JPS6468915A - Chip component - Google Patents

Chip component

Info

Publication number
JPS6468915A
JPS6468915A JP22743187A JP22743187A JPS6468915A JP S6468915 A JPS6468915 A JP S6468915A JP 22743187 A JP22743187 A JP 22743187A JP 22743187 A JP22743187 A JP 22743187A JP S6468915 A JPS6468915 A JP S6468915A
Authority
JP
Japan
Prior art keywords
trapezoid
sectional form
solder
soldered
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22743187A
Other languages
Japanese (ja)
Inventor
Fushimi Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP22743187A priority Critical patent/JPS6468915A/en
Publication of JPS6468915A publication Critical patent/JPS6468915A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Abstract

PURPOSE:To surely perform solder without producing non-soldering part by making the sectional form of the title component a trapezoid and providing electrodes on the slope thereof. CONSTITUTION:A chip component make its sectional form a trapezoid and the longer side of the trapezoid comes in contact with a printed board and is really mounted face 1 soldered when the components are really mounted. The really mounted face 1 is a printed board side, flowed in a flow soldering bath and chip components are soldered on electrodes 2. The thickness is thin because the sectional form is trapezoid and non-soldering part is not produced when solder is performed by a flow solder machine.
JP22743187A 1987-09-09 1987-09-09 Chip component Pending JPS6468915A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22743187A JPS6468915A (en) 1987-09-09 1987-09-09 Chip component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22743187A JPS6468915A (en) 1987-09-09 1987-09-09 Chip component

Publications (1)

Publication Number Publication Date
JPS6468915A true JPS6468915A (en) 1989-03-15

Family

ID=16860748

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22743187A Pending JPS6468915A (en) 1987-09-09 1987-09-09 Chip component

Country Status (1)

Country Link
JP (1) JPS6468915A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5388024A (en) * 1993-08-02 1995-02-07 Avx Corporation Trapezoid chip capacitor
JP2015023173A (en) * 2013-07-19 2015-02-02 Tdk株式会社 Laminated capacitor
JP2015220110A (en) * 2014-05-19 2015-12-07 Tdk株式会社 Power storage device
JP2016072486A (en) * 2014-09-30 2016-05-09 株式会社村田製作所 Multilayer ceramic capacitor

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5388024A (en) * 1993-08-02 1995-02-07 Avx Corporation Trapezoid chip capacitor
JP2015023173A (en) * 2013-07-19 2015-02-02 Tdk株式会社 Laminated capacitor
JP2015220110A (en) * 2014-05-19 2015-12-07 Tdk株式会社 Power storage device
JP2016072486A (en) * 2014-09-30 2016-05-09 株式会社村田製作所 Multilayer ceramic capacitor

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