JPS6420693A - Ic mounting device - Google Patents
Ic mounting deviceInfo
- Publication number
- JPS6420693A JPS6420693A JP17641087A JP17641087A JPS6420693A JP S6420693 A JPS6420693 A JP S6420693A JP 17641087 A JP17641087 A JP 17641087A JP 17641087 A JP17641087 A JP 17641087A JP S6420693 A JPS6420693 A JP S6420693A
- Authority
- JP
- Japan
- Prior art keywords
- board
- lead
- land
- mounting device
- manner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
PURPOSE:To allow to easily mount an IC in a limited space on a board, by fixing a lead press fitting on the board using a screw and the like in such a manner that each lead of the IC is fixed on a soldering land which corresponds to the frame member thereof in a pressed state. CONSTITUTION:To mount a flat package type IC 1 on a printed board 2, a through hole 7 corresponding to a screw inserting hole 6 is bored and the IC 1 is mounted on the printed board 2 in such a manner that a lead 1a of the IC 1 is located on a solder land 2a. A frame body 4 is set on the board 2 and tightened by nuts after inserting screws 8 into holes 6 and 7 of the board. In this way, each lead 1a is fixed on the corresponding land 2a in a pressed state. According to this IC mounting device, a flat package type IC can be mounted in a limited space simply without using any socket and the like.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17641087A JPS6420693A (en) | 1987-07-15 | 1987-07-15 | Ic mounting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17641087A JPS6420693A (en) | 1987-07-15 | 1987-07-15 | Ic mounting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6420693A true JPS6420693A (en) | 1989-01-24 |
Family
ID=16013192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17641087A Pending JPS6420693A (en) | 1987-07-15 | 1987-07-15 | Ic mounting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6420693A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0195778U (en) * | 1987-12-18 | 1989-06-26 | ||
US5006962A (en) * | 1989-12-28 | 1991-04-09 | Intel Corporation | Apparatus for surface mounting an integrated circuit package |
US5161984A (en) * | 1991-10-16 | 1992-11-10 | Amp Incorporated | Electrical socket |
-
1987
- 1987-07-15 JP JP17641087A patent/JPS6420693A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0195778U (en) * | 1987-12-18 | 1989-06-26 | ||
US5006962A (en) * | 1989-12-28 | 1991-04-09 | Intel Corporation | Apparatus for surface mounting an integrated circuit package |
US5161984A (en) * | 1991-10-16 | 1992-11-10 | Amp Incorporated | Electrical socket |
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