JPS58221667A - Soldering method of chip parts - Google Patents
Soldering method of chip partsInfo
- Publication number
- JPS58221667A JPS58221667A JP57103224A JP10322482A JPS58221667A JP S58221667 A JPS58221667 A JP S58221667A JP 57103224 A JP57103224 A JP 57103224A JP 10322482 A JP10322482 A JP 10322482A JP S58221667 A JPS58221667 A JP S58221667A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- solder
- chip parts
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
【発明の詳細な説明】
本発明は両面に導体層を有する印刷配線板にチップ部品
を効率的に半田付けする方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for efficiently soldering chip components to printed wiring boards having conductor layers on both sides.
一般に両面に導体層を有する印刷配線板にチップ部品を
半田付けする場合には先ず表に形成した導体層にクリー
ム半田を塗布し、この半田によってチップ部品を印刷配
線板の表側に半田付けし、しかる後改めて印刷配線板の
裏面に接着剤を用いてチップ部品を装着し、このチップ
部品を浸漬半田付法によって上記印刷配線板の裏面に半
田付けするようにしている。しかしながら、この種のも
のでは表にチップ部品を半田付けする場合と裏にチップ
部品を半田付けする場合とでそれぞれ別々の半田付法を
採用しており、全体としてその作業性が著しく悪いとい
う問題があった。Generally, when soldering chip components to a printed wiring board that has conductor layers on both sides, cream solder is first applied to the conductor layer formed on the front side, and the chip components are soldered to the front side of the printed wiring board using this solder. Thereafter, the chip component is again attached to the back surface of the printed wiring board using an adhesive, and this chip component is soldered to the back surface of the printed wiring board by dip soldering. However, with this type of product, separate soldering methods are used for soldering chip components on the front side and when soldering chip components on the back side, and the overall workability is extremely poor. was there.
本発明は以上のような従来の欠点を除去するものであシ
、簡単な方法で容易に半田付けできる優れた半田付方法
を提供するものである。The present invention eliminates the above-mentioned conventional drawbacks and provides an excellent soldering method that enables easy soldering.
以下、本発明の半田付方法について一実施例の図面とと
もに説明する。図において１は表裏両面にそれぞれ導体
層２，３を有する印刷配線板であシ、表側に形成した導
体ｗ２のチップ部品取付位置にはそれぞれスルーホール
４を形成”ｊ”＋ｏ ５゜６はそれぞれ接着剤７，８を
用いて上記印刷配線板１の表裏に固定されたリード線を
有しないチップ部品であり１両端には図示していないが
それぞれ電極を有し、この電極がそれぞれ上記導体層２
゜３に対向するようにする。そして印刷配線板１の表側
に固定されたチップ部品５は上記電極の一部が上記スル
ーホール４に対向するように取付ける。Hereinafter, the soldering method of the present invention will be explained with reference to the drawings of one embodiment. In the figure, 1 is a printed wiring board having conductor layers 2 and 3 on both the front and back sides, and through holes 4 are formed at the chip component mounting positions of the conductor w2 formed on the front side. It is a chip component without lead wires that is fixed to the front and back sides of the printed wiring board 1 using adhesives 7 and 8, and has electrodes (not shown) at both ends of the 1, and these electrodes are connected to the conductor layer, respectively. 2
It should face ゜3. The chip component 5 fixed to the front side of the printed wiring board 1 is attached so that a part of the electrode faces the through hole 4.
そしてこのようにしてチップ部品５，６を取付けた後、
上記印刷配線板１の裏面を溶融し゛た半田に浸漬する。After installing the chip parts 5 and 6 in this way,
The back side of the printed wiring board 1 is immersed in molten solder.
印刷配線板１の裏面を浴融した半田に浸漬すると、この
半田によって先ず裏面に固定されたチップ部品６が印刷
配線板１の裏面に形成された導体層３に半田付けされる
。そして、溶融した半田は更にスルーホールを通して印
刷配線板１の裏側に導かれここで印刷配線板１の表側に
固定したチップ部品６が印刷配線板１の表面に形成した
導体層２に半田付けされる。すなわち、図゛において９
，１０はそれぞれ印刷配線板１の裏面を溶融した半田に
浸漬したことによって印刷配線板１の表裏に付着した半
田であり、印刷配線板１の表裏に固定したチップ部品５
，６は上記半田９，１゜によって／ｌぼ同時に正確に半
田付けされる。When the back surface of the printed wiring board 1 is dipped in solder melted in a bath, the chip components 6 fixed to the back surface are first soldered to the conductive layer 3 formed on the back surface of the printed wiring board 1. The molten solder is further guided to the back side of the printed wiring board 1 through the through holes, where the chip component 6 fixed to the front side of the printed wiring board 1 is soldered to the conductive layer 2 formed on the surface of the printed wiring board 1. Ru. In other words, 9 in Fig.
, 10 are solders that have adhered to the front and back surfaces of the printed wiring board 1 by dipping the back surface of the printed wiring board 1 in molten solder, respectively, and chip components 5 fixed to the front and back surfaces of the printed wiring board 1
, 6 are accurately soldered at about the same time by the solder 9, 1°.
本発明は上記実施例より明らかなように、印刷配線板と
して表側に形成した導体層のチップ部品取付位置にスル
ーホールを形成したものを使用し、印刷配線板の表裏に
そｎぞれ接着剤を用いてチップ部品を取付け、その後印
刷配線板の裏面全浴融した半田に浸漬するようにしたも
のであ夛、従来のように別々の２つの方法を用いること
なく一度に同じ方法で表裏両面に同時にチップ部品を半
田付けすることができ、全体としてその作業性が著しく
向上し、大巾なコストダウンを図ることができるなどき
わめて有利なものである。As is clear from the above embodiments, the present invention uses a printed wiring board in which through-holes are formed at chip component mounting positions in a conductive layer formed on the front side, and adhesive is applied to each of the front and back sides of the printed wiring board. The chip components are attached using a wafer, and then the back side of the printed wiring board is immersed in solder that has been melted in a full bath.This method eliminates the need to use two separate methods as was the case in the past. It is extremely advantageous in that chip parts can be soldered simultaneously to the wafer, the overall workability is significantly improved, and costs can be significantly reduced.
図は本発明の半田付方法を用いて半田付けした印刷配線
板の一実施例の断側面図である。
１・・・・・・印刷配線板、２，３・・・・・・導体層
、４・旧・・スルーホール、５，６・・・・・・チップ
部品、７，８・・・・・・接着剤、９，１０・・・・・
・半田。The figure is a cross-sectional side view of an embodiment of a printed wiring board soldered using the soldering method of the present invention. 1... Printed wiring board, 2, 3... Conductor layer, 4... Old through hole, 5, 6... Chip parts, 7, 8...・・Adhesive, 9, 10・・・・
·solder.
Claims (1)
のチップ部品取付位置にそれぞれスルーホールを有する
印刷配線板を使用し、この印刷配線板の表裏にそれぞれ
接着剤を用いてチップ部品を装着し、その後、上記印刷
配線板の裏面を溶融した半田に浸漬し、この半田によっ
て上記印刷配線板の裏面に装着されたチップ部品を上記
印刷配線板の裏面に形成された導体層に半田付けすると
共に上記印刷配線板に形成された上記スルーホールを通
して上記半田を上記印刷配線板の表面側に導出させ、上
記表面側に導出した上記半田によって上記印刷配線板の
表面に装着されたチップ部品を上記印刷配線板の表面に
形成された導体層に半田付けするようにしたことを特徴
とするチップ部品の半田付方法。A printed wiring board is used, which has a conductor layer on each of the front and back sides, and through-holes at the chip component mounting positions of the conductor layer formed on the surface, and adhesive is used on each of the front and back sides of this printed wiring board to attach the chip components. Then, the back side of the printed wiring board is dipped in molten solder, and the solder is used to solder the chip components mounted on the back side of the printed wiring board to the conductor layer formed on the back side of the printed wiring board. At the same time, the solder is led out to the front surface side of the printed wiring board through the through hole formed in the printed wiring board, and the chip component mounted on the surface of the printed wiring board is connected to the solder led out to the front surface side. A method for soldering chip components, characterized in that soldering is performed on a conductor layer formed on the surface of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57103224A JPS58221667A (en) | 1982-06-15 | 1982-06-15 | Soldering method of chip parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57103224A JPS58221667A (en) | 1982-06-15 | 1982-06-15 | Soldering method of chip parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58221667A true JPS58221667A (en) | 1983-12-23 |
Family
ID=14348514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57103224A Pending JPS58221667A (en) | 1982-06-15 | 1982-06-15 | Soldering method of chip parts |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58221667A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2601545A1 (en) * | 1986-07-09 | 1988-01-15 | Constr Telephoniques | Method for equipping a board with electronic components |
| FR2619276A1 (en) * | 1987-08-07 | 1989-02-10 | Cit Alcatel | Double-sided or multi-layer hybrid printed circuit board |
| US4982376A (en) * | 1989-04-20 | 1991-01-01 | U.S. Philips Corporation | Method of mounting electrical and/or electronic components on a single-sided printed board |
-
1982
- 1982-06-15 JP JP57103224A patent/JPS58221667A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2601545A1 (en) * | 1986-07-09 | 1988-01-15 | Constr Telephoniques | Method for equipping a board with electronic components |
| FR2619276A1 (en) * | 1987-08-07 | 1989-02-10 | Cit Alcatel | Double-sided or multi-layer hybrid printed circuit board |
| US4982376A (en) * | 1989-04-20 | 1991-01-01 | U.S. Philips Corporation | Method of mounting electrical and/or electronic components on a single-sided printed board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3060896B2 (en) | Structure of bump electrode | |
| JPH0669005B2 (en) | Multi-layer sheet coil | |
| JPH02100392A (en) | Circuit board and soldering method | |
| EP0126164A4 (en) | Method of connecting double-sided circuits. | |
| US5863406A (en) | Method of manufacturing a printed circuit board | |
| JPS58221667A (en) | Soldering method of chip parts | |
| JPS5857785A (en) | Method of mounting electronic part | |
| JPH06349561A (en) | Method of soldering lead terminal to wiring board | |
| JPS6352795B2 (en) | ||
| JPH03152993A (en) | Mounting of component on printed wiring board | |
| JP3152230B2 (en) | Manufacturing method of liquid crystal display device | |
| JPH0311903Y2 (en) | ||
| JPS60218900A (en) | Printed circuit board | |
| JPH0116039B2 (en) | ||
| JPH0634710Y2 (en) | Printed wiring board | |
| JPS589395A (en) | Method of mounting chip part | |
| JPH02301725A (en) | Soldered terminal | |
| JPS5823955B2 (en) | Insatsu High Senban | |
| JPS58216493A (en) | Laminated substrate for printed circuit and method of producing flexible electric circuit board using same laminated substrate | |
| JP2002158427A (en) | Printed wiring board, component mounting board and electronic apparatus | |
| JPS614295A (en) | Method of producing printed circuit board | |
| JPH088510A (en) | Leadless chip carrier | |
| JPH01189988A (en) | Method of connecting flexible board | |
| JPH04342190A (en) | Front-back connection of double-side substrate | |
| JPH01295484A (en) | Printed wiring board |