JPS6468915A - Chip component - Google Patents
Chip componentInfo
- Publication number
- JPS6468915A JPS6468915A JP62227431A JP22743187A JPS6468915A JP S6468915 A JPS6468915 A JP S6468915A JP 62227431 A JP62227431 A JP 62227431A JP 22743187 A JP22743187 A JP 22743187A JP S6468915 A JPS6468915 A JP S6468915A
- Authority
- JP
- Japan
- Prior art keywords
- trapezoid
- sectional form
- solder
- soldered
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 abstract 3
- 238000005476 soldering Methods 0.000 abstract 3
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Details Of Resistors (AREA)
Abstract
PURPOSE:To surely perform solder without producing non-soldering part by making the sectional form of the title component a trapezoid and providing electrodes on the slope thereof. CONSTITUTION:A chip component make its sectional form a trapezoid and the longer side of the trapezoid comes in contact with a printed board and is really mounted face 1 soldered when the components are really mounted. The really mounted face 1 is a printed board side, flowed in a flow soldering bath and chip components are soldered on electrodes 2. The thickness is thin because the sectional form is trapezoid and non-soldering part is not produced when solder is performed by a flow solder machine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62227431A JPS6468915A (en) | 1987-09-09 | 1987-09-09 | Chip component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62227431A JPS6468915A (en) | 1987-09-09 | 1987-09-09 | Chip component |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6468915A true JPS6468915A (en) | 1989-03-15 |
Family
ID=16860748
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62227431A Pending JPS6468915A (en) | 1987-09-09 | 1987-09-09 | Chip component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6468915A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5388024A (en) * | 1993-08-02 | 1995-02-07 | Avx Corporation | Trapezoid chip capacitor |
JP2015023173A (en) * | 2013-07-19 | 2015-02-02 | Tdk株式会社 | Laminated capacitor |
JP2015220110A (en) * | 2014-05-19 | 2015-12-07 | Tdk株式会社 | Power storage device |
JP2016072486A (en) * | 2014-09-30 | 2016-05-09 | 株式会社村田製作所 | Multilayer ceramic capacitor |
-
1987
- 1987-09-09 JP JP62227431A patent/JPS6468915A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5388024A (en) * | 1993-08-02 | 1995-02-07 | Avx Corporation | Trapezoid chip capacitor |
JP2015023173A (en) * | 2013-07-19 | 2015-02-02 | Tdk株式会社 | Laminated capacitor |
JP2015220110A (en) * | 2014-05-19 | 2015-12-07 | Tdk株式会社 | Power storage device |
JP2016072486A (en) * | 2014-09-30 | 2016-05-09 | 株式会社村田製作所 | Multilayer ceramic capacitor |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR890004824B1 (en) | Printed circuit board | |
NZ184109A (en) | Fluxed solder composition used in printed circuit board production: soft soldering | |
EP0358332A3 (en) | Circuit board and method of soldering | |
JPS6468915A (en) | Chip component | |
EP0039160A3 (en) | Methods for bonding conductive bumps to electronic circuitry | |
JPS6421876A (en) | Electrical structural component with contact pin | |
JPS5718347A (en) | Mounting structure of ic | |
JPS57190341A (en) | Circuit borad composition | |
JPS5789331A (en) | Tuner device | |
JPS6413792A (en) | Mounting structure of part | |
JPS6424493A (en) | Method for mounting chip component | |
JPS6477991A (en) | Printed circuit board | |
JPS6477988A (en) | Printed wiring board | |
CA2058716A1 (en) | Printed circuit board assembly handle/stiffener | |
GB2019093A (en) | Improvements in or relating to electrical assemblies or components having connecting wires for insertion into bores of circuit boards | |
KR910009211Y1 (en) | Pcb | |
JPS6421884A (en) | Molding method for connector pin of multilayer ceramics circuit board | |
JPS5685844A (en) | Diode composite circuit device | |
JPH01168951U (en) | ||
JPS6424494A (en) | Formation of solder layer on printed wiring board | |
JPS6444266A (en) | Automatic soldering device | |
JPS6466993A (en) | Printed wiring board | |
JPS6355574U (en) | ||
Berkshire et al. | Soldering Apparatus and Method | |
JPS6455895A (en) | Soldering method |