JP2019149063A - Heat sensor - Google Patents

Abstract

To provide a thin heat sensor.SOLUTION: A heat sensor 100 comprises: a main body 10; a substrate 20 provided in the main body 10; a cover 30 having an inflow hole into which an air flow flows, and attached to the main body 10; and a heat detection unit 40 for detecting heat of a hot air flow F2 flowing in from the inflow hole. The heat detection unit 40 includes: a heat sensitive unit 41 disposed in the cover 30; and a lead unit 42 having a tip to which the heat sensitive unit 41 is attached, inclined from the substrate 20 toward the cover 30 and extending linearly.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a heat detector including a heat detector.

  2. Description of the Related Art Conventionally, a heat detector includes a heat detection unit such as a thermistor that detects heat, and detects the occurrence of a fire by detecting the heat of a hot air current generated by the fire. In the heat detector, the heat detector is installed on the substrate so as to protrude from the cover through a through hole provided in the bottom surface of the cover (see, for example, Patent Document 1). In the heat detector disclosed in Patent Document 1, the heat detection part protruding from the cover is protected by a protector separate from the cover. A hot airflow flows in from the inflow hole formed in the protector, and the heat of the hot airflow is detected by the heat detector.

JP-A-8-287374

  In the heat detector of Patent Document 1, the heat detection unit has a tip protruding from the cover, and the tip is not obstructed by an obstacle or a finger, because it is necessary to accurately measure the ambient airflow temperature in a short time. A protector is required to avoid touching, and the thickness of the heat sensor is increased.

  The present invention has been made to solve the above-described problems, and an object thereof is to provide a heat sensor having a reduced thickness.

  The heat sensor of the present invention has a main body, a substrate provided in the main body, an inflow hole into which an airflow flows, a cover attached to the main body, and heat of the airflow that has flowed in from the inflow hole. A heat detection unit that detects the heat detection unit, and the heat detection unit includes a heat detection unit disposed in the cover, and the heat detection unit is attached to a tip of the heat detection unit. The heat detection unit extends linearly from the substrate toward the cover. A lead portion.

  In the heat sensor, the inflow hole is a vertical hole formed in the bottom surface of the cover facing the substrate, and has a contact preventing portion protruding from an inner peripheral wall or is in a slit shape.

  Further, in the heat sensor, an insertion hole into which the heat detection unit is inserted is formed in the substrate, and the heat detection unit is fixed to a surface of the substrate on the main body side, A straight line extends from the surface toward the cover.

  According to the present invention, since the heat sensitive part is disposed in the cover such that the lead part is inclined with respect to the substrate, the heat detector can be made thin.

It is a side view which shows the external appearance of the heat sensor 100 which concerns on Embodiment 1. FIG. 2 is a bottom view showing an appearance of a heat sensor 100. FIG. It is sectional drawing which shows the AA cross section of FIG. FIG. 3 is a partially enlarged view of a region R in FIG. 2. It is a fragmentary perspective view which shows a perpendicular hole periphery. It is a bottom view which shows the modification of a contact prevention part. It is a bottom view which shows another modification of a contact prevention part. It is explanatory drawing which shows the flow of the vertical airflow which reached the cover bottom face part of the heat sensor. It is sectional drawing which shows an example of the attachment structure of a board | substrate and a heat detection part. It is sectional drawing which shows another example of the attachment structure of a board | substrate and a heat detection part. It is a top view of the attachment structure of FIG.

Embodiment 1 FIG.
FIG. 1 is a side view showing an appearance of a heat sensor 100 according to the first embodiment. FIG. 2 is a bottom view showing the appearance of the heat sensor 100. The heat detector 100 is installed in a monitoring space such as a room in a house, for example, and monitors the ambient temperature. The heat sensor 100 outputs a signal indicating a fire to a fire receiver (not shown) when the ambient temperature becomes equal to or higher than a certain temperature.

  As shown in FIGS. 1 and 2, the heat detector 100 includes a main body 10, a substrate 20 (see FIG. 3), a heat detection unit 40 that detects the heat of the airflow flowing into the main body 10, and the inflow of airflow. And a cover 30 having a hole. The main body 10 is attached to the ceiling 200 via the base 11. A substrate 20 is provided on the main body 10, and a heat detection unit 40 is attached to the substrate 20. A cover 30 is detachably attached to the main body 10 so as to cover the substrate 20. In the following description, the arrow X direction represents the width direction of the heat sensor 100, the arrow Y direction represents the depth direction, and the arrow Z direction represents the height direction.

  FIG. 3 is a cross-sectional view showing the AA cross section of FIG. As shown in FIGS. 1 and 3, the main body 10 includes a base 11 that is fixed to the ceiling 200 with screws or the like, and a main body middle plate 12 that is disposed below the base 11. The main body middle plate 12 is formed in a disc shape, and the substrate 20 is installed on the middle plate lower surface 12b side. A substrate installation portion 12c that protrudes along the shape of the substrate 20 is formed on the middle plate lower surface 12b, and the substrate 20 is accommodated in the substrate installation portion 12c.

  As shown in FIGS. 1 to 3, the cover 30 is formed in a bottomed cylindrical shape, and includes a cylindrical cover side surface portion 31, a disk-shaped cover bottom surface portion 32, a cover side surface portion 31, and a cover bottom surface portion 32. And a slit portion 33 provided therebetween. The cover side surface portion 31 surrounds the outer periphery of the main body middle plate 12. The cover bottom surface portion 32 is disposed to face the lower surface 20 b of the substrate 20. In this way, the airflow circulation space SP is formed by the cover 30 and the main body middle plate 12 on which the substrate 20 is installed.

  A penetrating vertical hole 32a is formed at the center of the bottom surface portion 32 of the cover, and a plurality of contact preventing portions 32c for protecting the heat detection unit 40 are formed on the inner peripheral wall 32b of the vertical hole 32a. A vertical airflow flows into the circulation space SP through the vertical hole 32a. Here, the vertical airflow means an airflow that flows in a direction perpendicular to the surface of the ceiling 200. The horizontal hole 33 a formed in the slit portion 33 also serves as an inflow hole for the hot air flowing into the cover 30.

  The slit portion 33 includes a horizontal hole 33a opened to extend in the circumferential direction of the cover 30, a plurality of main struts 33b extending in the vertical direction (arrow Z direction), and a plurality of adjacent main struts 33b. It has a sub-column 33c and a ring-shaped partition member 33d that partitions the horizontal hole 33a. Each main column 33 b supports the cover bottom surface portion 32. Each sub column 33c is thinner than the main column 33b and supports the partition member 33d. The horizontal hole 33a is partitioned into two stages by a ring-shaped partition member 33d. A horizontal airflow flows into the circulation space SP through the horizontal hole 33a. In addition, the air current in the circulation space SP flows out of the heat sensor 100 through the horizontal hole 33a. Here, the horizontal airflow means an airflow that flows in a direction parallel to the surface of the ceiling 200.

  Various electronic components are mounted on the substrate 20 to form a control circuit. A pin hole 20c is formed at a preset position of the substrate 20, and the heat detector 40 is attached to the lower surface 20b side of the substrate 20 through the pin hole 20c. The control circuit receives the output value of the heat detector 40 and determines the ambient temperature based on the output value. The control circuit transmits a fire signal to the receiver or the like when it is determined that the ambient temperature is equal to or higher than a certain temperature. The control circuit may be configured to transmit a fire signal to the receiver when there is a temperature change equal to or higher than a set value in a short time.

  The heat detection unit 40 includes a heat detection element, and includes a heat-sensitive unit 41 that detects heat, a rod-like lead unit 42 formed of a lead wire, and a pin 43 provided at the base end of the lead unit 42. The heat-sensitive part 41 is a thermistor whose resistance is changed by heat transmitted from an air stream, for example, and converts the temperature change into an electric signal and outputs it.

  The heat sensitive part 41 is attached to the tip of the lead part 42, and the heat sensitive part 41 and the lead part 42 are integrally coated. By inserting the pin 43 of the heat detection unit 40 into the pin hole 20 c of the substrate 20, the base end portion of the lead unit 42 is connected to the substrate 20, and the heat sensitive unit 41 is electrically connected to the control circuit of the substrate 20. .

  As shown in FIGS. 2 and 3, the heat sensitive part 41 is arranged to be positioned above the vertical hole 32 a in order to detect the heat of the vertical airflow. Specifically, the inclination angle θ of the lead portion 42 and the length of the lead portion 42 are determined, and the position of the pin hole 20c of the substrate 20 is determined based on the position of the vertical hole 32a provided in the cover bottom surface portion 32. To do. Here, the lead portion 42 is attached to be inclined with respect to the substrate 20, and the inclination angle θ is an angle formed by the lower surface 20 b of the substrate 20 and the lead portion 42. The lead part 42 is formed of a linear rigid body. With such a configuration, since the lead portion 42 is stably fixed to the substrate 20, the heat sensitive portion 41 can be disposed at a preset position in the circulation space SP.

  In general, the heat of the airflow is also absorbed by the plate surrounding the airflow. As described above, the ambient temperature determined by the control circuit depends on the output value of the heat sensitive unit 41, that is, the amount of heat transmitted to the heat sensitive unit 41. For this reason, in the distribution space SP, the heat sensitive part 41 is arranged apart from the substrate 20 and the cover 30 by a predetermined distance or more, and the heat sensitive part 41 can receive heat with high efficiency. A fire is detected immediately. Here, the “heat receiving characteristic” means a temperature difference between the temperature of the hot air flow detected by the heat sensitive unit 41 and the actual hot air flow, and “good heat receiving characteristic” means that the temperature difference is small and “heat receiving characteristic”. “Characteristic deterioration” means that the temperature difference increases.

  Here, the inclination angle θ of the lead part 42 is determined by the balance between the heat receiving characteristic of the heat sensitive part 41 and the thickness of the heat detector 100. Specifically, as the inclination angle θ is smaller, an increase in the thickness of the heat sensor 100 with respect to the horizontal distance between the pin hole 20c and the vertical hole 32a can be suppressed, and the heat sensor 100 can be made thinner. it can. On the other hand, as the inclination angle θ is larger, the distance between the heat sensitive part 41 and the substrate 20 can be increased, and the heat receiving characteristics can be improved by providing a space around the heat sensitive part 41.

  Specifically, when the inclination angle θ of the lead part 42 is less than 5 °, the heat sensitive part 41 approaches the substrate 20 and loses heat, so that the heat receiving characteristic is remarkably deteriorated. In particular, in order to maintain the heat receiving characteristics of the heat sensitive part 41 well, it is preferable that the inclination angle θ is secured to 15 ° or more. On the other hand, when the inclination angle θ is 60 ° or more, the effect of reducing the thickness of the heat detector 100 is reduced. Therefore, the inclination angle θ of the lead part 42 is desirably 5 ° to 60 °.

  FIG. 4 is a partially enlarged view of a region R in FIG. The cover bottom surface portion 32 has a contact preventing portion 32c protruding from the inner peripheral wall 32b of the vertical hole 32a. In the example shown in FIG. 4, a plurality of trapezoidal contact prevention portions 32 c (here, four as an example) are provided, and the vertical holes 32 a are formed in a clover leaf shape. The vertical hole 32a and the contact prevention part 32c may have any shape. However, since the heat sensitive part 41 is disposed above the vertical hole 32a, the part having the heat sensitive part 41, that is, the vertical hole 32a. The center of the should be open.

  The distances L1, L2, and L3 between the tips in the case where a plurality of contact prevention portions 32c are provided are shorter than the outer diameter D1 (for example, 2 cm) of the vertical hole 32a, so that the test finger or the like can be prevented from entering. It is a distance (for example, 8 mm or less). As a result, it is possible to prevent fingers and instruments from coming into contact with the heat-sensitive part 41, and, for example, the opening area is increased compared with the case where a round hole having a radius of 8 mm or less is formed, so that the vertical airflow is generated in the cover 30. It is possible to make it easier to flow into. In general, since the vertical airflow is faster than the horizontal airflow that flows in through the ceiling 200, it is possible to prevent the delay of fire detection by facilitating the flow of the vertical airflow. In addition, the number of the contact prevention parts 32c is not limited to four. In the case where there is one contact prevention part 32c, the distance L1 may be the distance between the tip of the contact prevention part 32c and the opposing wall surface.

  FIG. 5 is a partial perspective view showing the periphery of the vertical hole 32a. FIG. 5 shows a thermal air flow F <b> 1 that flows from the monitoring space through the contact prevention unit 32 c into the heat sensor 100. On the outer surface side of the tip of each contact preventing portion 32c, a tapered portion 32d is formed in which the plate thickness gradually decreases toward the center of the vertical hole 32a. At the time of a fire, the hot air flow F1 that has moved up the monitoring space and reached the contact prevention portion 32c flows along the contact prevention portion 32c, passes through the tapered portion 32d, and flows into the cover 30 from the vertical hole 32a.

  When the plurality of contact preventing portions 32c are provided, the opening area is smaller than when the vertical hole 32a is a round hole having the outer diameter D1. However, the hot air flow F1 is guided to the heat sensitive part 41 by the contact preventing part 32c, and the resistance by the contact preventing part 32c is reduced by the tapered part 32d. Therefore, a decrease in the speed of the hot air flow F1 is suppressed, and the amount of the hot air flow F1 passing through the heat sensitive part 41 is ensured.

  FIG. 6 is a bottom view showing a modified example of the contact preventing portion. If the contact prevention part 32c is provided in the vertical hole 32a and the distance of the front-end | tip of the contact prevention part 32c can be made below fixed, the shape of the contact prevention part 32c will not be limited to the above thing. For example, the shape of each contact prevention part 132c may be formed in the rod shape as shown in FIG. In this case, the area of the vertical hole 132a can be increased as compared with the case where the vertical hole 32a has a clover leaf shape. When the contact prevention part 32c is trapezoidal as shown in FIG. 4, the strength of the contact prevention part 32c is ensured by narrowing the width of the tip and increasing the width of the part connected to the inner peripheral wall 32b. can do.

FIG. 7 shows another modified example of the contact preventing portion, in which the vertical hole 232a is formed in an elongated slit shape. In this case, contact with a finger or the like can be prevented if the short side dimension of the rectangle is within 10 mm. On the other hand, the long side dimension is determined so that the heat sensitive part 41 is not hidden even when the mounting angle of the heat sensor 100 is inclined from 0 ° horizontal to 75 ° vertical. As a specific example, the distance from the cover bottom surface part 232 to the heat sensitive part 41 is 3 mm. Even when the ceiling surface 200 is tilted to 75 ° in the direction of the arrow Y, the long side dimension for hiding the heat-sensitive part 41 is 3 mm ÷ tan (15 °) ≈11 mm from the heat-sensitive part 41, and the heat-sensitive part is at the center. Therefore, the long side dimension may be set to 22 mm, which is twice this.
In the case where there are two heat detection elements, the slits may be provided at two locations from the center to both ends. The shape may be an arc shape in accordance with the main body shape.

  Further, when the outer diameter D1 of the vertical hole 32a is increased, the number of the contact prevention portions 32c is increased to protect the heat sensitive portion 41, and when the outer diameter D1 of the vertical hole 32a is decreased, the number of the contact prevention portions 32c. May be reduced to secure the opening area.

  Based on FIG. 1, the flow of the airflow at the time of a fire is demonstrated. When a fire occurs in the monitoring space, a vertical airflow is generated from the fire source to the ceiling 200. After the vertical airflow reaches the ceiling 200, the direction of the airflow is parallel to the ceiling 200, and the horizontal airflow follows the ceiling 200. Flowing. If the fire source is directly below the heat sensor 100, the vertical airflow reaches the bottom surface portion 32 of the cover. Further, when the fire source is not at a position directly below the heat sensor 100, all the vertical airflow rising from the fire source reaches the ceiling 200, flows as a horizontal airflow along the ceiling 200, and reaches the heat sensor 100. It flows from the slit portion 33.

  FIG. 8 is an explanatory diagram showing the flow of vertical airflow that has reached the bottom surface of the cover of the heat sensor. The thermal airflows F2, F3, F5, and F6 shown in FIG. 8 are cases where the fire source is directly below the heat sensor 100, and around the heat sensor 100 of the vertical airflow that has reached the cover bottom surface portion 32 from the fire source. Represents the flow of Of the hot airflow that has reached the cover bottom surface portion 32, the hot airflow F2 that has reached the center of the cover bottom surface portion 32 flows into the cover 30 from the vertical hole 32a and causes the heat sensitive portion 41 located above the vertical hole 32a to flow. pass. At this time, the heat of the hot air flow F <b> 2 is transmitted to the heat sensitive part 41. After passing through the heat sensitive part 41, the thermal air flow F2 travels through the circulation space SP toward the slit part 33 provided on the outer periphery of the cover 30, and flows out of the heat sensor 100 from the horizontal hole 33a.

  Of the hot airflow that has reached the cover bottom surface portion 32, the hot airflow F1 (see FIG. 5) that has reached the contact prevention portion 32c flows along the tapered portion 32d and flows into the cover 30 from the vertical hole 32a. The hot air flow F1 flowing into the cover 30 transfers heat to the heat sensitive part 41, merges with the hot air flow F2 in the circulation space SP, and flows out of the heat sensor 100 from the horizontal hole 33a.

  On the other hand, the hot airflow that has reached the outside of the vertical hole 32a flows along the bottom surface portion 32 of the cover, and a part of the hot airflow F3 flows into the cover 30 through the vertical hole 32a and passes through the heat sensitive portion 41 and is slit. It flows out of the heat sensor 100 from the part 33. The remaining hot airflows F5 and F6 flow through the outer surface of the cover bottom surface portion 32 to the ceiling 200, merge with the hot airflows F1, F2, and F3 flowing out from the heat sensor 100 and flow through the ceiling 200. Due to the flow of the hot airflows F1, F2, and F3 flowing out from the horizontal holes 33a, a position other than the position where the hot airflows F1, F2, and F3 flow out of the horizontal holes 33a or a new hot airflow from the vertical holes 32a flows. Promoted.

  On the other hand, when the fire source is not directly below the heat sensor 100, all the vertical air current generated from the fire source reaches the ceiling 200 and travels along the ceiling 200 as a horizontal air current. When this horizontal airflow reaches the side surface of the heat sensor 100, it flows into the heat sensor 100 through the horizontal hole 33a, and flows out of the horizontal hole 33a through the circulation space SP. At this time, heat is transmitted to the heat sensitive part 41 from the hot airflow passing through the central part of the circulation space SP.

  When heat is transmitted to the heat sensitive part 41, the control circuit detects a temperature change based on the signal sent to the substrate 20 via the lead part 42, and a fire signal is transmitted from the control circuit to the receiver. Informed.

  So far, the case where the heat detection unit 40 is fixed to the substrate 20 by inserting the pin 43 of the heat detection unit 40 into the pin hole 20c of the substrate 20 has been described, but the attachment of the heat detection unit 40 and the substrate 20 is described. Any method may be used. For example, the heat detection unit 40 may be fixed to the substrate 20 by soldering or the like.

  FIG. 9 is a cross-sectional view illustrating an example of a mounting configuration of the substrate and the heat detection unit. An insertion hole 120c is formed in the substrate 120, and the heat detection unit 140 is inserted into the insertion hole 120c. The heat detection unit 140 has a mounting base 44 provided at the base end of the lead part 42, and is attached to the substrate 20 via the mounting base 44. The mounting base 44 has a base part 44a connected to the lead part 42 and a claw part 44b serving as two lead pins extending from the base part 44a. The lead part 42 and the base part 44 a are soldered, and the base part 44 a is formed thicker than the lead part 42. The claw portion 44 b is soldered to the upper surface 120 a of the substrate 120, and the heat detection unit 140 and the substrate 120 are electrically connected via the solder 50. The mounting base 44 is a member for attaching the heat detection unit 140 to the substrate 20 while maintaining the inclination angle θ.

  That is, in the heat detection unit 140, the claw portion 44 b is fixed to the upper surface 120 a of the substrate 120, the base portion 44 a is disposed in the insertion hole 120 c, and the lead portion 42 protrudes toward the lower surface 120 b side of the substrate 20. Since the heat detection unit 140 extends linearly so as to incline from the upper surface 120a of the substrate 120 toward the cover 30, the claw portion 44b falls down so as to approach the upper surface 120a and is easily fixed by soldering. Here, the insertion hole 120c only needs to be formed larger than the base portion 44a in order to accommodate the base portion 44a of the mounting base 44.

  Generally, the lead portion 42 such as a thermistor is formed in a rigid body so as to ensure strength, and is not easily bent. However, the heat detection unit 140 is disposed so as to penetrate the substrate 120 and is attached to the substrate 120 via the mounting base 44, whereby the heat detection unit 140 can be fixed to the substrate 120 without being bent.

  The lead portion 42 may be inserted into the insertion hole 120c, and the base end portion of the lead portion 42 or the pin 43 may be fixed to the upper surface 120a of the substrate 120 by soldering. In this case, it is not necessary to provide the mounting base 44, and the insertion hole 120 c only needs to have a width for accommodating the lead portion 42.

  Further, the heat detecting unit 140 may be configured such that the heat sensitive unit 41 is located outside the outer edge 120d of the substrate 120. In this case, since there is no board | substrate 120 in the upper part of the heat sensitive part 41, a space can be provided around the heat sensitive part 41, and a heat receiving characteristic can be improved. As described above, when the heat detection unit 140 is obliquely inserted into the insertion hole 120c, even if the heat-sensitive part 41 and the lead part 42 are pushed toward the substrate 120, the lead part 42 hits the edge of the insertion hole 120c. The distance between the heat sensitive part 41 and the main body middle plate 12 is ensured to be a certain distance or more.

  FIG. 10 is a cross-sectional view showing another example of the mounting configuration of the substrate and the heat detection unit. FIG. 11 is a plan view of the mounting configuration of FIG. 10 and 11 illustrate the arrangement of the heat detection unit 140 when the heat sensor 100 further includes the lower middle plate 60. FIG.

  The lower middle plate 60 is disposed below the substrate 220 and protects the substrate 220 from dust and heat. A through hole 60a is formed in the lower middle plate 60, and the base portion 44a of the mounting base 44 is accommodated in the through hole 60a. Two insertion holes 220c are formed in the substrate 220, and the claw portions 44b of the mounting base 44 are inserted into the respective insertion holes 220c. The tip of the claw 44b is fixed to the upper surface 220a of the substrate 220 by soldering. As shown in FIG. 10, the heat detector 140 is formed in a straight line inclined from the upper surface 220 a of the substrate 220 toward the cover 30. Thus, by arranging the base portion 44a in the through hole 60a of the lower middle plate 60, the width of the insertion hole 220c formed in the substrate 220 can be reduced compared to the case of FIG. It is possible to secure an area for providing electronic components and circuits.

  As described above, in the first embodiment, the heat sensor 100 is disposed in the cover 30, and detects the temperature of the airflow flowing in from the inflow hole of the cover 30 and the substrate 20 toward the cover 30. And a lead portion 42 that is inclined and extends linearly. Thereby, the heat sensitive part 41 does not protrude from the cover 30 and it is not necessary to provide a separate protector, so that the thickness of the heat sensor 100 can be reduced. Further, it is not necessary to provide the cover 30 with a through hole 60a for causing the heat sensitive portion 41 to protrude from the cover 30, and it is not necessary to align the position of the through hole 60a with the mounting position on the substrate 20, so that assembly is facilitated.

  The inflow hole is a vertical hole 32a formed in the cover bottom surface portion 32 of the cover 30 facing the substrate 20, and the cover 30 has a contact prevention portion 32c protruding from the inner peripheral wall 32b of the vertical hole 32a. Thereby, it is possible to prevent a finger or the like from touching the heat-sensitive part 41 while securing the amount of the inflowing air by setting the opening area of the vertical hole 32a to a certain value or more. In this way, the heat sensitive part 41 can be protected while preventing a decrease in heat receiving characteristics.

In addition, although the board | substrate 120 demonstrated in the case where it provided in the main body 10, you may fix to the inner side of the cover 30. FIG.
Further, the heat sensitive part 41 of the heat detecting part 40 attached to the substrate is slightly projected from the vertical hole 32a of the cover 30, and a protector covering the periphery of the tip part is provided around the vertical hole 32a of the cover 30. You may do it.

  The heat detection unit 140 is fixed to the upper surface 120a of the substrate 120, inserted into the insertion hole 120c, and extends in a straight line inclined from the upper surface 120a toward the cover 30. Thereby, since the heat detection part 140 penetrates the board | substrate 120 inclining, it is not necessary to bend the heat detection part 140, and the attachment of the board | substrate 120 and the heat detection part 140 becomes easy.

  The embodiment of the present invention is not limited to the above embodiment, and various modifications can be made. For example, the heat sensor 100 may include a speaker, and the heat sensor 100 may notify a fire.

  Moreover, although the case where the outer diameter D1 of the vertical hole 32a is 2 cm has been described as an example, it may be determined by the outer diameter of the heat sensor 100. Further, the position and number of the heat detection unit 40 and the vertical holes 32a may be selected according to the arrangement of the internal structures.

  Further, the tapered portion 32d is formed not only at the tip of the contact preventing portion 32c but also around the entire contact preventing portion 32c and the vertical hole 32a, and a hot airflow (for example, hot airflows F5 and F6) reaching the periphery of the vertical hole 32a. May flow toward the vertical hole 32a.

  10 Main body, 11 Base, 12 Main body middle plate, 12b Middle plate lower surface, 12c Substrate installation part, 20, 120, 220 Substrate, 20b, 120b Lower surface, 20c Pin hole, 30 Cover, 31 Cover side part, 32, 132, 232 Cover bottom part, 32a, 132a, 232a Vertical hole, 32b, 132b Inner peripheral wall, 32c, 132c Contact prevention part, 32d Taper part, 33 Slit part, 33a Horizontal hole, 33b Main strut, 33c Sub strut, 33d Partition member, 40 Heat detection part, 41 Heat sensitive part, 42 Lead part, 43 pin, 60 Lower middle plate, 60a Through hole, 100 Heat detector, 120a, 220a Upper surface, 120c, 220c Insertion hole, 200 Ceiling, D1 outer diameter, F1-F6 Hot air flow, L1-L3 distance, R region, SP distribution space, θ inclination angle.

Claims (3)

The body,
A substrate provided in the body;
A cover attached to the main body, having an inflow hole through which airflow flows;
A heat detection unit that detects the heat of the airflow flowing in from the inflow hole,
The heat detector is
A heat sensitive part disposed in the cover;
A heat sensor having a heat-sensing part attached to a tip, and a lead part that inclines from the substrate toward the cover and extends linearly. The heat sensor according to claim 1, wherein the inflow hole is a vertical hole formed in a cover bottom surface of the cover facing the substrate, and has a contact prevention portion protruding from an inner peripheral wall or has a slit shape. . The substrate has an insertion hole into which the heat detection unit is inserted,
The heat detector according to claim 1, wherein the heat detection unit is fixed to the surface of the substrate on the main body side and extends linearly from the surface of the main body side toward the cover.

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