JPS6428571A - Aging board - Google Patents

Aging board

Info

Publication number
JPS6428571A
JPS6428571A JP18338587A JP18338587A JPS6428571A JP S6428571 A JPS6428571 A JP S6428571A JP 18338587 A JP18338587 A JP 18338587A JP 18338587 A JP18338587 A JP 18338587A JP S6428571 A JPS6428571 A JP S6428571A
Authority
JP
Japan
Prior art keywords
board
aging
hole
contact pin
socket
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18338587A
Other languages
Japanese (ja)
Inventor
Masayoshi Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HAGURO DENSHI KK
Hitachi Ltd
Renesas Semiconductor Package and Test Solutions Co Ltd
Original Assignee
HAGURO DENSHI KK
Hitachi Ltd
Hitachi Yonezawa Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HAGURO DENSHI KK, Hitachi Ltd, Hitachi Yonezawa Electronics Co Ltd filed Critical HAGURO DENSHI KK
Priority to JP18338587A priority Critical patent/JPS6428571A/en
Publication of JPS6428571A publication Critical patent/JPS6428571A/en
Pending legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PURPOSE:To achieve a reduction in the cost of an aging board with the lowering of expense for a socket, by mounting a contact pin on the aging board used for aging of a semiconductor device in direct contact therewith to eliminate the socket. CONSTITUTION:A first layer board 2 of an aging board 1 of a semiconductor device 6 is made up of a printed circuit board base material, which is built up of a rectangular planar material, made the same as board of the board 1. A second board 3 is laminated on the board 2 and made up of a base material the same as that of the board 1. A contact hole 4 is made in an oval form with the pitch and the size corresponding to a lead 8 of the device 6 to be inserted into the board 3 and a contact pin 5 is mounted on the board 1 corresponding to the hole 4. Then, the contact pin 5 is inserted into the hole 4 of the board 3 being bent and a part as side wall of the hole 4 serves as guide of the lead 8 of the device 6 thereby setting the device 6 on the board 1.
JP18338587A 1987-07-24 1987-07-24 Aging board Pending JPS6428571A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18338587A JPS6428571A (en) 1987-07-24 1987-07-24 Aging board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18338587A JPS6428571A (en) 1987-07-24 1987-07-24 Aging board

Publications (1)

Publication Number Publication Date
JPS6428571A true JPS6428571A (en) 1989-01-31

Family

ID=16134847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18338587A Pending JPS6428571A (en) 1987-07-24 1987-07-24 Aging board

Country Status (1)

Country Link
JP (1) JPS6428571A (en)

Similar Documents

Publication Publication Date Title
US4703991B1 (en) Low profile jack
EP0333374A3 (en) Edge-mounted, surface-mount package for semiconductor integrated circuit devices
AU1442388A (en) Electrical connector terminal for a flexible printed circuit board
IT8319963A0 (en) SEMICONDUCTOR DEVICE IN THE SHAPE OF A FLAT BOARD WITH ELECTRICAL CONTACTS ON BOTH SIDES AND PROCEDURE FOR ITS MANUFACTURE.
JPS5798989A (en) Carrier socket
JPS5530193A (en) Contact and insulating socket and panel board having same contact
EP0361195A3 (en) Printed circuit board with moulded substrate
CA2127898A1 (en) Insulating Element and Circuit Board Using the Same
JPS6428571A (en) Aging board
HK48291A (en) Flat electrical cable connection with printed circuit board
JPS645894A (en) Thin-type mounting type semiconductor device
JPS6413792A (en) Mounting structure of part
GB1555227A (en) Method for mounting socket contacts to dual-in-line package leads and for mounting the combination onto pre-drilled printed circuit boards
JPS52116073A (en) Hermetic structure in which integrated circuit element is sealed up ai rtightly
JPS5742138A (en) Semiconductor device
JPS5272166A (en) Coupling of parts
JPS6450551A (en) Ic package structure
JPS5721848A (en) Semiconductor device
JPS6467000A (en) Jig for mounting printed circuit board
JPS649686A (en) Mounting structure of circuit board
JPS54162171A (en) Printed circuit board with chip component embedded
JPS6489550A (en) Ic socket
JPS6469088A (en) Two sides mounting type printed board
JPS6417288A (en) Magnetic bubble memory device
JPS5376728A (en) Microwave circuit