JPS6455895A - Soldering method - Google Patents

Soldering method

Info

Publication number
JPS6455895A
JPS6455895A JP21251287A JP21251287A JPS6455895A JP S6455895 A JPS6455895 A JP S6455895A JP 21251287 A JP21251287 A JP 21251287A JP 21251287 A JP21251287 A JP 21251287A JP S6455895 A JPS6455895 A JP S6455895A
Authority
JP
Japan
Prior art keywords
solder
printed board
holes
hole
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP21251287A
Other languages
Japanese (ja)
Inventor
Akio Kurane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP21251287A priority Critical patent/JPS6455895A/en
Publication of JPS6455895A publication Critical patent/JPS6455895A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Landscapes

  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To solder parts to both surfaces of a printed board efficiently, by dipping one surface of the printed board having through holes into a solder bath, and soldering the electrodes of the parts on the other surface of the printed board with solder which is intruded by way of the through holes. CONSTITUTION:A printed board 1 has copper foil patterns 4 and through holes 8. Chip parts 2 and 3 and a discrete part 2a are attached with paste (temporarily fixed with a bonding agent). An electrode 7 of the discrete part 2a is formed at the opening part of the through hole 8. The copper foil pattern 4 is formed on the other surface from the inside of the through hole 8. One surface having the chip parts 3 is dipped into a solder bath (dipping solder bath) in a soldering step. At this time, the solder rises up by a capillary phenomenon from the lower part. When the rising is insufficient, the solder can be blown up from the lower side or sucked from the upper side for assistance. Thus, the electrode 7 of the discrete part 2a is soldered at the opening part of the through hole.
JP21251287A 1987-08-26 1987-08-26 Soldering method Pending JPS6455895A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP21251287A JPS6455895A (en) 1987-08-26 1987-08-26 Soldering method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21251287A JPS6455895A (en) 1987-08-26 1987-08-26 Soldering method

Publications (1)

Publication Number Publication Date
JPS6455895A true JPS6455895A (en) 1989-03-02

Family

ID=16623900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21251287A Pending JPS6455895A (en) 1987-08-26 1987-08-26 Soldering method

Country Status (1)

Country Link
JP (1) JPS6455895A (en)

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