JPS6413792A - Mounting structure of part - Google Patents

Mounting structure of part

Info

Publication number
JPS6413792A
JPS6413792A JP17016287A JP17016287A JPS6413792A JP S6413792 A JPS6413792 A JP S6413792A JP 17016287 A JP17016287 A JP 17016287A JP 17016287 A JP17016287 A JP 17016287A JP S6413792 A JPS6413792 A JP S6413792A
Authority
JP
Japan
Prior art keywords
lead
wiring board
printed wiring
askew
mounting structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17016287A
Other languages
Japanese (ja)
Inventor
Hiroyuki Tsukuni
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP17016287A priority Critical patent/JPS6413792A/en
Publication of JPS6413792A publication Critical patent/JPS6413792A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To lower height, and to facilitate work by inserting a lead askew into a slot bored to a printed wiring board and mounting the part aslant. CONSTITUTION:A part 1 is soldered by solder 4 under the state in which a lead 2 is inserted askew into a through hole slot 5 in a multilayer printed wiring board 3. Accordingly, the work of the bending of the lead can be removed.
JP17016287A 1987-07-07 1987-07-07 Mounting structure of part Pending JPS6413792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17016287A JPS6413792A (en) 1987-07-07 1987-07-07 Mounting structure of part

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17016287A JPS6413792A (en) 1987-07-07 1987-07-07 Mounting structure of part

Publications (1)

Publication Number Publication Date
JPS6413792A true JPS6413792A (en) 1989-01-18

Family

ID=15899831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17016287A Pending JPS6413792A (en) 1987-07-07 1987-07-07 Mounting structure of part

Country Status (1)

Country Link
JP (1) JPS6413792A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009043812A (en) * 2007-08-07 2009-02-26 Toa Corp Power electronics device
JP2013128039A (en) * 2011-12-19 2013-06-27 Panasonic Corp Circuit arrangement
JP2019149063A (en) * 2018-02-28 2019-09-05 能美防災株式会社 Heat sensor
JP2020166549A (en) * 2019-03-29 2020-10-08 能美防災株式会社 Heat detector
JP2021033874A (en) * 2019-08-28 2021-03-01 能美防災株式会社 Heat detector

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009043812A (en) * 2007-08-07 2009-02-26 Toa Corp Power electronics device
JP2013128039A (en) * 2011-12-19 2013-06-27 Panasonic Corp Circuit arrangement
JP2019149063A (en) * 2018-02-28 2019-09-05 能美防災株式会社 Heat sensor
JP2022088675A (en) * 2018-02-28 2022-06-14 能美防災株式会社 Heat sensor
JP2020166549A (en) * 2019-03-29 2020-10-08 能美防災株式会社 Heat detector
JP2021033874A (en) * 2019-08-28 2021-03-01 能美防災株式会社 Heat detector

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