JP2010129564A - Electronic component package, and piezoelectric vibrator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an electronic component package having high bonding strength to a printed board to mount. <P>SOLUTION: This electronic component package is composed of a rectangular package body 5 capable of carrying electronic components, and a lid member 20 to airtightly seal the package body 5 containing electronic components. A pair of first mounting terminals 6, 7 are formed in one diagonal areas along the side facing the outside bottom face of the package body 5, and a pair of second mounting terminals 8, 9 are formed in the other diagonal areas along the side facing the outside bottom face of the package body 5 in this electronic component package 1. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to an electronic component package and a piezoelectric vibrator, and more particularly, to an electronic component package having an improved mounting terminal pattern in order to increase the connection strength with a circuit board, and a piezoelectric vibrator using the same.

Piezoelectric vibrators, especially surface-mounted quartz vibrators, are small in size, easily obtain high-precision, high-stable frequencies, and have little secular change. Widely used as a source.
In recent years, devices have become smaller and lighter, and the demand for further miniaturization of surface-mounted crystal units has been increasing.
In particular, AT-cut quartz resonators whose frequency-temperature characteristics exhibit a cubic curve are widely used in mobile phones and the like because of their excellent temperature characteristics.
As is well known, a surface-mount type crystal resonator has excitation electrodes formed on both main surfaces of a crystal plate using a vacuum deposition method or a sputtering method, and is accommodated in a surface-mount type package body. A lid is hermetically sealed by seam welding or the like on the periphery of the package body.

When the piezoelectric vibrator is used for a vehicle-mounted device, the connection strength with the circuit board is particularly important.
This is because electronic components used in in-vehicle devices are exposed to severe temperature environments from low temperature to high temperature. If there is a difference in the coefficient of linear expansion between the package containing the piezoelectric vibration element and the circuit board on which the piezoelectric vibrator is mounted, the solder that connects the package and the circuit board will be strained due to repeated temperature changes, resulting in solder fatigue. This is because destruction may occur. Further, in recent years, the shape of the surface-mount type crystal resonator has been reduced in size, and the area of the package mounting terminal has been further reduced.
An example of a surface-mounted crystal resonator in which the connection strength between a mounting terminal and a circuit board is reinforced is Patent Document 1.
Is disclosed.
FIG. 15A is a side sectional view of the surface-mount type crystal resonator disclosed in Patent Document 1, and FIG. 15B is a bottom view.
A surface-mounted crystal resonator 70 shown in FIG. 15 includes a planar rectangular package body 71 having a recess with an upper opening, and a crystal resonator element 75 housed in the package body 71.
And a lid 72 joined to the upper opening of the package body 71. And
The surface mounted crystal resonator 70 configured as described above is connected to the wiring pattern 91 of the circuit board 90 via the solder 85.

As shown in FIG. 15B, a pair of terminal electrodes 82 and 83 are formed on the bottom surface of the package body 71 along the opposing sides. The pair of terminal electrodes 82 and 83 have regions 82a and 83a formed to face each other. The pair of terminal electrodes 82 and 83 are arranged point-symmetrically with respect to the center point of the package body 71. In addition, at the four corners of the package body 71,
Castellations C1 to C4 are formed, and castellations C1 and C3 are connected to terminal electrodes 82 and 83, respectively. By configuring such a package body 71,
The temperature environment changes and the terminal electrode 82 is caused by the difference in thermal expansion between the package body 71 and the circuit board 90.
, 83 even if stress is generated, the stresses are released to each other toward the regions 82b, 83b where the terminal electrodes 82, 83 are not formed, so that the stress is generated so as to rotate in a plane at the center point of the package body 71. The stress is relieved. As a result, the occurrence of solder cracks and the like is suppressed.
JP 2005-108923 A

However, in the package main body 71 shown in FIG. 15, the terminal electrodes 82 and 83 are electrically connected to the piezoelectric vibration element accommodated in the package via one castellation C1 and C3 formed at the corners of the package main body, respectively. Terminal electrodes 82, 8
When a crack occurs in the connection part between 3 and the castellations C1 and C3, there is a problem that the crystal unit may not function.
Further, since the package mounting terminals have different shapes lacking symmetry, there is a difficulty in sharing the land pattern on the mounting board when the customer attempts to make a multi-vendor.
Further, since the mounting terminals of the package are close to one side, the posture of the package after mounting on the printed circuit board (parallelism between the printed circuit board and the package) is deteriorated, and there is a possibility that distortion concentrates and cracks occur.
The present invention has been made to solve the above problems, and provides a package for an electronic component having improved connection strength between a package mounting terminal and a land of a printed circuit board, and a piezoelectric vibrator using the same. is there.

SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

Application Example 1 An electronic component package having a rectangular package main body on which an electronic component can be mounted and a lid member that hermetically seals the package main body including the electronic component, the outer bottom surface of the package main body A pair of first mounting terminals is formed in one diagonal region of the package body, and a pair of second mounting terminals is formed in the other diagonal region of the outer bottom surface of the package body, and the first mounting terminal and the The second mounting terminal is an electronic component package that is electrically connected.

By forming the pair of first and second mounting terminals on the outer bottom surface of the package body as described above, when the electronic component package is mounted on the printed board, the bonding strength between the mounting terminal and the land of the printed board Can be increased.
In addition, since the printed circuit board and the electronic component package come into contact at four points via solder, the posture of the electronic component package, that is, the outer bottom surface of the package body and the surface of the printed circuit board are parallel, so that the solder layer has a uniform thickness. Thus, there is an advantage that cracks due to repeated thermal strain are unlikely to occur.
Further, even if a crack occurs in the second mounting terminal, there is an effect that the crack stops at the gap between the first mounting terminal and the second mounting terminal and does not extend.

Application Example 2 An electronic component package having a rectangular package main body on which an electronic component can be mounted and a lid member that hermetically seals the package main body including the electronic component, the outer bottom surface of the package main body A pair of first mounting terminals is formed at a point-symmetrical position with respect to the center point of the package body in a region along the opposite side of the package body, the opposite side of the outer bottom surface of the package body, and the first A pair of second mounting terminals are formed in a region where one mounting terminal is not formed, and the first mounting terminal and the second mounting terminal are electrically connected. It is an electronic component package.

By forming the pair of first mounting terminals symmetrically as described above, the capacitance between the mounting terminals can be reduced.
Moreover, there is an advantage that it is strengthened against in-plane rotational distortion applied to the solder on the printed circuit board.
Further, by forming the pair of second mounting terminals in the region where the first mounting terminals are not formed, the package surface and the printed circuit board surface become parallel, so that the solder layer becomes uniform. Therefore, there is an advantage that cracks due to distortion generated in the solder are less likely to occur.

Application Example 3 The electronic component package according to Application Example 1 or 2, wherein the first and second mounting terminals have a stepped portion.

As described above, the first and second mounting terminals have a stepped structure, so that the solder layer at the peripheral portion of the mounting terminal that is subject to large strain can be thickened, and the bonding strength is strong against repeated temperature changes. A package having

Application Example 4 A piezoelectric vibrator including the electronic component package according to any one of Application Examples 1 to 3.

By configuring the piezoelectric vibrator as described above, the bottom face of the piezoelectric vibrator and the printed board surface are parallel when the mounting terminal of the piezoelectric vibrator and the printed board are joined via solder. A layer becomes uniform and it becomes difficult to produce a crack in solder.
Further, even if a crack occurs in the second mounting terminal, there is an advantage that the crack stops at the gap between the first mounting terminal and the second mounting terminal and does not extend.
Furthermore, even if a crack occurs in the solder of one of the first or second mounting terminals, it is possible to reduce malfunction of the electronic component due to poor connection of the terminals.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
1A and 1B are schematic views showing the configuration of an electronic component package 1 according to an embodiment of the present invention, where FIG. 1A is a bottom view and FIG. 1B is a cross-sectional view taken along the line QQ. The electronic component package 1 includes a rectangular package main body 5 on which the electronic component can be mounted, and a lid member 20 that hermetically seals the package main body 5 including the electronic component. And the electronic component package 1 is
A pair of first mounting terminals 6 in one diagonal region along the opposite side of the outer bottom surface of the package body 5.
7 are formed, and a pair of second mounting terminals 8 and 9 are formed in the other diagonal region. That is, the first mounting terminal 6 and the second mounting terminal 8, and the first mounting terminal 7 and the second mounting terminal 9.
Are arranged point-symmetrically with respect to the center of the outer bottom surface of the package body 5.

The package body 5 is configured by laminating, for example, a lower layer plate 5a, a middle layer plate 5b, and an upper layer plate 5c made of a ceramic material. The lower layer plate 5 a forms the bottom of the package body 5, the middle layer plate 5 b forms a mounting surface for electronic components, and the frame-shaped upper layer plate 5 c forms the internal space of the package body 5. A plurality of pad electrodes 11 for mounting electronic components are formed on the upper surface of the middle layer plate 5 b, and the pad electrodes 11 are electrically connected to the first mounting terminals 6 and 7 on the outer bottom surface by the internal wiring conductor 12.
A seal ring 5d is formed on the upper peripheral edge of the upper layer plate 5c, and the lid member 20 is seam welded to the seal ring 5d, so that the package 1 is hermetically sealed.
In the above description, an example of the package body 5 in which three layers of plates made of a ceramic material are stacked has been described. However, the electronic component package of the present invention is not limited to this, and two layers,
There may be four layers and five layers. The hermetic sealing is not limited to seam welding, but may be sealing using a low melting point glass or a low melting point brazing material such as gold tin for joining the package body and the lid member.

The electronic component package 1 according to the present invention is characterized in that a pair of first mounting terminals 6 and 7 are provided in one diagonal region of the outer bottom surface of the package body 5 and a pair of second mountings are provided in the other diagonal region. This is the point where terminals 8 and 9 are provided. The pair of first mounting terminals 6, 7 are arranged in a point-symmetrical pair with respect to the center point of the package body 5, and the pair of first mounting terminals 6, 7 are paired in a region along the opposite side where the first mounting terminals 6, 7 are not formed. Second mounting terminals 8 and 9 are formed. The mounting terminal 6 and the mounting terminal 8 and the mounting terminal 7 and the mounting terminal 9 are electrically connected by internal wiring conductors.
The shape of the second mounting terminals 8 and 9 is made smaller than that of the first mounting terminals 6 and 7, and the first mounting terminals 6 and 7 have a package body 5 as shown in FIG. Are connected to castellations C1 and C3 provided at the diagonal corners. The gap between the first mounting terminals 6 and 7 and the second mounting terminals 8 and 9 is about 80 μm to 100 μm.

By providing the first mounting terminals 6 and 7 and the second mounting terminals 8 and 9 on the outer bottom surface of the package body 5, when the package 1 is mounted on the printed board, the package 1 is printed via solder. It contacts the land of the board at 4 points. Therefore, the bottom surface of the package 1 is parallel to the printed circuit board surface, the solder layer sandwiched between them is uniform, and cracks are less likely to occur in the solder. In addition, since the land formed on the printed circuit board may be a symmetrical land, the printed circuit board can be widely used.
Even if cracks occur in the second mounting terminals 8 and 9 due to thermal strain or the like, the first mounting terminals 6
, 7 and the second mounting terminals 8, 9 have an effect that the crack stops and does not extend. Furthermore, since the pair of first mounting terminals are formed point-symmetrically, it is possible to reduce the capacitance between the mounting terminals and to prevent rotational distortion in the in-plane direction applied to the solder on the printed circuit board. It has the effect of being strengthened.

2A and 2B are schematic views showing a configuration of an electronic component package 2 according to a second embodiment of the present invention, where FIG. 2A is a bottom view and FIG. 2B is a cross-sectional view taken along the line Q-Q. . The difference from the electronic component package 1 shown in FIG. 1 is the structure of the mounting terminals provided on the outer bottom surface of the package body 5. The first mounting terminal has a step structure of terminals 6, 6a and 7, 7a, respectively, and the second mounting terminal has a step structure of 8, 8a, 9, 9a, respectively. In order to configure the step structure, first, the mounting terminals 6 and 7 are formed using a technique such as screen printing, and the mounting terminals 6 a and 7 a having a slightly smaller shape are formed on the mounting terminals 6 and 7. Similarly, the mounting terminals 8a and 9a having a smaller shape are overlapped with the mounting terminals 8 and 9 to form second mounting terminals 8 and 8a and 9 and 9a having a step structure.
Since the mounting terminals 6, 6a, 7, 7a and 8, 8a, 9, 9a have a stepped structure, it becomes possible to increase the thickness of the solder layer in the peripheral portion of the mounting terminal where the distortion is the largest, and the package and the printed circuit board. As a result, the solder is less likely to crack due to repeated thermal strain.

Fig.3 (a) is a bottom view of the modification of the package main body 5 shown to Fig.1 (a). FIG.
) Of the first and second mounting terminals 6, 7, 8, 9 are respectively L-shaped mounting terminals 6,
In this example, the mounting terminals 7 have an inverted L shape, and the first mounting terminals 6 and 7 are arranged point-symmetrically with respect to the center of the bottom surface. The first mounting terminals 6 and 7 are electrically connected to the castellations C3 and C1, and the bonding strength between the package and the printed board is increased. In FIG. 3A and subsequent figures,
Mounting terminals having the same functions as those in FIG.
FIG. 3B shows an example in which the first mounting terminals 6 and 7 shown in FIG. 3A have a step structure, the mounting terminal 6 has a step structure of 6 and 6a, and the mounting terminal 7 has a step structure of 7 and 7a. is there. By adopting a stepped structure for the mounting terminal, the thickness of the solder around the terminal having a large strain is increased, and cracks are less likely to occur due to repeated thermal strain.

FIGS. 4A and 4B are bottom views of modifications of the package body 5 shown in FIGS. 3A and 3B, respectively. FIG. 4A shows a package in which a pair of second mounting terminals 8 and 9 are formed in vacant regions in the upper right corner and the lower left corner of the pair of first mounting terminals 6 and 7 in FIG. 4 is a bottom view of the main body 5. FIG. The gap between the first mounting terminals 6 and 7 and the second mounting terminals 8 and 9 is 80 μm to 10 μm.
It is about 0 μm. The first mounting terminal 6 and the second mounting terminal 8, and the first mounting terminal 7 and the second mounting terminal 9 are electrically connected by the internal conductor wiring.
In FIG. 4B, the pair of first mounting terminals 6 and 7 in FIG. 4A are overlaid with mounting terminals 6a and 7a having a smaller shape, respectively, and the step structure shown in FIG. 1 mounting terminal 6
, 6a and 7, 7a. Similarly, a pair of second mounting terminals 8 and 9 in FIG. 4A are overlapped with mounting terminals 8a and 9a having a smaller shape, respectively, and a second mounting terminal having a step structure shown in FIG. In this example, 8, 8a and 9, 9a are used.
Gaps are provided between the first mounting terminals 6, 6a and 7, 7a and the second mounting terminals 8, 8a and 9, 9a, respectively. The first mounting terminals 6 and 6a and the second mounting terminals 8 and 8a are electrically connected by the internal conductor wiring, and the first mounting terminals 7 and 7a and the second mounting terminals 9 and 9a are also electrically connected.

FIG. 5 is a bottom view of a modified example of the package body 5 shown in FIG. 1 (a). The pair of second mounting terminals 8 and 9 shown in FIG. It is a bottom view. The first mounting terminals 6, 7 are electrically connected to the castellations C3, C1, and the second mounting terminals 8,
The same goes for Nine.
In the following embodiments, the first mounting terminal and the second mounting terminal are electrically connected to each other, but this is not described in detail.
Fig.6 (a) is a bottom view of the modification of the package main body 5 shown to Fig.3 (a). FIG.
The mounting terminals 6 and 7 shown in FIG. 6 are arranged symmetrically with respect to the center of the package body 5.
The mounting terminals 6 and 7 in FIG. 6A are arranged symmetrically with respect to the center line in the short direction of the package body 5. That is, the mounting terminal 7 in FIG. 6A has the same shape as the mounting terminal 7 in FIG. 3A, but the mounting terminal 6 in FIG. 6A has an inverted L-shape. The end portion of the package faces the end of the bottom surface of the package body 5.
FIG. 6B is a bottom view of a modified example of the package body 5 shown in FIG.
) Of the pair of first mounting terminals 6, 7 in a pair of second mounting terminals 8 in the vacant areas at both lower corners in the drawing.
, 9 are provided to form the package body 5.

Fig.7 (a) is a bottom view of the modification of the package main body 5 shown to Fig.6 (a). FIG.
), The end portions of the inverted L-shape of the mounting terminals 6 and 7 face the outside of the bottom surface. However, the shape of the mounting terminals 6 and 7 shown in FIG. It faces the center and has a symmetrical shape with respect to the center line in the short direction.
FIG.7 (b) is a bottom view of the modification of the package main body 5 shown to Fig.7 (a). FIG.
) Of the first mounting terminals 6 and 7, a pair of second mounting terminals 8,
9 is an example in which the package body 5 is configured.
Fig.8 (a) is a bottom view of the modification of the package main body 5 shown to Fig.7 (a). FIG.
The shape of the first mounting terminal 7 in FIG. 7 is the same as that of the first mounting terminal 7 shown in FIG. 7A, but the shape of the first mounting terminal 6 in FIG. The first mounting terminal 6 shown in FIG. 5A is inverted in the direction of the center line in the longitudinal direction of the package body 5, and the inverted L-shaped end portion faces the outside of the bottom surface of the package body 5. That is, the first mounting terminals 6 and 7 in FIG. 8A have the same shape, and the mounting terminals 6 are formed such that the mounting terminals 7 are translated in the longitudinal direction of the package body 5. .
FIG. 8B is a bottom view of a modification of the package body 5 shown in FIG. FIG.
The second mounting terminal 8 is provided in a vacant area in the lower right corner of the first mounting terminal 6 in the figure, and the second mounting terminal 9 is provided in a vacant area near the center of the first mounting terminal 7 in the figure. This is an example in which the package body 5 is configured.

Fig.9 (a) is a bottom view of the modification of the package main body 5 shown to Fig.8 (a). FIG.
The first mounting terminal 7 of FIG. 9 has the same shape as the first mounting terminal 7 of FIG.
The first mounting terminal 6 in FIG. 8 has a shape obtained by inverting the first mounting terminal 6 in FIG. 8A in the direction of the center line in the longitudinal direction of the package body 5. That is, the first mounting terminal 6 in FIG. 9A has an L shape, and the first mounting terminals 6 and 7 are arranged point-symmetrically with respect to the center of the bottom surface.
FIG. 9B is a bottom view of a modification of the package body 5 shown in FIG. FIG.
The second mounting terminal 8 is provided in a vacant area in the upper right corner of the first mounting terminal 6 in the figure, and the second mounting terminal 9 is provided in a vacant area near the center of the first mounting terminal 7 in the figure. This is an example in which the package body 5 is configured.
FIG. 10 is a bottom view of a modified example of the package body 5 shown in FIG. In this example, the package body 5 is configured by providing a pair of first mounting terminals 6 and 7 having a shape obtained by rotating a T-shape by 90 degrees on the bottom surface. The mounting terminals 6 and 7 have a point-symmetric shape with respect to the center of the bottom view of the package body 5.
FIG. 11 is a bottom view of a modified example of the package body 5 shown in FIG. A second mounting terminal 8 is provided in a vacant area in the upper right corner of the first mounting terminal 6 in FIG. 10, and a second mounting terminal 9 is provided in an vacant area in the lower left corner of the first mounting terminal 7 in the figure. This is an example in which the package body 5 is configured.

FIG. 12A is a bottom view of a modification of the package body 5 shown in FIG. FIG.
The first mounting terminals 6 and 7 of FIG. 10 are shaped by inverting the first mounting terminals 6 and 7 shown in FIG. The directions of the T-shaped vertical bars are directed toward the center along the longitudinal direction of the package body 5 and are symmetrical with respect to the center of the bottom surface of the package body 5.
FIG.12 (b) is a bottom view of the modification of the package main body 5 shown to Fig.12 (a). FIG.
2 (a), the second mounting terminal 8 is provided in the vacant area at the upper left in the drawing of the first mounting terminal 6, and the second mounting terminal is provided in the vacant area at the lower right in the drawing of the first mounting terminal 7. 9 is an example in which the package body 5 is configured. That is, the first mounting terminal 6 and the second mounting terminal 8, and the first mounting terminal 7 and the second mounting terminal 9 are arranged symmetrically with respect to the center of the bottom surface of the package body 5. .
FIG. 13A is a bottom view of a modification of the package body 5 shown in FIG. FIG.
The first mounting terminal 7 in FIG. 13 has the same shape as the first mounting terminal 7 in FIG.
The first mounting terminal 6 in a) has an L shape.
FIG.13 (b) is a bottom view of the modification of the package main body 5 shown to Fig.13 (a). FIG.
The second mounting terminal 8 is provided in a vacant area in the upper right corner of the first mounting terminal 6 in FIG.
This is an example in which the package main body 5 is configured by providing the second mounting terminal 9 in an open area in the lower left corner of the mounting terminal 7 in FIG.

FIG. 14 is a side view of the piezoelectric vibrator 3 configured by using, for example, the package body 5 shown in FIG. The piezoelectric vibrator 3 includes a package body 5, a piezoelectric vibration element 30, a lid member 20,
It has. A conductive adhesive 22 is applied to the pad electrode 11 of the package body 5, the piezoelectric vibration element 30 is placed on the conductive adhesive 22, and the piezoelectric vibration element 30 is lightly pressed. After the conductive adhesive 22 is dried, the lid member 20 is seam welded onto the seal ring 5d of the package body 5 in an atmosphere of an inert gas such as dry nitrogen or in a vacuum, and is hermetically sealed.
The piezoelectric vibrator 3 is completed. Needless to say, even when the package shown in FIG. 1 or FIGS. 3 to 13 is used, the piezoelectric vibrator can be configured in the same manner as in FIG.
By configuring the piezoelectric vibrator using the above-described package for electronic components, when the mounting terminal of the piezoelectric vibrator and the printed board are joined via solder, the bottom face of the piezoelectric vibrator and the printed board surface are Since they are parallel to each other, there is an effect that the solder layer becomes uniform and cracks are hardly generated in the solder.
Further, even if a crack occurs in the second mounting terminal, there is an effect that the crack stops at the gap between the first mounting terminal and the second mounting terminal and does not extend. Furthermore, even if a crack occurs in the solder of one of the first or second mounting terminals, there is an effect that the malfunction of the electronic component due to the terminal connection failure can be reduced.

It is the schematic which showed the structure of the package based on this invention, (a) is a bottom view, (b) is sectional drawing. It is the figure which showed the structure of the package of the 2nd Example, (a) is a bottom view, (b) is sectional drawing. (A) is a bottom view of a package according to another embodiment, and (b) is a bottom view of a package having a stepped mounting terminal according to another embodiment. (A) is a bottom view of a package according to another embodiment, and (b) is a bottom view of a package having a stepped mounting terminal according to another embodiment. It is a bottom view of the package of another Example. (A) is a bottom view of a package of another embodiment, and (b) is a bottom view of a package of another embodiment. (A) is a bottom view of a package of another embodiment, and (b) is a bottom view of a package of another embodiment. (A) is a bottom view of a package of another embodiment, and (b) is a bottom view of a package of another embodiment. (A) is a bottom view of a package of another embodiment, and (b) is a bottom view of a package of another embodiment. It is a bottom view of the package of another Example. It is a bottom view of the package of another Example. (A) is a bottom view of a package of another embodiment, and (b) is a bottom view of a package of another embodiment. (A) is a bottom view of a package of another embodiment, and (b) is a bottom view of a package of another embodiment. It is sectional drawing which shows the structure of a piezoelectric vibrator. (A) is sectional drawing which shows the structure of the conventional piezoelectric vibrator, (b) is a bottom view.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1, 2 ... Package, 3 ... Piezoelectric vibrator, 5 ... Package main body, 5a ... Lower layer board, 5b ... Middle layer board, 5c ... Upper layer board, 5d ... Seal ring, 6, 7, 6a, 7a ... 1st mounting terminal , 8,
9, 8a, 9a ... second mounting terminal, 11 ... pad electrode, 12 ... internal conductor wiring, 20 ... lid member, 22 ... conductive adhesive, 30 ... piezoelectric vibration element, C1, C2, C3, C4 ... caster The

Claims (4)

An electronic component package having a rectangular package main body on which an electronic component can be mounted, and a lid member that hermetically seals the package main body including the electronic component,
Forming a pair of first mounting terminals in one diagonal region of the outer bottom surface of the package body;
Forming a pair of second mounting terminals in the other diagonal region of the outer bottom surface of the package body;
The electronic component package, wherein the first mounting terminal and the second mounting terminal are electrically connected. An electronic component package having a rectangular package main body on which an electronic component can be mounted, and a lid member that hermetically seals the package main body including the electronic component,
Forming a pair of first mounting terminals on the outer bottom surface of the package body at a point-symmetrical position with respect to a center point of the package body;
A pair of second mounting terminals are formed in a region opposite to the outer bottom surface of the package body and where the first mounting terminals are not formed, and the first mounting terminals and the second mounting terminals are formed. An electronic component package that is electrically connected to a mounting terminal. The electronic component package according to claim 1, wherein the first and second mounting terminals have a stepped portion. A piezoelectric vibrator comprising the electronic component package according to claim 1.

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