formed along the inner periphery, and conduction is established with the metal part on the lower surface by the connecting band 14'' on the side surface. In the figure b, the metal part 14 is formed on the entire upper and lower surfaces. A portion 15 is formed, and the upper and lower surfaces are electrically connected by a connecting band 15'' on the side surface. In this way, as explained using FIG. 3, a pin at an arbitrary position can be set as a GND pin without specifying a specific pin. In the above-mentioned embodiments, explanations have been made using a hermetically sealed package with a laminated structure, but the present invention is not limited to such a laminated structure and can be applied to any hermetically sealed package. For example, it is of course possible to use a package without external leads.

[Brief Description of the Drawings] Figure 1 is an exploded perspective view of one embodiment of the present invention, Figures 2 and 3 are
4 and 4 are partial cross-sectional views of the fitting portion between the main package body and the frame member in the first, second and third embodiments of the present invention, and FIGS. FIG. 3 is a perspective view of a frame-like member having a metal portion that covers the entire upper and lower surfaces. 1...Main package body, 2...Recessed space for mounting semiconductor device, 3...Internal wiring of main package body, 4...Metal surface of mount part ,
5... Frame-shaped member, 6... Wiring metal part,
7... Entire wiring, 8... Bottom metal part of frame-shaped member, 9... Wiring metal part on side surface of frame-shaped member, 10... Brazing metal, 11... Semiconductor device, 12... Bonding wire, 14...
...Frame-shaped member upper and lower surface band-shaped metal parts, 15...
Frame-shaped member top and bottom all-metal parts.

Claims (1)

[Claims] 1. A main package body having internal wiring provided on a base made of an insulating material and a recessed space for mounting a semiconductor device in the center, and a metal part capable of establishing electrical continuity with the internal wiring and the recessed part. A package for a semiconductor device, comprising a frame-like member that fits into a space and is integrated with the main package body.