JPS6450551A - Ic package structure - Google Patents

Ic package structure

Info

Publication number
JPS6450551A
JPS6450551A JP20872887A JP20872887A JPS6450551A JP S6450551 A JPS6450551 A JP S6450551A JP 20872887 A JP20872887 A JP 20872887A JP 20872887 A JP20872887 A JP 20872887A JP S6450551 A JPS6450551 A JP S6450551A
Authority
JP
Japan
Prior art keywords
package
electronic component
connecting terminals
terminals
package structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20872887A
Other languages
Japanese (ja)
Inventor
Nobuyuki Yanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP20872887A priority Critical patent/JPS6450551A/en
Publication of JPS6450551A publication Critical patent/JPS6450551A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain an IC package structure wherein not only the planar package but also the multilayered packaging is made possible, by providing, on one surface of a first IC package, first connecting terminals to be connected to a first electronic component, and providing on the other surface second connecting terminals to be connected to a second electronic component. CONSTITUTION:There are provided a first IC package 2, first connecting terminals 11 provided on the first surface of the first IC package 2 and connected to a first electronic component 4, and second connecting terminals 12 provided on the second surface of said first IC package 2 opposite to the first surface and connected to a second electronic component 5. For instance, said first electronic component 4 is a second IC package 4, and said second electronic component 5 is a printed circuit board 5. And, the terminals 11 provided on the upper surface of the IC package 2 are respectively inserted and fixed into the throughhole-shaped connecting terminals 3 provided on the two IC packages 4. Also, the terminals 12 provided on the bottom surface of the IC package 2 are inserted and fixed into the throughhole-shaped connecting terminals 6 of the printed circuit board 5.
JP20872887A 1987-08-21 1987-08-21 Ic package structure Pending JPS6450551A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20872887A JPS6450551A (en) 1987-08-21 1987-08-21 Ic package structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20872887A JPS6450551A (en) 1987-08-21 1987-08-21 Ic package structure

Publications (1)

Publication Number Publication Date
JPS6450551A true JPS6450551A (en) 1989-02-27

Family

ID=16561097

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20872887A Pending JPS6450551A (en) 1987-08-21 1987-08-21 Ic package structure

Country Status (1)

Country Link
JP (1) JPS6450551A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537208A (en) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp Microwave package
JPH06244361A (en) * 1993-02-18 1994-09-02 Fujitsu Ltd Plastic sealed type semiconductor device
US7112468B2 (en) 1998-09-25 2006-09-26 Stmicroelectronics, Inc. Stacked multi-component integrated circuit microprocessor
JP2015522952A (en) * 2012-06-29 2015-08-06 サムソン エレクトロ−メカニックス カンパニーリミテッド． Superposition module package and manufacturing method thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537208A (en) * 1991-07-31 1993-02-12 Mitsubishi Electric Corp Microwave package
JPH06244361A (en) * 1993-02-18 1994-09-02 Fujitsu Ltd Plastic sealed type semiconductor device
US7112468B2 (en) 1998-09-25 2006-09-26 Stmicroelectronics, Inc. Stacked multi-component integrated circuit microprocessor
JP2015522952A (en) * 2012-06-29 2015-08-06 サムソン エレクトロ−メカニックス カンパニーリミテッド． Superposition module package and manufacturing method thereof

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