JP2004254251A - Surface mounting type piezoelectric vibrator and insulating package - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the various types of problems occurring when an intermediate mounting pad independent from each mounting terminal is disposed at the intermediate position between the respective mounting terminals in a surface mounting type piezoelectric transducer having at least two I/O terminals and at least two grounding terminals on the outer bottom surface of a package. <P>SOLUTION: The surface mounting type piezoelectric transducer 1 includes at least an insulating package 2 having a recess part 3 including an internal terminal 4, I/O and grounding mounting terminals 6 formed on the outer bottom surface of the insulating package, a piezoelectric vibration element 10 held in the recess part. In this surface mounting type piezoelectric transducer 1, a connecting conductor film which electrically connects between the two grounding mounting terminals 6G disposed on the outer bottom surface of the insulating package and having a thickness equivalent to each mounting terminal is formed on the outer bottom surface. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention provides a surface-mounted piezoelectric vibrator having a structure in which a piezoelectric vibrating element is accommodated in an insulating package, by variously improving the configuration and arrangement of mounting terminals exposed on the outer bottom surface of the insulating package. A surface-mount type piezoelectric vibrator that can improve the installation stability and durability when mounted on a motherboard and can simplify the internal wiring structure of a package base material used when mass-producing an insulating package; and The present invention relates to an insulating package.
[0002]
[Prior art]
A piezoelectric vibrator such as a surface mount type crystal vibrator is mounted on a motherboard in a state as shown in a partial sectional view of FIG. That is, in the piezoelectric vibrator 100, the piezoelectric vibrating element 110 is formed on the internal terminals (electrode pads) 103 arranged on the inner bottom surface of the recess 102 of the package 101 made of an insulating material such as ceramic by using the conductive adhesive 104. It has a configuration in which it is supported in a cantilever state, and the opening of the recess 102 is hermetically sealed with a metal lid 115. A plurality of mounting terminals 105 are arranged on the outer bottom surface of the package. The piezoelectric vibration element 110 has a configuration in which excitation electrodes and lead electrodes extending from each excitation electrode to the substrate edge are formed on both front and back surfaces of a piezoelectric substrate such as a quartz substrate.
For example, as shown in the package bottom view of FIG. 9B, the mounting terminals 105 include two hot terminals, that is, two input / output mounting terminals 105H and two ground-side mounting terminals 105G. The input / output mounting terminal 105H is electrically connected to the internal terminal 103 via an internal conductor (not shown), and the ground mounting terminal 105G is electrically connected to the metal cover 115 via an internal conductor (not shown).
The motherboard 120 includes an insulating substrate 121 made of an insulating material such as glass epoxy, and lands 122 formed on the insulating substrate 121 corresponding to the mounting terminals 105H and 105G. The terminals are connected to the respective mounting terminals 105H and 105G through the terminals.
[0003]
Incidentally, the insulating substrate 121 and the insulating package 101 constituting the motherboard 120 are made of different materials, and thus have different thermal expansion coefficients. Therefore, when an electronic device or the like on which the motherboard 120 on which the piezoelectric vibrator 100 is mounted is used in an environment where temperature changes are severe, the connection portion by the solder 125 is affected by the temperature change. That is, when the ambient temperature rises above a certain temperature (or falls below a certain temperature), a stress caused by a difference in thermal expansion as indicated by an arrow in FIG. In addition, cracks occur in the solder 125, which causes problems such as poor connection and dropping of the piezoelectric vibrator.
Further, since the mounting terminals 105H and 105G are spaced apart from each other at the four corners of the outer bottom surface of the insulating package 101, the package portion located between the mounting terminals may be bent depending on the conditions when mounting on the motherboard 120. Deformation is likely to occur, and the crystal resonator may be damaged. That is, FIGS. 10A and 10B are diagrams showing such an example. In this example, the mother board is held in a state where the upper surface center of the metal lid 115 is sucked and held by the vacuum suction nozzle 130 of the automatic mounting apparatus. Although the case where the piezoelectric vibrator 100 is mounted on the land 122 is shown, when a strong pressing force acts on the center of the upper surface of the piezoelectric vibrator 100 from the vacuum suction nozzle 130 as shown in FIG. In addition, there is a possibility that the internal piezoelectric vibration element 110 may be damaged.
From such a point, as shown in FIGS. 11 and 12 (a) and (b), the machine at the time of mounting is mounted on the middle portion in the longitudinal direction of the outer bottom surface of the insulating package (the middle position between the mounting terminals 105H and 105G). There has been proposed a type in which two intermediate mounting pads 106 are arranged to secure stability. By setting the thickness of the intermediate mounting pad 106 to be equal to the thickness of each of the mounting terminals 105H and 105G, it is possible to prevent deformation at the time of mounting on the motherboard and to improve the installation stability.
[0004]
The type shown in FIG. 12 is different from FIG. 11 in that the castellations 107 are formed on the side surfaces of the insulating package corresponding to the intermediate mounting pads 106 and the mounting terminals 105H and 105G, and the conductors formed in the castellations 107. The film is electrically connected to each of the intermediate mounting pads 106 and the mounting terminals 105H and 105G in a corresponding positional relationship. By arranging the conductive film conductive to each of the intermediate mounting pads and the mounting terminals on the side surface of the package in this manner, the solder used for mounting on the motherboard is attached to the conductive film on the side surface in a fillet shape to increase the connection strength. It becomes possible.
However, it has no electrical function, and the intermediate mounting pad 106 is provided mainly for the purpose of improving the mechanical connection strength of the package exclusively during mounting on the motherboard and preventing deformation of the package during mounting. Even in the case of the other mounting terminals, the surface of the intermediate mounting pad 106 made of tungsten or the like is gold-plated by electroplating because it is necessary to secure the solder connection strength with the land on the motherboard side as in the case of the other mounting terminals. It is necessary to form a layer.
[0005]
Normally, the ceramic insulating package 101 is obtained by stacking a plurality of large-area ceramic sheets and dividing the fired sheet-shaped package base material into individual pieces. Gold plating on the internal terminals 103 and the four mounting terminals 105H and 105G is performed collectively before dividing the package base material, which is efficient in increasing productivity. For this reason, a common electrode used for electroplating is arranged on the outer peripheral edge of the package base material, and the internal terminals and mounting terminals arranged on all package pieces on the package base material are directed toward the common electrode. , Internal conductors for ensuring conduction are wired. Therefore, when current is supplied from the common electrode while the package base material is immersed in the electrolytic solution, power is supplied to all the internal terminals and the mounting terminals, and the gold component in the electrolytic solution is deposited on each terminal and gold plating is performed. Form a layer. For this reason, when the intermediate mounting pads 106 are arranged on the bottom surface of the package as described above, it is necessary to form a gold plating layer also on the intermediate mounting pads 106, and for this purpose, all the intermediate mounting pads 106 are connected to the common electrode. The internal conductor to be connected must be wired in advance in the package base material.
However, in the case where two intermediate mounting pads 106 are provided in addition to the two internal terminals 103 and the four mounting terminals 105H and 105G, the number of individual pieces × 2 (pieces) is provided between the two and the common electrode. Since it is necessary to increase the number of internal conductors, the design and structure of the package base material become complicated, resulting in an increase in manufacturing cost and a decrease in productivity.
[0006]
[Problems to be solved by the invention]
The present invention has been made in view of the above, and in a surface-mount type piezoelectric vibrator provided with at least two input / output mounting terminals on an outer bottom surface of a package and at least two grounding mounting terminals, It is an object of the present invention to solve various problems that occur when an independent intermediate mounting pad is arranged at an intermediate position between each mounting terminal.
The above problem is that when an intermediate mounting pad independent of the mounting terminal is provided, the wiring structure of an internal conductor for plating the intermediate mounting pad on the package base material with gold is complicated.
[0007]
[Means for Solving the Problems]
In order to solve the above problems, the present invention has the following configuration.
First, a first aspect of the present invention provides an insulating package having a recess provided with an internal terminal, input / output and ground mounting terminals formed on the outer bottom surface of the insulating package, and A piezoelectric vibrating element having a structure in which an excitation electrode and a lead electrode are formed, and supported in the recess by electrically and mechanically connecting the lead electrode on the internal terminal by a conductive adhesive; A metal lid that hermetically seals the opening; and, in a surface-mount type piezoelectric vibrator, at least comprising: a grounding mounting terminal disposed on an outer bottom surface of the insulating package; A connection conductor film having the same thickness is formed on the outer bottom surface.
On the substantially rectangular outer bottom surface of the insulating package that constitutes the surface mount type piezoelectric vibrator, input mounting terminals and ground mounting terminals are individually formed at the four corners, but the distance between each mounting terminal When the length is long, deformation at the time of mounting occurs. Further, when the four mounting terminals are connected to each land on the motherboard by soldering, solder cracks are likely to occur due to a difference in thermal expansion coefficient between the motherboard and the package. According to the present invention, when the grounding mounting terminals are present at two of the four corners on the outer bottom surface of the package, the grounding mounting terminals are connected by the connection conductor film. The stability, the installation stability, and the solder connection strength can be increased to prevent the damage of the vibration element and the occurrence of solder cracks due to the deformation of the package. At the same time, when batch processing is performed using a package base material in which large-area ceramic sheets are stacked, the number of internal wires required for plating mounting terminals and connection conductor films with gold or the like is increased. Can be prevented.
[0008]
According to a second aspect of the present invention, in the first aspect, the four mounting terminals are arranged along a periphery of the outer bottom surface of the insulating package, and the two grounding mounting terminals are arranged diagonally apart from each other. Alternatively, they are arranged in an adjacent positional relationship, and the grounding mounting terminals are electrically connected by the connection conductor film.
According to a third aspect of the present invention, there is provided an insulating package having a recess having an internal terminal, input / output and ground mounting terminals formed on an outer bottom surface of the insulating package, and an excitation electrode on a piezoelectric substrate. And a piezoelectric vibrating element supported in the recess by electrically and mechanically connecting the lead electrode on the internal terminal by a conductive adhesive, and the opening of the recess. A metal lid that hermetically seals, and a surface mount type piezoelectric vibrator having at least an intermediate portion between two opposing sides of the outer bottom surface of the insulative package for securing installation stability when mounting the motherboard. In the arrangement in which the mounting pads are respectively arranged, a connection conductor film having the same thickness as each of the intermediate mounting pads is formed on the outer bottom surface while electrically connecting the two intermediate mounting pads. .
Even in the case where the intermediate mounting pad is provided, by connecting the two intermediate mounting pads with the connection conductor film, the same effect as in the first aspect can be obtained.
According to a fourth aspect of the present invention, in the third aspect, a connection conductor film for electrically connecting at least one of the intermediate mounting pads and at least one of the ground mounting terminals is formed on an outer bottom surface of the insulating package. It is characterized by having done.
Even when the intermediate mounting pad and the ground mounting terminal grind are connected by a connection conductor film, it is possible to obtain the same operation and effect as those of the above respective claims.
According to a fifth aspect of the present invention, there is provided an insulating package having a recess provided with an internal terminal, input / output and ground mounting terminals formed on an outer bottom surface of the insulating package, and an excitation electrode on a piezoelectric substrate. And a piezoelectric vibrating element supported in the recess by electrically and mechanically connecting the lead electrode on the internal terminal by a conductive adhesive, and the opening of the recess. A metal lid for hermetically sealing, at least one of the opposing edges of each of the adjacently mounted mounting terminals in the surface mount type piezoelectric vibrator, at least one of which is extended to approach the other mounting terminal side. The extended conductor film is formed on the outer bottom surface of the insulating package.
By extending a part of the existing mounting terminals arranged at the four corners of the package bottom surface, the same function and effect as those of the above inventions can be obtained.
According to a sixth aspect of the present invention, there is provided an insulating package having the structure according to the first to fifth aspects.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the present invention will be described in detail with reference to embodiments shown in the drawings.
1A and 1B are a vertical sectional view and a bottom view showing a structure of a quartz oscillator as an example of a piezoelectric oscillator according to a first embodiment of the present invention.
In this crystal resonator 1, a piezoelectric vibrating element 10 is formed by using a conductive adhesive 5 on internal terminals (electrode pads) 4 arranged on the inner bottom surface of a recess 3 of an insulating package 2 made of an insulating material such as ceramic. It has a configuration in which it is supported in a cantilever state and the opening of the recess 3 is hermetically sealed with a metal lid 15. Four mounting terminals 6 that are electrically connected to the internal terminals 4 and the metal cover 15 are arranged on the outer bottom surface of the package. Further, the crystal resonator element 10 has a configuration in which excitation electrodes 12 are formed on both front and back surfaces of a crystal substrate 11, respectively.
The characteristic configuration of the embodiment of FIG. 1 lies in the shape and arrangement of the mounting terminals 6. That is, in the general crystal unit 1, the mounting terminals 6 are arranged at the four corners of the rectangular outer bottom surface of the package, and in this embodiment, the input / output mounting terminals 6H are provided at the corners along each diagonal line. , 6H and ground mounting terminals 6G, 6G. The present embodiment is characterized by a configuration in which two grounding mounting terminals arranged opposite to each other along a diagonal line among these mounting terminals are electrically connected by the connection conductor film 20.
[0010]
Like the mounting terminals 6, the connection conductor film 20 has a structure in which gold plating is formed on a conductor film of tungsten or the like that is integrally formed when the laminated ceramic sheets are fired. The connection conductor film 20 is disposed along the bottom surface of the package, connects the grounding mounting terminals 6G, and plays the role of making the center of the bottom surface of the package the same height as the other mounting terminals. The thickness is set equal to each mounting terminal 6. The connection conductor film 20 according to this embodiment is led out in a crank shape from each of the grounding mounting terminals 6G and is arranged along the center of the outer bottom surface of the package. As compared with the conventional case in which terminals exist, solder cracks due to the difference in thermal expansion coefficient as shown in FIG. 9 do not occur. That is, not only between the mounting terminals located at the four corners of the package bottom surface and the lands on the motherboard, but also between the connection conductor film 20 located at the center and the corresponding grounding lands on the motherboard by soldering. , The number of solder joints and the amount of solder used can be increased, so that the connection strength is increased, the stress applied to the solder due to the difference in the coefficient of thermal expansion is dispersed, and the thermal expansion between the motherboard and the material used for the package. The occurrence of solder cracks due to the difference in the coefficients can be prevented. Further, by connecting the connection conductor film 20 to the grounding land on the motherboard by soldering, the mounting and installation stability of the package central part is improved, and the central part of the upper surface of the crystal unit is adsorbed by the vacuum suction nozzle to be mounted on the motherboard. By applying pressure by the vacuum suction pad at the time of mounting on a semiconductor device, problems such as deformation of the central portion of the package and damage to the crystal resonator element can be prevented.
The configuration in which the thickness of the connection conductor film 20 is equal to the thickness of the mounting terminal 6 is common to all the following embodiments.
Further, as shown in FIG. 11, when compared with the case where intermediate mounting pads are formed at intermediate positions of the mounting terminals 6 located at both ends in the longitudinal direction of the package bottom surface, the batch processing using a large-area package base material is more difficult. It is not necessary to particularly provide an internal conductor for gold plating on the connection conductor film 20 (can be shared with the internal conductor for the mounting terminal 6G for grounding), so that the configuration of the package base material is simplified, and productivity is improved. Manufacturing costs can be reduced.
[0011]
Next, FIGS. 2A and 2B are bottom views of a crystal resonator according to another embodiment (a modification of the first embodiment) of the present invention, respectively. In the above, two grounding mounting terminals 6G, 6G are arranged adjacent to corners along the short side of the package bottom surface, and the two grounding mounting terminals 6G, 6G are electrically connected to each other. The connection conductor film 20 is formed so as to extend to the center in the longitudinal direction. The connection conductor film 20 is obtained by applying gold plating to a tungsten film integrally formed when the ceramic sheets are stacked and fired similarly to the mounting terminals 6. Also in this embodiment, it is not necessary to provide a dedicated internal wiring for performing gold plating on the connection conductor film 20 in the package base material, and the connection conductor film 20 extends to the center of the package bottom surface. Therefore, there is no breakage due to pressure from the vacuum suction pad during automatic mounting. Further, for the same reason as that described in the second embodiment, the occurrence of solder cracks can be prevented.
In the embodiment of FIG. 2B, two grounding mounting terminals 6G, 6G are disposed adjacent to each other at a corner along the long side of the package bottom surface. The conductive films 21 (thickness equivalent to those of the mounting terminals) are extended linearly from the inner edges of the two input / output mounting terminals 6H, 6H located at the other two corners. Then, the overhanging conductor films 21 are arranged so as to face each other in a non-contact manner so as to extend to the vicinity of the longitudinal center of the package bottom surface. Each of the connection conductor film 20 and the overhanging conductor film 21 is formed by applying gold plating to a tungsten film integrally formed when laminating and firing ceramic sheets, similarly to the mounting terminals 6.
Also in this embodiment, not only is there no need for special internal wiring when gold plating is applied to the connection conductor film 20 connecting the two grounding mounting terminals 6G, but also the connection conductor film 20 and the overhanging conductor film 21 Are arranged along the longitudinal direction so as to cover almost the center of the package bottom, so that the center of the package is not easily deformed and deformed or damaged by the pressing force of the vacuum suction pad of the automatic mounting device. I can't. Also, solder cracks can be effectively prevented for the same reason as in the other embodiments.
[0012]
Next, FIG. 3 is a bottom view and a front view showing an embodiment for solving the drawback of the crystal unit having the intermediate mounting pad shown in FIG. The characteristic configuration of the crystal unit 1 according to this embodiment is that the input / output mounting terminals 6H and the grounding mounting terminals 6G are provided at the four corners of the outer bottom surface of the package 2, respectively, while the central part of each long side is provided. There is a configuration in which the intermediate mounting pads 25 arranged respectively are connected by the connection conductor film 20. According to this embodiment, the conventional two intermediate mounting pads are provided independently, so that the gold-plated internal conductor dedicated to the intermediate mounting pads needs to be wired in the package base material, which complicates the structure. Can be reduced by half. That is, by connecting and integrating the two intermediate mounting pads 25 with the connection conductor film 20, only one internal wiring for gold plating is required, and the configuration of the package base material can be simplified. Also, solder cracks can be effectively prevented for the same reason as in the other embodiments.
Next, FIGS. 4A and 4B are configuration diagrams of a modified embodiment of FIG. 3. In this embodiment, two mounting terminals 6G for grounding are arranged on a diagonal line on the bottom surface of the package. The configuration is characterized in that the ground mounting terminal 6G and the intermediate mounting pad 25 located adjacent to the ground mounting terminal 6G are individually electrically connected via the connection conductor film 20. As described above, the two intermediate mounting pads 25 conventionally arranged independently are electrically connected to the adjacent grounding mounting terminals 6G, so that the plating inner conductor wired to the package base material to gold-plate the grounding mounting terminals is formed. By utilizing this, all the intermediate mounting pads 25 can be plated with gold, and the structure of the package base material can be prevented from becoming complicated due to an increase in the number of internal conductors.
[0013]
Further, the embodiment of FIGS. 5A and 5B is characterized in that, in addition to the configuration of the embodiment of FIG. 4, each intermediate mounting pad 25 is connected by the connection conductor film 20. That is, the grounding mounting terminals 6G are respectively arranged at two corners along one diagonal line, and the grounding mounting terminals 6G and the intermediate mounting pads 25 arranged adjacent to each other are electrically connected by the connection conductor film 20. Further, the connection between the intermediate mounting pads 25 is conducted by another connection conductor film 20.
According to this embodiment, since the number of internal wirings for gold plating can be reduced as compared with the embodiment of FIG. 4, the structure of the package base material can be further simplified, and the manufacturing cost can be reduced.
In the embodiment of FIGS. 6A and 6B, the grounding mounting terminals 6G are arranged adjacent to two corners along the short side of the package bottom surface, and each of the grounding mounting terminals 6G and each of the intermediate mounting pads are arranged. 25 is characterized in that a connection conductor film 20 having a wide area for connecting all of them 25 is formed. According to this embodiment, since all the intermediate mounting pads 25 are electrically connected to all the grounding mounting terminals 6G, the number of internal wirings for gold plating can be greatly reduced, the structure of the package base material is further simplified, and Cost can be reduced.
Further, in the embodiment of FIGS. 7A and 7B, two grounding mounting terminals 6G are arranged adjacent to two corners along the long side of the package bottom surface, and each of the grounding mounting terminals 6G and The configuration is characterized in that a connection conductor film 20 for linearly connecting one intermediate mounting pad 25 is formed.
Also in the crystal resonator according to each embodiment shown in FIG. 7, the number of internal wirings for gold plating can be reduced, so that the structure of the package base material can be further simplified and the manufacturing cost can be reduced.
[0014]
Next, in each of the above embodiments, the connection conductor film is used to connect between the mounting terminals for grounding, between the intermediate mounting pads, and the like. However, in each of the embodiments shown in FIGS. Is characterized in that opposing edges 6A of an arbitrary mounting terminal 6 are extended along each edge to the center of the edge. That is, the extension conductor film 30 is formed by extending the edge 6A of the conventional mounting terminal 6 indicated by the dotted line to the center of the package bottom surface toward the edge of the other opposite mounting terminal. Are configured not to contact. First, in the embodiment of FIG. 8A, the edge 6A of the input / output mounting terminal 6H and / or the grounding mounting terminal 6G extends along the edge of the package outer bottom surface to the center of the edge. By extending, the deformation at the time of mounting is prevented and the number of plating internal conductors in the package base material is reduced. In FIG. 8B, the edge 6A of each mounting terminal adjacently arranged along the long side is extended to the center of the long side to prevent deformation at the time of mounting and prevent the package base material from being deformed. The number of internal conductors for plating is reduced.
Also, in each of the embodiments shown in FIGS. 8A and 8B, since the conductor film constituting the extension conductor film 30 extends to near the center of the package bottom surface, the crystal resonator is mounted on the motherboard. Deformation due to pressure at the time of performing is prevented. Further, by connecting the extension conductor film 30 to the grounding lands on the motherboard by soldering, it is possible to increase the solder connection strength of all the mounting terminals, and to prevent the occurrence of solder cracks.
[0015]
Note that the vertical and horizontal dimensions (long side × short side) of the package bottom surface are generally 6 × 3.5 mm, 5 × 3.2 mm, or 4 × 2.5 mm, but in any size package, The distance between the adjacent edges 30A of the extended conductor film 30 or the distance between the edges of the extended conductor film 30 and the adjacent mounting terminals 6H is 0.8 mm or less (a degree that the terminals are not short-circuited by soldering). ) Is the optimal value.
In each of the above embodiments, for convenience of explanation, each mounting terminal 6, the connection conductor film 20, the intermediate mounting pad 25, and the extension conductor film 30 are separately described and illustrated. In the case of a continuous configuration, it does not mean that it is manufactured while being distinguished in the manufacturing stage.
The present invention can be applied not only to a piezoelectric oscillator such as a quartz oscillator but also to a piezoelectric oscillator such as a quartz oscillator in which a quartz oscillator and an oscillation circuit are combined.
[0016]
【The invention's effect】
As described above, according to the present invention, in a surface mount type piezoelectric vibrator provided with at least two input / output mounting terminals and at least two ground mounting terminals on the outer bottom surface of the package, the mounting terminals are independent of the mounting terminals. Various problems that occur when the intermediate mounting pad is arranged at an intermediate position between the mounting terminals can be solved. In particular, in the present invention, it is possible to solve the problem that the wiring structure of the internal conductor for plating the intermediate mounting pad on the package base material with gold is complicated when the intermediate mounting pad independent from the mounting terminal is provided. it can.
[Brief description of the drawings]
FIGS. 1A and 1B are a vertical sectional view and a bottom view showing a structure of a crystal resonator as an example of a piezoelectric resonator according to a first embodiment of the present invention.
FIGS. 2A and 2B are bottom views of a crystal resonator according to another embodiment (a modification of the first embodiment) of the present invention.
FIGS. 3A and 3B are a bottom view and a front view showing an embodiment for solving the drawbacks of the crystal unit having the intermediate mounting pad shown in FIG.
4A and 4B are configuration diagrams of a modified embodiment of FIG.
FIGS. 5A and 5B are views showing a modification of the embodiment of FIG. 4;
FIGS. 6A and 6B are diagrams showing another embodiment of the present invention.
7A and 7B are views showing another embodiment of the present invention.
FIGS. 8A and 8B are diagrams each showing a configuration of another embodiment of the present invention.
FIGS. 9A and 9B are a partial cross-sectional front view and a bottom view showing a mounted state of a piezoelectric vibrator according to a conventional example.
FIGS. 10A and 10B are diagrams for explaining the drawbacks of the conventional example.
FIG. 11 is a bottom view of another conventional example.
FIGS. 12 (a) and (b) are explanatory diagrams of the configuration of another conventional example.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 crystal oscillator, 2 insulating package, 3 recess, 4 internal terminal (electrode pad), 5 conductive adhesive, 6 (6H, 6G) mounting terminal, 10 piezoelectric vibration element, 11 crystal substrate, 12 excitation electrode, 15 Metal cover, 20 Connection conductor film, 21 Overhang conductor film, 25 Intermediate mounting pad, 30 Extension conductor film.

Claims (6)

An insulating package having a recess having internal terminals, input / output and ground mounting terminals formed on the outer bottom surface of the insulating package, and an excitation electrode and a lead electrode formed on a piezoelectric substrate. And a piezoelectric vibrating element supported in the recess by electrically and mechanically connecting the lead electrode with a conductive adhesive on the internal terminal, and a metal lid for hermetically sealing the opening of the recess. A surface-mounted piezoelectric vibrator comprising at least:
An electrical connection is made between two grounding mounting terminals disposed on the outer bottom surface of the insulating package, and a connection conductor film having the same thickness as each mounting terminal is formed on the outer bottom surface. Surface mount type piezoelectric vibrator. The four mounting terminals are arranged along the periphery of the outer bottom surface of the insulating package, and the two grounding mounting terminals are arranged diagonally apart from each other or arranged in an adjacent positional relationship, 2. The surface mounted piezoelectric vibrator according to claim 1, wherein the grounding mounting terminals are electrically connected by the connection conductor film. An insulating package having a recess having internal terminals, input / output and ground mounting terminals formed on the outer bottom surface of the insulating package, and an excitation electrode and a lead electrode formed on a piezoelectric substrate. And a piezoelectric vibrating element supported in the recess by electrically and mechanically connecting the lead electrode with a conductive adhesive on the internal terminal, and a metal lid for hermetically sealing the opening of the recess. , A surface-mount type piezoelectric vibrator having at least an intermediate mounting pad for securing installation stability at the time of mounting on a motherboard at an intermediate portion between two opposing sides of the outer surface of the insulating package. At
A surface-mount type piezoelectric vibrator, wherein a connection conductor film having the same thickness as each of the intermediate mounting pads is formed on the outer bottom surface while electrically connecting the two intermediate mounting pads. The connection conductor film for electrically connecting between at least one of the intermediate mounting pads and at least one of the ground mounting terminals is formed on an outer bottom surface of the insulating package. Surface mount type piezoelectric vibrator. An insulating package having a recess having internal terminals, input / output and ground mounting terminals formed on the outer bottom surface of the insulating package, and an excitation electrode and a lead electrode formed on a piezoelectric substrate. And a piezoelectric vibrating element supported in the recess by electrically and mechanically connecting the lead electrode with a conductive adhesive on the internal terminal, and a metal lid for hermetically sealing the opening of the recess. A surface-mounted piezoelectric vibrator comprising at least:
An extended conductor film is formed on the outer bottom surface of the insulating package, and is formed so that at least one of the opposing edges of the adjacent mounting terminals is extended toward the other mounting terminal. Surface mount type piezoelectric vibrator. An insulating package having the structure according to claim 1.

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